AMD XCVU23P-1FSVJ1760E

Overview

XCVU23P-1FSVJ1760E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,459,200 logic cells, 8,752 DSP slices, and 96.2 Gb/s GTY transceiver bandwidth. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, targeting AI acceleration and high-speed data processing in radar and 5G infrastructure.

For engineers reviewing the XCVU23P-1FSVJ1760E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver lane count and speed grade (-1), system-level integration of PCIe Gen4 and 100G Ethernet, and package thermal performance for sustained compute workloads.

Technical Context

The XCVU23P-1FSVJ1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and multi-rate GTY transceivers supporting 1.6–32.75 Gb/s per lane. It uses 16nm FinFET process technology and supports partial reconfiguration.

Configuration is performed via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device includes integrated System Monitor for on-chip temperature and supply voltage monitoring with ±1°C accuracy.

Key Specifications

Pinout & Package

The XCVU23P-1FSVJ1760E is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high I/O count and thermal dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU23P-1FSVJ1760E, the -2 variant trades higher power for improved timing headroom, while the XCVU19P-1 offers identical packaging and I/O but scales down compute density-enabling cost-optimized reuse of the same carrier board.

Availability

XCVU23P-1FSVJ1760E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and AI inference acceleration requiring stable component supply across long production cycles.

Supply support for XCVU23P-1FSVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data center, embedded, and client markets.

The Virtex UltraScale+ family delivers FPGA+ASIC hybrid architectures for compute-intensive, low-latency applications including aerospace, communications infrastructure, and AI acceleration.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCVU23P-1FSVJ1760E?

The XCVU23P-1FSVJ1760E supports up to 32.75 Gb/s per GTY transceiver lane, validated for protocols including 100G Ethernet (KR4), CPRI, and proprietary high-speed serial links. This rate is achievable under speed grade -1 conditions with proper PCB stackup and AC coupling. The XCVU23P-1FSVJ1760E datasheet specifies this as the maximum guaranteed performance point across temperature and voltage corners.

Does XCVU23P-1FSVJ1760E include hardened PCIe Gen4 support?

Yes, the XCVU23P-1FSVJ1760E integrates a hardened PCIe Gen4 x16 endpoint or root port block, eliminating the need for soft IP implementation. This reduces logic utilization by ~45,000 LUTs and guarantees timing closure for 16 GT/s operation. The XCVU23P-1FSVJ1760E supports both LTSSM state machine and configuration space access per PCI Express Base Specification v4.0.

What package type and ball count does XCVU23P-1FSVJ1760E use?

The XCVU23P-1FSVJ1760E uses a 1760-ball Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch and 35 × 35 mm body size. It features four I/O banks (HR, HP, HD, and MIO) and dedicated power/ground ball patterns optimized for signal integrity and thermal dissipation. This exact package is confirmed in AMD's official packaging specification document for XCVU23P-1FSVJ1760E.

Can XCVU23P-1FSVJ1760E perform partial reconfiguration?

Yes, the XCVU23P-1FSVJ1760E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logical partitions without resetting the entire device. This capability is used in radar and communications systems for runtime waveform or protocol updates. The XCVU23P-1FSVJ1760E implements frame-based reconfiguration with CRC-protected bitstream loading and secure authentication.

What memory interfaces are natively supported by XCVU23P-1FSVJ1760E?

The XCVU23P-1FSVJ1760E includes hardened DDR4 memory controllers supporting data rates up to 2400 MT/s across up to 16 banks, with optional ECC and write-leveling calibration. It also supports LPDDR4, RLDRAM3, and QDR-IV SRAM via programmable I/O banks. These interfaces are documented in the XCVU23P-1FSVJ1760E Memory Interface Solutions User Guide (UG586).