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AMD XCVU190-3FLGA2577E
- Part No.:
- XCVU190-3FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU190-3FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,476
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Product details
Overview
XCVU190-3FLGA2577E from AMD is a high-end Virtex UltraScale+ FPGA featuring 1,922,500 logic cells, 10,800 DSP slices, 96.4 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets AI acceleration, 5G baseband processing, and high-throughput data center offload.
For engineers reviewing the XCVU190-3FLGA2577E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory bandwidth, DSP resource density, and thermal envelope under sustained compute load.
Technical Context
The XCVU190-3FLGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened ARM Cortex-A53 processor subsystems (in certain variants), and integrated 25.8 Gb/s GTY transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its UltraScale+ architecture uses 16nm FinFET process technology, enabling higher logic density and lower dynamic power than prior generations. The device includes hardened 100G Ethernet MAC blocks and IEEE 1588 v2 timestamping support for deterministic networking applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,922,500 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 10,800 - enables parallel execution of high-precision multiply-accumulate operations for AI inference kernels |
| Block RAM | 96.4 Mb - provides on-die memory for low-latency buffering and coefficient storage in signal processing pipelines |
| Transceiver Max Rate | 25.8 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and high-speed serial interconnects without external retimers |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - enables direct interfacing to image sensors, memory, and high-speed ADC/DAC devices |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional host interface bandwidth for accelerator card integration |
Pinout & Package
Package: 2577-ball Flip-Chip Land Grid Array (FLGA) with 0.8 mm pitch, thermally enhanced for high-power operation up to 75 W TDP.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA logic fabric; requires tight regulation and low-noise filtering |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, PCIe PHY, and clock management tiles at 1.8 V |
| MGTAVCC | Transceiver analog supply | Provides clean 0.92 V to GTY transceiver analog circuitry; sensitive to ripple and noise |
| CLK_IN_0 | Dedicated clock input | Accepts differential reference clock (e.g., 100–300 MHz) for PLL/MMCM clock synthesis |
| INIT_B | Configuration status | Active-low open-drain output indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL footprint and timing closure effort for high-speed networking stacks |
| AXI4-Stream interconnect fabric | Enables zero-cycle handshaking and backpressure-aware data flow between IP blocks |
| Partial reconfiguration support | Allows runtime logic module swapping without full system reset or downtime |
| IEEE 1588 v2 timestamping | Provides sub-100 ns time synchronization accuracy across distributed nodes in TSN or 5G fronthaul |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time deep learning model execution on edge servers using custom quantized CNNs. IC Role / Device Role / Timing Role: Configurable hardware accelerator implementing convolution, activation, and pooling layers in pipeline. Use Value: Delivers >12 TOPS/W efficiency with deterministic latency under 50 µs per inference batch. | Use Scenario: Digital pre-distortion (DPD) and beamforming matrix computation in active antenna systems. IC Role / Device Role / Timing Role: Real-time signal processor handling 128-channel RF sample streams at 2.4576 GS/s aggregate rate. Use Value: Enables closed-loop DPD update within 100 µs using on-chip DSP slices and BRAM-based coefficient buffers. |
| Data Center SmartNIC Offload | High-Fidelity Radar Processing |
Use Scenario: TCP/IP stack acceleration, TLS termination, and RDMA protocol handling in cloud infrastructure NICs. IC Role / Device Role / Timing Role: Programmable network packet processor with PCIe Gen4 host interface and 100G Ethernet MAC. Use Value: Reduces CPU utilization by 70% while sustaining 95 Gbps line-rate throughput with <1 µs packet latency. | Use Scenario: Pulse-Doppler and STAP processing for automotive and defense radar with 4D imaging capability. IC Role / Device Role / Timing Role: High-precision FFT engine and CFAR detector operating on 16-bit complex IQ samples. Use Value: Achieves 120 dB dynamic range and <0.5° angular resolution using 10,800 DSP slices and 96.4 Mb BRAM for range-Doppler map buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGA2577I | Lower speed grade (-2 vs -3); 15% reduced max transceiver rate (22.5 Gb/s) and 10% lower DSP slice timing margin | Suitable for cost-sensitive 5G mid-haul or video transcoding where full -3 performance is unused | Select when thermal budget or power envelope restricts operation at -3 speed grade |
| XCVU13P-2FLGA2577E | Smaller logic capacity (1,024,000 LCs), fewer DSP slices (5,400), same package but lower I/O count (528 vs 654) | Targeted at compact radar modules or edge AI inference with reduced model size and memory bandwidth needs | Choose when design fits within smaller resource footprint and avoids over-provisioning |
Compared with XCVU190-2FLGA2577I and XCVU13P-2FLGA2577E, the XCVU190-3FLGA2577E delivers highest compute density and serial I/O bandwidth, making it optimal for full-scale 100G+ systems where latency, throughput, and reconfigurability are critical.
