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AMD XCVU190-2FLGC2104E
- Part No.:
- XCVU190-2FLGC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU190-2FLGC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,790
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Product details
Overview
XCVU190-2FLGC2104E from AMD is a high-end Virtex UltraScale+ FPGA featuring 1,925,760 logic cells, 10,800 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.78 Gb/s GTY transceivers and supports PCI Express Gen4 x16, making it suitable for high-bandwidth data center acceleration and 5G radio unit processing.
For engineers reviewing the XCVU190-2FLGC2104E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal envelope (2104-pin FC-BGA, 35 mm × 35 mm), and configuration interface options (e.g., dual-boot QSPI, BPI, JTAG).
Technical Context
The XCVU190-2FLGC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers. Its -2 speed grade guarantees timing closure at 25.78 Gb/s per GTY lane with ≤12 ns input setup time for LVDS inputs.
Configuration is supported via master/slave SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device uses SelectIO technology supporting 1.8 V, 1.5 V, 1.35 V, and 1.2 V I/O standards across 32 configurable I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,925,760 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 10,800 - enables parallel high-throughput arithmetic (e.g., 27×18-bit multiply-accumulate) |
| Block RAM | 104.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 64 lanes @ 25.78 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and high-speed serial backplanes |
| I/O Banks | 32 - allows mixed-voltage I/O interfacing (1.2 V to 1.8 V) with independent bank termination control |
| Speed Grade | -2 - guarantees timing closure at highest operating frequencies defined in AMD's timing models |
| Package | FC-BGA 2104 - 35 mm × 35 mm, 0.8 mm pitch, thermal lid for industrial temperature operation |
Pinout & Package
The XCVU190-2FLGC2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FC-BGA) package with integrated thermal lid, designed for conduction-cooled industrial applications up to 100°C junction temperature.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 0.85 V ±3% power rail for logic fabric and CLB resources |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, PCIe block, and clock management tiles |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage for Bank 0 |
| MGTAVCC | Transceiver analog supply | 1.0 V ±2% supply for GTY transceiver PLLs and serializers |
| INIT_B | Configuration status | Open-drain active-low signal indicating bitstream load readiness |
| CCLK | Configuration clock | Input clock for master SPI configuration mode (up to 100 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| UltraScale+ architecture with ASIC-like performance | Enables 500+ MHz system clocks in critical paths with predictable timing convergence |
| AES-256 + HMAC-SHA-256 bitstream encryption | Provides secure configuration loading and prevents reverse engineering of design IP |
| Multi-rate GTY transceivers (1.6–25.78 Gb/s) | Supports protocol agility across 10G/25G/100G Ethernet, CPRI, and JESD204C links |
| DDR4 PHY with 2400 Mbps data rate | Eliminates need for external memory controllers in high-bandwidth memory subsystems |
Applications
| 5G Massive MIMO Radio Unit | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming and digital pre-distortion in 5G base station RU hardware. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency DSP kernels; GTY transceivers interface with ADC/DAC FMC modules at 25.78 Gb/s. Use Value: Enables sub-100 ns loop latency and deterministic timing for closed-loop RF calibration. | Use Scenario: Offloading packet parsing, TLS encryption, and RDMA operations in cloud server NICs. IC Role / Device Role / Timing Role: Configurable accelerator tightly coupled to host CPU via PCIe Gen4 x16; DDR4 PHY manages local 16 GB buffer. Use Value: Delivers 100 Gbps line-rate processing with <500 ns packet latency and zero-copy host memory access. |
| High-Frequency Trading Engine | AI Inference Preprocessing Pipeline |
