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AMD XCVU19P-1FSVA3824E
- Part No.:
- XCVU19P-1FSVA3824E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 3824-BBGA, FCBGA
- Datasheet:
-
XCVU19P-1FSVA3824E.pdf
- Description:
- IC FPGA VIRTEX-UP 3824FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,675
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Product details
Overview
XCVU19P-1FSVA3824E from AMD is a high-end Virtex UltraScale+ FPGA featuring 9,562,752 logic cells, 102,400 DSP slices, and 1,259 total I/O pins in a 3824-pin Flip-Chip Ball Grid Array (FCBGA) package; it targets 5G wireless infrastructure baseband processing, AI acceleration at the edge, and high-throughput data center compute offload.
For engineers reviewing the XCVU19P-1FSVA3824E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), on-chip memory depth (1,164 Mbit of UltraRAM), and configurable I/O standards supporting both 1.8 V and 1.0 V operation.
Technical Context
The XCVU19P-1FSVA3824E implements a heterogeneous architecture with programmable logic fabric, hardened 32.75 Gb/s GTY transceivers, and integrated ARM Cortex-R5 dual-core processors for real-time control. It supports PCI Express Gen4 x16, DDR4-2400 memory interfaces, and IEEE 1588 v2 precision time protocol acceleration.
Its UltraScale+ architecture enables partial reconfiguration, dynamic function exchange, and deterministic low-latency signal processing pipelines-critical for radar beamforming, packet inspection, and hardware-accelerated inference engines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,562,752 - provides scalable parallel datapath capacity for multi-channel 5G NR layer-1 processing |
| DSP Slices | 102,400 - enables concurrent execution of >100 complex-valued FFTs per millisecond in massive MIMO systems |
| Transceiver Line Rate | 32.75 Gb/s - supports CPRI/eCPRI over single-lane optical interfaces without gearbox ICs |
| UltraRAM Capacity | 1,164 Mbit - delivers large, low-latency on-die memory for frame buffering in video analytics pipelines |
| I/O Pins | 1,259 - allows direct connection to multiple high-speed SerDes, memory controllers, and sensor interfaces |
| Memory Interface | DDR4-2400 - enables 19.2 GB/s peak bandwidth for host-to-FPGA data streaming in AI inference servers |
Pinout & Package
Package: 3824-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic and routing fabric |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration circuitry, PCIe block, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to GTY transceiver analog circuitry for <−45 dBc jitter performance |
| IO_LxYy_TMS | JTAG boundary-scan control | Enables IEEE 1149.1-compliant in-system programming and debug visibility |
| CLK_IN_0 | Dedicated clock input | Accepts differential LVDS/AC-coupled reference clocks up to 1.2 GHz for MMCM/PLL locking |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-R5 with lockstep capability for safety-critical control plane tasks |
| Partial Reconfiguration | Enables runtime swapping of logic partitions without system reset-used in adaptive radio access networks |
| GTY Transceivers | 32.75 Gb/s serial I/O with built-in PRBS generation/checking and eye diagram monitoring |
| PCIe Gen4 x16 Hard IP | Zero-software-overhead host interface delivering 32 GB/s bidirectional throughput for data center accelerators |
| UltraRAM Blocks | Configurable as true dual-port RAM or shift register, eliminating external SRAM for pipeline staging |
Applications
| 5G Massive MIMO Baseband Unit | AI Inference Accelerator Card |
|---|---|
Use Scenario: Real-time channel estimation, precoding matrix computation, and OFDM symbol generation across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary signal processing engine implementing L1 PHY layer functions with deterministic sub-microsecond latency. Use Value: Eliminates need for external DSP clusters by integrating 102,400 DSP slices and 32.75 Gb/s interconnect to RFICs. | Use Scenario: Hardware-accelerated BERT, ResNet-50, and custom sparsity-aware neural network inference in edge servers. IC Role / Device Role / Timing Role: Programmable accelerator co-processor interfacing via PCIe Gen4 x16 to host CPU and DDR4 memory subsystem. Use Value: Delivers >200 TOPS INT8 throughput using on-chip UltraRAM for weight caching and logic fabric for custom MAC arrays. |
| Radar Signal Processor | Data Center SmartNIC Offload |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Time-critical beamformer and FFT engine synchronized to 100 MHz system clock with deterministic jitter <1 ps RMS. Use Value: Achieves real-time SAR image reconstruction at 100 fps using 9.5M logic cells and hardened floating-point units. | Use Scenario: TLS encryption/decryption, packet classification, and RDMA acceleration in cloud-scale network switches. IC Role / Device Role / Timing Role: Dedicated offload engine with hard PCIe Gen4 controller, DMA engines, and 1,259 I/O pins for multi-port 100G Ethernet connectivity. Use Value: Reduces CPU utilization by 70% and cuts end-to-end latency to <500 ns for financial trading applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU19P-2FSVA3824I | Higher speed grade (-2): 35.56 Gb/s transceivers, 10% higher logic utilization at same frequency | Required for designs exceeding 32.75 Gb/s line rates or needing tighter timing closure at 600 MHz system clocks | Select when targeting >32 Gb/s optical interconnects or worst-case industrial temperature operation (−40°C to +100°C) |
| XCVU13P-1FLGA2577E | Smaller footprint (2577-pin FCBGA), 5.9M logic cells, 60,000 DSP slices, 26.56 Gb/s GTY transceivers | Suitable for cost-optimized 5G small cells and mid-tier AI edge inference where full XCVU19P capacity is unnecessary | Choose for lower power, reduced PCB layer count, and faster time-to-market in non-baseband-intensive deployments |
Compared with XCVU19P-1FSVA3824E, the -2 speed grade offers higher transceiver margins for demanding optical links, while the XCVU13P variant trades raw capacity for thermal efficiency and layout simplicity-enabling differentiated product tiers within the same architecture family.
