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AMD XCVU190-3FLGB2104E
- Part No.:
- XCVU190-3FLGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU190-3FLGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,379
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Product details
Overview
XCVU190-3FLGB2104E from AMD is a high-end Virtex UltraScale+ FPGA featuring 1,927,200 logic cells, 10,800 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-throughput data center acceleration and 5G wireless infrastructure.
For engineers reviewing the XCVU190-3FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-3), I/O voltage support (1.8 V/1.2 V), and thermal design power (TDP) of 75 W under typical operation.
Technical Context
The XCVU190-3FLGB2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated 25.8 Gb/s GTY transceivers. It supports deterministic latency modes and AXI4-Stream interfaces for high-speed data path integration.
This device uses a 16 nm FinFET process, includes hardened 100G Ethernet MAC blocks, and delivers up to 2.4 Tbps aggregate transceiver bandwidth across 64 GTY lanes. Its configuration interface supports dual-boot via Quad-SPI and JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,927,200 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 10,800 - enables parallel high-precision arithmetic for real-time signal processing and AI inference |
| Block RAM | 104.5 Mb - supports large on-chip buffering and lookup table storage without external memory dependency |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - provides native 100G Ethernet and PCIe Gen4 connectivity with forward error correction |
| I/O Standards | Supports 1.8 V, 1.2 V, and SSTL - enables direct interfacing with DDR4, LPDDR4, and legacy memory subsystems |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths in high-performance designs |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder mask defined pads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration, clocking, and transceiver auxiliary circuits |
| MGTAVCC | GTY analog supply | Delivers clean 0.92 V to GTY transceiver analog sections; sensitive to ripple & noise |
| IO_Lx_y | User I/O bank | Configurable as single-ended or differential; grouped by voltage domain and I/O standard |
| CLK_IN_0 | Dedicated clock input | Connects to external oscillator; feeds MMCM/PLL for clock synthesis and jitter cleaning |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and verification time for multi-100G line card designs |
| Dual-boot configuration | Enables field-upgradable bitstreams with fail-safe fallback to known-good image |
| AXI4-Stream interconnect | Standardizes high-throughput data movement between IP blocks without custom handshaking logic |
| PCIe Gen4 x16 root port | Provides 32 GB/s host interface bandwidth for accelerator cards in server platforms |
| UltraScale+ memory controller | Supports DDR4-2400 and LPDDR4-4266 with ECC, reducing external memory latency and bandwidth bottlenecks |
Applications
| 5G Massive MIMO Baseband Processing | Data Center AI Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R massive MIMO radios. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency signal processing kernels; GTY transceivers handle CPRI/eCPRI fronthaul links. Use Value: Achieves sub-100 ns loop latency and deterministic timing for closed-loop RF calibration. | Use Scenario: Offloading matrix multiplication and sparse tensor operations in cloud inference servers. IC Role / Device Role / Timing Role: Configurable logic implements custom compute pipelines; PCIe Gen4 x16 connects to CPU host with minimal software stack changes. Use Value: Delivers >2× throughput vs. GPU-based inference for specific NLP workloads with lower power per inference. |
| High-Frequency Trading Engine | Multi-Protocol Network Packet Processor |
Use Scenario: Order matching, risk checking, and market data filtering with microsecond-level determinism. IC Role / Device Role / Timing Role: Dedicated logic partitions run time-critical algorithms; hardened Ethernet MACs handle 100G market data feeds. Use Value: Guarantees worst-case execution time ≤ 750 ns across all matched orders, meeting exchange latency SLAs. | Use Scenario: Line-rate packet classification, deep packet inspection, and TLS offload in service provider edge routers. IC Role / Device Role / Timing Role: GTY transceivers ingest 100G/400G traffic; logic fabric applies parallel pattern matching and stateful flow tracking. Use Value: Processes 1.2 Bpps at <1.5 µs average latency while maintaining full IPv6/IPv4/MPLS header parsing fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104I | Lower speed grade (-2) and industrial temperature rating (–40°C to +100°C) | Better suited for extended-temperature embedded systems where peak frequency margin is not required | Select when thermal budget or cost constraints outweigh need for -3 timing margin |
| XCVU13P-2FLGA2577E | Fewer logic cells (1,024,000), 40 GTY lanes, and smaller 2577-pin FCBGA package | Targets mid-range 5G DU and radar processing where full XCVU190 capacity is over-provisioned | Choose for space-constrained designs needing ~60% of XCVU190-3FLGB2104E resources at lower power |
Compared with XCVU190-2FLGB2104I and XCVU13P-2FLGA2577E, the XCVU190-3FLGB2104E delivers highest logic density and transceiver bandwidth for data center and macro base station applications, but requires more stringent thermal management and PCB routing complexity.
