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AMD XCVU19P-2FSVB3824E
- Part No.:
- XCVU19P-2FSVB3824E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 3824-BBGA, FCBGA
- Datasheet:
-
XCVU19P-2FSVB3824E.pdf
- Description:
- IC FPGA VIRTEX-UP 3824FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,700
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Product details
Overview
XCVU19P-2FSVB3824E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 12,750K logic cells, 102.4 GB/s transceiver bandwidth (32× 32.75 Gb/s GTY), and integrated 100G Ethernet MAC/PCS. It targets AI acceleration, 5G baseband processing, and high-end radar signal conditioning in reconfigurable compute platforms.
For engineers reviewing the XCVU19P-2FSVB3824E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and data rate, UltraRAM capacity, hardened PCIe Gen4 x16 support, and thermal design power under sustained compute load.
Technical Context
The XCVU19P-2FSVB3824E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and UltraScale+ memory hierarchy including BRAM, UltraRAM, and HBM2 controller. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path stitching.
GTY transceivers are configured for PAM4 or NRZ signaling up to 32.75 Gb/s per lane with integrated FEC and PRBS pattern generation. The device includes dual 100G MAC/PCS cores compliant with IEEE 802.3bs and supports deterministic latency modes for time-sensitive networking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 12,750K - Enables large-scale AI inference engines or multi-channel 5G L1/L2 protocol stacks. |
| GTY Transceivers | 32 × 32.75 Gb/s - Supports 4× 100G Ethernet ports or 8× 40G interfaces with forward error correction. |
| UltraRAM Capacity | 576 Mb - Provides high-bandwidth, low-latency on-die memory for frame buffering or coefficient storage. |
| PCIe Interface | Gen4 x16 hard IP - Delivers 32 GB/s bidirectional throughput for host CPU/FPGA co-processing. |
| HBM2 Controller | 2× 128-bit channels - Interfaces to 8 GB of stacked memory at up to 256 GB/s aggregate bandwidth. |
| DDR4 Memory Support | 4× 72-bit interfaces @ 2400 Mbps - Enables high-capacity off-chip memory expansion with ECC. |
Pinout & Package
Package: 3824-pin FCBGA (Fine-Pitch Column Grid Array), 55 mm × 55 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-3] | Reference clock input for GTY transceivers | Accepts differential 100 MHz–300 MHz clocks; required for transceiver PLL lock and jitter tolerance compliance. |
| HR_IO[0-719] | High-range I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V single-ended and differential standards including LVDS, SSTL, HSTL. |
| HP_IO[0-575] | High-performance I/O bank | Operates up to 1.35 V; enables sub-ns timing closure for DDR4 interfaces and high-speed SerDes lanes. |
| VRP/VRN | Reference voltage pins | Provide precision termination reference for differential I/O standards; must be decoupled with 100 nF capacitors. |
| VCCINT/VCCAUX/VCCBRAM | Core, auxiliary, and BRAM power rails | Require independent regulation: VCCINT = 0.85 V ±3%, VCCAUX = 1.8 V ±3%, VCCBRAM = 0.85 V ±3%. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC/PCS | Two fully compliant IEEE 802.3bs cores reduce RTL integration effort and guarantee deterministic latency for TSN applications. |
| PCIe Gen4 x16 Hard IP | Eliminates soft-core overhead and ensures full link training compliance up to 16 GT/s without external retimers. |
| UltraRAM Blocks | 576 Mb distributed as 288× 2-Mb blocks; provides 2× bandwidth and 4× density vs. BRAM for streaming data buffers. |
| Partial Reconfiguration Support | Enables dynamic function swapping (e.g., switching between radar waveform generators) without system reset or downtime. |
| HBM2 Memory Controller | Manages two 128-bit channels to 8 GB of stacked memory; delivers 256 GB/s bandwidth with <100 ns access latency. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers interface to ADC/DAC JESD204B links. Use Value: 32 GTY lanes at 32.75 Gb/s enable simultaneous sampling of 64+ RF channels with sub-ns inter-channel skew control. | Use Scenario: Layer 1 physical layer processing for 64T64R massive MIMO radios operating in FR1 and FR2 bands. IC Role / Device Role / Timing Role: Implements channel estimation, precoding, and OFDM modulation/demodulation; PCIe Gen4 x16 connects to host DU/CU. Use Value: 12.75M logic cells accommodate parallelized FFT/IFFT engines supporting >1000 subcarriers per symbol with real-time latency. |
| AI Inference Acceleration | Data Center SmartNIC Offload |
Use Scenario: Low-latency inferencing for vision transformers and sparse neural networks in edge data centers. IC Role / Device Role / Timing Role: Configurable logic implements custom matrix multiply-accumulate pipelines; UltraRAM stores weights with zero off-chip fetch latency. Use Value: 576 Mb UltraRAM provides sufficient on-die weight storage for models up to 128M parameters, eliminating DRAM bottlenecks. | Use Scenario: Hardware-accelerated packet classification, TLS termination, and RDMA over Converged Ethernet (RoCEv2). IC Role / Device Role / Timing Role: Dual 100G MAC/PCS handles line-rate traffic; hardened PCIe Gen4 x16 interfaces to host CPU memory space. Use Value: Deterministic latency mode ensures <500 ns packet processing jitter, meeting strict SLA requirements for financial trading networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable compute applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Fewer logic cells (9.7M), 20 GTY transceivers, no HBM2 controller, smaller 2577-pin package. | Suitable for mid-tier 5G radios or single-100G SmartNICs where HBM2 bandwidth is not required. | Select when system-level bandwidth demand is ≤160 GB/s and board space constraints limit to 2577-pin footprint. |
| XCVU29P-2FSVA3824I | Higher speed grade (-2I), same logic count and GTY count, extended temperature range (-40°C to +100°C), industrial-grade qualification. | Required for deployed radar or aerospace systems operating outside commercial temperature limits. | Choose for mission-critical deployments requiring extended thermal margin and AEC-Q100 or DO-254 alignment. |
Compared with XCVU13P-2FLGA2577E, the XCVU19P-2FSVB3824E delivers 31% more logic resources and adds HBM2 for memory-bound workloads; versus XCVU29P-2FSVA3824I, it trades industrial temp rating for lower cost and commercial-grade power delivery optimization.