Availability
XCVU190-3FLGA2577E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G massive MIMO radio units, and high-performance computing SmartNICs requiring stable component supply and long-term program support.
Supply support for XCVU190-3FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, gaming, and embedded markets.
The Virtex UltraScale+ family delivers FPGA platforms optimized for compute-intensive, high-bandwidth, and low-latency applications including AI inference, 5G infrastructure, and real-time signal processing.
FAQ
What is the maximum supported transceiver data rate for XCVU190-3FLGA2577E?
The XCVU190-3FLGA2577E supports GTY transceivers rated up to 25.8 Gb/s per lane. This enables native 100G Ethernet (4×25G), 200G (4×50G PAM4), and CPRI/eCPRI interfaces without external retiming. The -3 speed grade guarantees timing closure at this rate under specified voltage and temperature conditions.
Does XCVU190-3FLGA2577E include a hard processor system?
No, the XCVU190-3FLGA2577E does not integrate a hard ARM processor subsystem. It belongs to the Virtex UltraScale+ FPGA portfolio without PS (Processing System) - unlike Zynq UltraScale+ MPSoC devices. All processing must be implemented in programmable logic or via external processors connected through high-speed interfaces.
What package type and ball count does XCVU190-3FLGA2577E use?
XCVU190-3FLGA2577E uses a 2577-ball Flip-Chip Land Grid Array (FLGA) package with 0.8 mm pitch. This thermally enhanced package supports high-power operation up to 75 W TDP and is compatible with standard PCB assembly processes for high-density interconnect designs.
Can XCVU190-3FLGA2577E support PCIe Gen4 x16 root complex functionality?
Yes, XCVU190-3FLGA2577E includes a hardened PCIe Gen4 x16 endpoint and root complex controller. It supports full link training, ASPM power states, and AER reporting. Implementation requires proper board-level layout, reference clock jitter control (<100 fs RMS), and compliance with PCIe CEM 4.0 mechanical specifications.
What is the total block RAM capacity of XCVU190-3FLGA2577E?
The XCVU190-3FLGA2577E provides 96.4 Mb of total block RAM, composed of 3,600 × 36 Kb BRAM primitives. This capacity supports large on-chip buffers, coefficient tables, and FIFOs for high-throughput streaming applications such as radar processing and video encoding pipelines.
XCVU190-3FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU190-3FLGA2577E FAQ
1.How can I place an order for XCVU190-3FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-3FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-3FLGA2577E reliable?
The price and inventory of XCVU190-3FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-3FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU190-3FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-3FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-3FLGA2577E?
XCVU190-3FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-3FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-3FLGA2577E?
For technical support, including XCVU190-3FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-3FLGA2577E requirements.
6.How does Aetrix verify that XCVU190-3FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU190-3FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-3FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU190-3FLGA2577E?
All XCVU190-3FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-3FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-3FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU190-3FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU190-3FLGA2577E Tags
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