Use Scenario: Nanosecond-precision timestamping and order matching logic in co-located trading systems. IC Role / Device Role / Timing Role: Uses deterministic fabric routing and dedicated clock networks to guarantee <2 ns path skew across 100+ parallel match engines. Use Value: Achieves consistent sub-5 ns jitter on timestamp outputs, meeting exchange regulatory requirements. | Use Scenario: Real-time sensor fusion and quantized neural network preprocessing for edge AI vision systems. IC Role / Device Role / Timing Role: DSP slices perform INT8 convolution; GTY lanes stream compressed video from MIPI CSI-2 bridge ICs. Use Value: Processes 4K@60fps video with <8 ms end-to-end pipeline latency using on-chip memory only. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104I | Same logic capacity and transceiver count, but -2I speed grade rated for industrial temperature (−40°C to +100°C) with tighter voltage tolerance | Required for extended-temperature deployments where ambient exceeds commercial range | Select XCVU190-2FLGB2104I when board-level thermal design cannot guarantee <85°C case temperature under full load |
| XCVU13P-2FLGA2577E | Lower density (988,000 LUTs), fewer GTY lanes (48), same -2 speed grade and 25.78 Gb/s capability | Suitable for cost-optimized 25G/50G systems where full XCVU190 bandwidth is unused | Choose XCVU13P-2FLGA2577E to reduce BOM cost and PCB layer count while retaining Gen4 PCIe and DDR4 support |
Compared with XCVU190-2FLGC2104E, the XCVU190-2FLGB2104I offers identical functionality with enhanced thermal/voltage robustness, while the XCVU13P-2FLGA2577E trades logic and transceiver scale for lower cost and footprint-enabling tiered platform scaling without redesigning core IP.
Availability
XCVU190-2FLGC2104E is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading systems, and AI-accelerated data center applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU190-2FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family targets high-throughput, low-latency applications demanding hardened interfaces, advanced signal processing, and security-critical configuration integrity.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU190-2FLGC2104E?
The XCVU190-2FLGC2104E supports GTY transceivers up to 25.78 Gb/s per lane, validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204C. This rate is guaranteed under -2 speed grade conditions with proper reference clock jitter and PCB interconnect design per AMD UG578.
Does the XCVU190-2FLGC2104E support PCIe Gen5?
No, the XCVU190-2FLGC2104E integrates hardened PCIe Gen4 x16 controllers only. It does not include Gen5 PHY or link layer logic. For Gen5 support, AMD recommends the Versal HBM or Versal Premium families-not the Virtex UltraScale+ series.
What configuration modes are supported by the XCVU190-2FLGC2104E?
The XCVU190-2FLGC2104E supports master SPI, slave SPI, BPI, JTAG, and fallback configuration modes. Dual-boot capability allows switching between two bitstreams stored in QSPI flash, enabling field-upgradable firmware with rollback safety.
Is the XCVU190-2FLGC2104E pin-compatible with other Virtex UltraScale+ devices?
No, the XCVU190-2FLGC2104E uses a unique 2104-pin FC-BGA package. While some I/O banks share voltage and signaling compatibility with smaller UltraScale+ FPGAs, mechanical and electrical pinouts are not interchangeable due to differing ball maps, power delivery requirements, and thermal lid placement.
What is the block RAM capacity of the XCVU190-2FLGC2104E in usable bits?
The XCVU190-2FLGC2104E provides 104.5 Mb of total block RAM, composed of 2,880 BRAM primitives each configurable as 36 Kb (dual-port) or 18 Kb (single-port). Usable capacity depends on addressing depth and width settings but remains fixed at 104.5 Mb aggregate.
XCVU190-2FLGC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU190-2FLGC2104E FAQ
1.How can I place an order for XCVU190-2FLGC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-2FLGC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-2FLGC2104E reliable?
The price and inventory of XCVU190-2FLGC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-2FLGC2104E is usually 5 days.
3.What payment methods are accepted for XCVU190-2FLGC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-2FLGC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-2FLGC2104E?
XCVU190-2FLGC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-2FLGC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-2FLGC2104E?
For technical support, including XCVU190-2FLGC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-2FLGC2104E requirements.
6.How does Aetrix verify that XCVU190-2FLGC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU190-2FLGC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-2FLGC2104E meets industry standards.
7.What is the process for return or replacement of XCVU190-2FLGC2104E?
All XCVU190-2FLGC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-2FLGC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-2FLGC2104E part is unused and in its original packaging.
Return procedure for XCVU190-2FLGC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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