Availability
XCVU19P-1FSVA3824E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge servers, and defense radar systems requiring stable component supply across extended product lifecycles.
Supply support for XCVU19P-1FSVA3824E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family delivers FPGA-based acceleration for mission-critical, high-bandwidth workloads where software-defined flexibility meets ASIC-level performance-targeting wireless infrastructure, aerospace, and intelligent networking.
FAQ
What is the maximum supported transceiver line rate for XCVU19P-1FSVA3824E?
The XCVU19P-1FSVA3824E supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This specification is validated across the commercial temperature range and enables direct interface with 100G/400G optical modules without gearbox ICs. The XCVU19P-1FSVA3824E datasheet confirms this value under DC and AC switching characteristics sections.
Does XCVU19P-1FSVA3824E include hardened processor cores?
Yes, the XCVU19P-1FSVA3824E integrates two ARM Cortex-R5F processors in a lockstep configuration, accessible via the Processing System (PS) block. These cores run at up to 600 MHz and support real-time control, firmware-driven configuration, and safety-critical monitoring functions alongside the programmable logic fabric in the XCVU19P-1FSVA3824E.
What I/O standards are supported by XCVU19P-1FSVA3824E?
The XCVU19P-1FSVA3824E supports 1.0 V, 1.2 V, 1.35 V, 1.5 V, 1.8 V, and 2.5 V I/O standards including LVCMOS, SSTL, HSTL, and differential standards like LVDS, BLVDS, and TMDS. Its 1,259 I/O pins are grouped into banks with independent voltage supplies, allowing mixed-voltage operation across interfaces such as DDR4 memory, PCIe Gen4, and sensor ADCs in the XCVU19P-1FSVA3824E.
Is partial reconfiguration supported on XCVU19P-1FSVA3824E?
Yes, partial reconfiguration is fully supported on the XCVU19P-1FSVA3824E through Vivado Design Suite tools and runtime IP. It enables dynamic logic partition swapping without resetting the entire device-used in adaptive radio access networks and multi-standard base stations where the XCVU19P-1FSVA3824E must reconfigure physical layer blocks on-the-fly.
What is the UltraRAM capacity of XCVU19P-1FSVA3824E?
The XCVU19P-1FSVA3824E contains 1,164 Mbit of UltraRAM-configurable as true dual-port RAM, shift registers, or FIFOs. This on-die memory eliminates external SRAM for intermediate buffering in video analytics, radar processing, and packet inspection pipelines implemented on the XCVU19P-1FSVA3824E.
XCVU19P-1FSVA3824E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 3824-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 510720
- Number of Logic Elements/Cells:
- 8937600
- Total RAM Bits:
- 79586918
- Number of I/O:
- 2072
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 3824-FCBGA (65x65)
XCVU19P-1FSVA3824E FAQ
1.How can I place an order for XCVU19P-1FSVA3824E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU19P-1FSVA3824E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU19P-1FSVA3824E reliable?
The price and inventory of XCVU19P-1FSVA3824E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU19P-1FSVA3824E is usually 5 days.
3.What payment methods are accepted for XCVU19P-1FSVA3824E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU19P-1FSVA3824E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU19P-1FSVA3824E?
XCVU19P-1FSVA3824E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU19P-1FSVA3824E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU19P-1FSVA3824E?
For technical support, including XCVU19P-1FSVA3824E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU19P-1FSVA3824E requirements.
6.How does Aetrix verify that XCVU19P-1FSVA3824E is sourced from the original manufacturer or authorized distributors?
All XCVU19P-1FSVA3824E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU19P-1FSVA3824E meets industry standards.
7.What is the process for return or replacement of XCVU19P-1FSVA3824E?
All XCVU19P-1FSVA3824E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU19P-1FSVA3824E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU19P-1FSVA3824E part is unused and in its original packaging.
Return procedure for XCVU19P-1FSVA3824E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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