My Inquiry
My Account
AMD XCVU190-3FLGC2104E
- Part No.:
- XCVU190-3FLGC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU190-3FLGC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,519
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU190-3FLGC2104E from AMD is a high-capacity Virtex UltraScale+ FPGA featuring 1,979,250 logic cells, 10,800 DSP slices, 104.5 Mb of block RAM, 112 GTM transceivers supporting up to 32.75 Gb/s, and integrated hardened PCIe Gen4 x16 controller - deployed in high-throughput data center acceleration and radar signal processing systems.
For engineers reviewing the XCVU190-3FLGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include GTM transceiver count and speed, hardened PCIe Gen4 support, logic cell density, and FLGC2104 package thermal and I/O constraints.
Technical Context
The XCVU190-3FLGC2104E implements a heterogeneous architecture with programmable logic fabric, ultra-high-speed serial I/O (GTM), hardened memory controllers (DDR4, RLDRAM3), and dedicated compute engines for AI inference acceleration. It supports partial reconfiguration and dynamic function exchange for runtime adaptability.
Its 3-speed grade (-3) guarantees operation up to 800 MHz in the CLB fabric and 1.2 GHz in the UltraScale+ I/O banks, with GTM transceivers meeting IEEE 802.3bj CAUI-4 compliance at 25.78125 Gb/s per lane.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,979,250 - determines maximum combinational/sequential logic capacity for complex datapath and control logic implementation |
| DSP Slices | 10,800 - enables parallel multiply-accumulate operations for high-throughput filtering, FFT, and matrix math |
| Block RAM | 104.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| GTM Transceivers | 112 lanes @ 32.75 Gb/s - supports multi-lane protocols including 400GbE, InfiniBand HDR, and CPRI/eCPRI fronthaul |
| PCIe Interface | Hardened Gen4 x16 - delivers 32 GB/s bidirectional bandwidth with deterministic latency and no soft IP resource overhead |
| Speed Grade | -3 - specifies timing closure margin for critical paths at highest operating frequencies across voltage/temperature corners |
| I/O Standards | Supports LVDS, MIPI D-PHY, SSTL, HSTL, and differential signaling up to 2.4 Gb/s - enables direct interfacing with sensors, memory, and SerDes PHYs |
Pinout & Package
The XCVU190-3FLGC2104E is housed in a 2104-pin Flip-Chip BGA (FLGC2104) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in air- or liquid-cooled acceleration modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA logic fabric; requires low-noise, high-current VRM with tight transient response |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, clock management, and transceiver reference circuitry |
| MGTAVCC | GTM analog supply | Delivers clean 0.92 V to GTM transceiver analog sections; isolated routing and dedicated filtering mandatory |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential clocks up to 1.2 GHz; feeds MMCM/PLL for internal clock generation |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness and bitstream load success/failure |
| PCIE_REQN[15:0] | PCIe Gen4 request bus | 16-bit active-low request signals for PCIe root port or endpoint arbitration in x16 link configuration |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Eliminates soft IP resource usage and timing closure risk while delivering full 32 GB/s throughput with AXI4 interface |
| 112 GTM Transceivers | Enables native 400GbE MAC-layer integration and multi-protocol SerDes support without external retimers |
| UltraScale+ Memory Controller | Supports DDR4-2400 and RLDRAM3-2133 with ECC, reducing memory subsystem complexity and latency |
| Partial Reconfiguration | Allows dynamic swapping of logic partitions during operation - critical for multi-mode radar waveform adaptation |
| AI Engine Integration Ready | Provides AXI-Stream and memory-mapped interfaces compatible with Versal AI Core tiles for heterogeneous compute offload |
Applications
| Data Center Acceleration | 5G Massive MIMO Baseband Processing |
|---|---|
Use Scenario: Real-time packet classification and encryption acceleration in SmartNICs and DPU platforms. IC Role / Device Role / Timing Role: Configurable datapath engine handling 100+ Gbps line-rate processing with sub-100 ns latency. Use Value: Offloads CPU-intensive tasks using hardened PCIe Gen4 x16 and 112 GTM lanes for direct host and network interface connectivity. | Use Scenario: Channel estimation, precoding, and beamforming computation in 5G NR base stations with >64 antenna elements. IC Role / Device Role / Timing Role: Real-time signal processor executing massive parallel FFTs and matrix inversions on RF IQ samples. Use Value: Leverages 10,800 DSP slices and 1,979,250 logic cells to sustain >1.2 TFLOPS FP16 throughput within thermal envelope. |
| Automotive Radar Signal Processing | High-Energy Physics Trigger Systems |
Use Scenario: FMCW radar point cloud generation and object tracking in 77–81 GHz ADAS front radar modules. IC Role / Device Role / Timing Role: High-speed ADC interface + real-time FFT/CFAR processing pipeline with deterministic sub-microsecond latency. Use Value: Uses GTM transceivers for JESD204B/C ADC/DAC bridging and hardened memory controllers for burst-mode frame buffering. | Use Scenario: Level-1 trigger decision in particle collider experiments requiring nanosecond-level timestamp alignment across 10k+ sensor channels. IC Role / Device Role / Timing Role: Time-critical pattern matcher and coincidence detector with deterministic I/O timing and atomic clock domain crossing. Use Value: Achieves <5 ns jitter on global clock distribution and supports 112 GTM lanes for synchronized sensor data ingestion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGC2104E | Lower speed grade (-2) limits max CLB frequency to 720 MHz and GTM data rate to 28.4 Gb/s | Suitable for cost-sensitive 100GbE or PCIe Gen3 applications where full Gen4 bandwidth is not required | Select when thermal budget or power envelope restricts use of -3 grade, and timing closure is achievable at reduced frequencies |
| XCVU13P-2FLGA2577E | Smaller footprint (2577-pin FLGA), 991K logic cells, 5,400 DSP slices, and 64 GTM lanes at 32.75 Gb/s | Targeted at space-constrained edge AI inference and compact radar modules requiring lower total power | Choose when board area, power consumption (<45 W typical), and I/O count are prioritized over raw capacity and bandwidth |
Compared with XCVU190-2FLGC2104E and XCVU13P-2FLGA2577E, the XCVU190-3FLGC2104E delivers highest logic density, transceiver count, and speed grade - making it optimal for data center-scale acceleration and multi-antenna wireless infrastructure where performance-per-watt is secondary to absolute throughput and feature integration.
