AMD XCVU19P-2FSVA3824E

Overview

XCVU19P-2FSVA3824E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 12,750K logic cells, 1,452 DSP slices, and 135.5 Mb of block RAM. It supports PCIe Gen4 x16, 25G/28G/58G transceivers, and hardened DDR4 memory controllers, deployed in AI acceleration, high-end test equipment, and radar signal processing systems.

For engineers reviewing the XCVU19P-2FSVA3824E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal envelope (3824-pin FC-BGA, 35mm × 35mm), and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCVU19P-2FSVA3824E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated RFSoC ADC/DAC tiles in select variants - though this specific speed-grade variant excludes RF tiles. Its UltraScale+ architecture uses 16nm FinFET process technology and supports partial reconfiguration.

Configuration occurs via quad-SPI, BPI, or JTAG interfaces with dual-boot capability; it supports SEU mitigation through built-in scrubbing and ECC on configuration memory. The device operates across industrial temperature range (–40°C to +100°C junction) and requires multi-rail power sequencing (VCCINT, VCCAUX, VCCO, VRP, etc.).

Key Specifications

Pinout & Package

Package: 3824-pin Flip-Chip Ball Grid Array (FC-BGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU19P-2FSVA3824E, the XCVU19P-2FLGA2577E trades I/O and thermal headroom for compactness, while the XCVU29P-2FSVA3824E extends logic and memory resources within the same mechanical envelope-enabling future-proofing without layout change.

Availability

XCVU19P-2FSVA3824E is available at Aetrix Electronics and suitable for radar signal processing, AI inference acceleration, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCVU19P-2FSVA3824E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, adaptive SoCs, and FPGA solutions for datacenter, aerospace, and communications infrastructure.

The Virtex UltraScale+ family targets demanding applications requiring high logic density, hardened connectivity, and deterministic real-time processing-especially in defense electronics, 5G infrastructure, and AI hardware platforms.

FAQ

What is the maximum supported transceiver data rate for XCVU19P-2FSVA3824E?

The XCVU19P-2FSVA3824E supports transceiver data rates up to 58 Gb/s using PAM4 signaling, enabling 400G Ethernet and coherent optical interfaces. This specification is validated under industrial temperature conditions and requires proper reference clock jitter compliance (< 500 fs RMS). The XCVU19P-2FSVA3824E transceiver architecture includes built-in gearbox and FEC blocks to maintain link integrity at line rates exceeding 28 Gb/s NRZ.

Does XCVU19P-2FSVA3824E include integrated RF ADC/DAC tiles?

No, the XCVU19P-2FSVA3824E does not include integrated RF analog-to-digital or digital-to-analog converters. RFSoC capabilities are exclusive to the Zynq UltraScale+ RFSoC family (e.g., ZU28DR). The XCVU19P-2FSVA3824E is a pure programmable logic device with hardened digital IP only-its analog interface relies entirely on external high-speed ADC/DAC components connected via its 58 Gb/s transceivers or LVDS I/O banks.

What configuration modes are supported by XCVU19P-2FSVA3824E?

The XCVU19P-2FSVA3824E supports multiple configuration modes: quad-SPI flash, BPI parallel NOR flash, JTAG boundary-scan, and SelectMAP. Dual-boot capability allows fallback to a secondary bitstream stored in flash memory upon CRC failure. Configuration security features-including AES-256 decryption and HMAC authentication-are active in all non-JTAG modes. The XCVU19P-2FSVA3824E also supports partial reconfiguration via ICAP interface for runtime logic updates.

What is the operating temperature range for XCVU19P-2FSVA3824E?

The XCVU19P-2FSVA3824E is rated for industrial temperature operation, with a junction temperature range of –40°C to +100°C. Thermal design must account for its maximum power dissipation of 75W under worst-case switching activity. The XCVU19P-2FSVA3824E package includes a thermal lid and requires a minimum 6-layer PCB with dedicated ground/power planes and ≥12 thermal vias under the die for reliable operation at upper ambient temperatures.

How many DDR4 memory interfaces does XCVU19P-2FSVA3824E support?

The XCVU19P-2FSVA3824E integrates two hardened DDR4 memory controllers, each supporting up to 72-bit wide interfaces (64 data + 8 ECC bits) at speeds up to 2,400 MT/s. These controllers connect directly to external DDR4 SODIMMs or discrete components and expose AXI4 slave interfaces for seamless integration with processor subsystems or custom logic. The XCVU19P-2FSVA3824E DDR4 controllers include on-die termination, write leveling, and read-leveling calibration logic.