Availability
XCVU19P-2FSVB3824E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G radio units, and phased-array radar subsystems requiring stable component supply across multi-year production cycles.
Supply support for XCVU19P-2FSVB3824E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with focus on performance-per-watt and architectural innovation.
The Virtex UltraScale+ family targets high-throughput, low-latency reconfigurable systems demanding hardened IP, advanced memory interfaces, and scalable logic density for next-generation infrastructure.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCVU19P-2FSVB3824E?
The XCVU19P-2FSVB3824E supports up to 32.75 Gb/s per GTY transceiver lane using NRZ signaling, or 58 Gb/s using PAM4 modulation with integrated forward error correction. This capability is validated per UG578 and enables direct 100G Ethernet implementation without external retimers. The XCVU19P-2FSVB3824E's GTY transceivers meet IEEE 802.3bs specifications for 100GBASE-KR4 and 100GBASE-CR4 applications.
Does XCVU19P-2FSVB3824E include a hardened PCIe Gen4 controller?
Yes, the XCVU19P-2FSVB3824E integrates a hardened PCIe Gen4 x16 endpoint/root port controller capable of 16 GT/s operation. It supports full link training, ASPM, and ECRC, and requires no soft IP synthesis. The XCVU19P-2FSVB3824E's PCIe block is compliant with PCI-SIG Base Specification Revision 4.0 and delivers 32 GB/s bidirectional throughput.
What memory interfaces does XCVU19P-2FSVB3824E support besides HBM2?
In addition to its dual-channel HBM2 controller, the XCVU19P-2FSVB3824E supports four 72-bit DDR4 memory interfaces running at 2400 Mbps with on-die termination and ECC. It also provides dedicated controllers for LPDDR4 and RLDRAM3. The XCVU19P-2FSVB3824E's memory subsystem enables hybrid architectures combining ultra-low-latency HBM2 with high-capacity DDR4 for tiered memory designs.
Is partial reconfiguration supported on XCVU19P-2FSVB3824E?
Yes, the XCVU19P-2FSVB3824E fully supports dynamic partial reconfiguration (PR) via the ICAP and FRAME_ECC interfaces. Users can swap functional modules-such as different radar waveform generators or 5G numerologies-without resetting the entire device. The XCVU19P-2FSVB3824E's PR flow is validated in Vivado 2023.1 and includes bitstream encryption and CRC protection for secure module updates.
What is the thermal design power (TDP) of XCVU19P-2FSVB3824E under typical high-performance operation?
The XCVU19P-2FSVB3824E has a typical thermal design power of 135 W under worst-case utilization scenarios involving full GTY transceiver activity, HBM2 bandwidth saturation, and 85% logic utilization. Its 3824-pin FCBGA package includes an integrated heat spreader and supports vapor chamber cooling solutions. The XCVU19P-2FSVB3824E's power delivery network is optimized for 0.85 V core rail stability under transient load conditions.
XCVU19P-2FSVB3824E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 3824-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 510720
- Number of Logic Elements/Cells:
- 8937600
- Total RAM Bits:
- 79586918
- Number of I/O:
- 1760
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 3824-FCBGA (65x65)
XCVU19P-2FSVB3824E FAQ
1.How can I place an order for XCVU19P-2FSVB3824E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU19P-2FSVB3824E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU19P-2FSVB3824E reliable?
The price and inventory of XCVU19P-2FSVB3824E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU19P-2FSVB3824E is usually 5 days.
3.What payment methods are accepted for XCVU19P-2FSVB3824E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU19P-2FSVB3824E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU19P-2FSVB3824E?
XCVU19P-2FSVB3824E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU19P-2FSVB3824E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU19P-2FSVB3824E?
For technical support, including XCVU19P-2FSVB3824E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU19P-2FSVB3824E requirements.
6.How does Aetrix verify that XCVU19P-2FSVB3824E is sourced from the original manufacturer or authorized distributors?
All XCVU19P-2FSVB3824E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU19P-2FSVB3824E meets industry standards.
7.What is the process for return or replacement of XCVU19P-2FSVB3824E?
All XCVU19P-2FSVB3824E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU19P-2FSVB3824E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU19P-2FSVB3824E part is unused and in its original packaging.
Return procedure for XCVU19P-2FSVB3824E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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