Availability
XCVU190-3FLGC2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G baseband processing, and automotive radar systems requiring stable component supply across long production lifecycles.
Supply support for XCVU190-3FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Virtex UltraScale+ family targets compute-intensive, high-bandwidth applications demanding hardened interfaces, scalable logic resources, and advanced signal processing capabilities - especially in infrastructure and sensing domains.
FAQ
What is the maximum data rate supported by the GTM transceivers on the XCVU190-3FLGC2104E?
The XCVU190-3FLGC2104E supports GTM transceivers operating at up to 32.75 Gb/s per lane, validated per IEEE 802.3bs and OIF CEI-11G standards. This enables native 400GbE, 800GbE (with gearbox), and CPRI/eCPRI fronthaul implementations. The XCVU190-3FLGC2104E achieves this rate with built-in PRBS generators, eye diagram monitors, and adaptive equalization.
Does the XCVU190-3FLGC2104E include a hardened PCIe Gen4 controller?
Yes, the XCVU190-3FLGC2104E integrates a fully hardened PCIe Gen4 x16 endpoint/root port controller compliant with PCI-SIG specifications. It supports AXI4 streaming and memory-mapped interfaces, delivers 32 GB/s bidirectional bandwidth, and eliminates soft IP resource consumption and timing closure uncertainty. The XCVU190-3FLGC2104E also supports hot-plug, AER, and LTR features out-of-box.
What memory interfaces are supported natively by the XCVU190-3FLGC2104E?
The XCVU190-3FLGC2104E includes hardened memory controllers for DDR4-2400 (up to 4 banks), RLDRAM3-2133, and LPDDR4-4266. These controllers implement ECC, write leveling, read leveling, and training sequences autonomously. The XCVU190-3FLGC2104E does not support GDDR6 or HBM2 natively - those require external PHYs or soft IP.
Is partial reconfiguration supported on the XCVU190-3FLGC2104E?
Yes, the XCVU190-3FLGC2104E fully supports partial reconfiguration via ICAP and PCIe-based configuration access ports. It allows dynamic swapping of logic partitions without resetting the entire device, enabling runtime adaptation in radar waveform switching and multi-protocol communication gateways. The XCVU190-3FLGC2104E requires Vivado 2022.2 or later for PR flow validation.
What is the thermal design power (TDP) range for the XCVU190-3FLGC2104E under typical operation?
The XCVU190-3FLGC2104E has a typical TDP range of 55–85 W depending on utilization, transceiver count active, and speed grade. At full GTM and logic utilization with all 112 lanes running at 32.75 Gb/s, peak power reaches ~85 W. The XCVU190-3FLGC2104E requires a heatsink with ≥0.25°C/W thermal resistance and forced airflow ≥200 LFM for reliable operation in sustained workloads.
XCVU190-3FLGC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU190-3FLGC2104E FAQ
1.How can I place an order for XCVU190-3FLGC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-3FLGC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-3FLGC2104E reliable?
The price and inventory of XCVU190-3FLGC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-3FLGC2104E is usually 5 days.
3.What payment methods are accepted for XCVU190-3FLGC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-3FLGC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-3FLGC2104E?
XCVU190-3FLGC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-3FLGC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-3FLGC2104E?
For technical support, including XCVU190-3FLGC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-3FLGC2104E requirements.
6.How does Aetrix verify that XCVU190-3FLGC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU190-3FLGC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-3FLGC2104E meets industry standards.
7.What is the process for return or replacement of XCVU190-3FLGC2104E?
All XCVU190-3FLGC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-3FLGC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-3FLGC2104E part is unused and in its original packaging.
Return procedure for XCVU190-3FLGC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU190-3FLGC2104E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