Availability
XCVU190-3FLGB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator cards, and high-frequency trading systems requiring stable component supply and long-term program support.
Supply support for XCVU190-3FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and communications infrastructure.
The Virtex UltraScale+ family targets demanding compute-intensive applications including 5G RAN, cloud acceleration, and real-time signal processing, with emphasis on transceiver performance, memory bandwidth, and deterministic latency.
FAQ
What is the maximum supported data rate per GTY transceiver lane in the XCVU190-3FLGB2104E?
The XCVU190-3FLGB2104E supports up to 25.8 Gb/s per GTY transceiver lane, validated for protocols including 100G Ethernet (CAUI-4), PCIe Gen4, and OTN OTU4. This rate is guaranteed under speed grade -3 conditions with proper reference clock jitter and PCB interconnect design per AMD UG578.
Does the XCVU190-3FLGB2104E include hardened memory controllers?
Yes, the XCVU190-3FLGB2104E integrates hardened DDR4 and LPDDR4 memory controllers supporting data rates up to DDR4-2400 and LPDDR4-4266. These controllers include built-in ECC, write leveling, and read/write leveling calibration logic, reducing FPGA resource usage and timing closure effort for memory subsystems.
What thermal solution is recommended for sustained operation of the XCVU190-3FLGB2104E?
A vapor chamber heatsink with ≥ 0.15 °C/W thermal resistance and forced airflow ≥ 300 LFM is recommended for the XCVU190-3FLGB2104E under full utilization. The device's thermal design power is 75 W, and junction temperature must remain below 100°C per AMD DS923 guidelines.
Can the XCVU190-3FLGB2104E be configured via PCIe during runtime?
No, the XCVU190-3FLGB2104E does not support PCIe-based partial reconfiguration. Configuration occurs via dedicated configuration pins (e.g., Quad-SPI, JTAG, or SelectMAP). PCIe is used only for data transport after configuration; bitstream loading requires external configuration master or fallback flash.
Is the XCVU190-3FLGB2104E pin-compatible with other Virtex UltraScale+ devices?
No, the XCVU190-3FLGB2104E uses a unique 2104-pin FCBGA package and is not pin-compatible with other Virtex UltraScale+ devices. Pin mapping, power domains, and I/O bank arrangements differ across the family; migration requires PCB redesign and I/O constraint updates.
XCVU190-3FLGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU190-3FLGB2104E FAQ
1.How can I place an order for XCVU190-3FLGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-3FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-3FLGB2104E reliable?
The price and inventory of XCVU190-3FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-3FLGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU190-3FLGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-3FLGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-3FLGB2104E?
XCVU190-3FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-3FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-3FLGB2104E?
For technical support, including XCVU190-3FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-3FLGB2104E requirements.
6.How does Aetrix verify that XCVU190-3FLGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU190-3FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-3FLGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU190-3FLGB2104E?
All XCVU190-3FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-3FLGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-3FLGB2104E part is unused and in its original packaging.
Return procedure for XCVU190-3FLGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU190-3FLGB2104E Tags
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