AMD XCVU23P-1FSVJ1760I

Overview

XCVU23P-1FSVJ1760I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,375K logic cells, 9,480 DSP slices, and 59.5 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers (up to 64 lanes), and DDR4 memory interfaces up to 2400 Mbps. Used in high-end radar signal processing systems requiring real-time beamforming and low-latency data path acceleration.

For engineers reviewing the XCVU23P-1FSVJ1760I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (TDP) of 55 W, and support for AMBA AXI4-Stream and AXI4-Lite interconnect protocols.

Technical Context

The XCVU23P-1FSVJ1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 10/25G Ethernet MAC, DDR4 PHY), and UltraScale+ SelectIO technology supporting SSTL, HSTL, and LVCMOS standards. Its transceiver subsystem uses GTY transceivers with built-in PRBS generators/checkers and adaptive equalization.

Configuration is performed via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device supports partial reconfiguration and dynamic function exchange (DFX) for runtime hardware updates without system reset.

Key Specifications

Pinout & Package

Package: FSVJ1760 - 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU23P-1FSVJ1760I, the XCVU29P offers headroom for future scalability but demands more board area and cooling, while the XCVU13P reduces BOM and thermal overhead at the expense of transceiver count and DSP throughput.

Availability

XCVU23P-1FSVJ1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-performance computing applications requiring stable component supply across long product lifecycles.

Supply support for XCVU23P-1FSVJ1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive workloads in aerospace, defense, wired/wireless infrastructure, and test equipment.

FAQ

What is the maximum supported DDR4 data rate for XCVU23P-1FSVJ1760I?

The XCVU23P-1FSVJ1760I supports DDR4 memory interfaces up to 2400 Mbps per pin using its hardened DDR4 PHY. This rate is validated across all I/O banks configured for SSTL-12 standard and requires matched trace lengths and proper termination. The XCVU23P-1FSVJ1760I achieves this performance with built-in write leveling, read leveling, and gate training sequences.

Does XCVU23P-1FSVJ1760I include hardened PCIe Gen4 controllers?

Yes, the XCVU23P-1FSVJ1760I integrates dual hardened PCIe Gen4 x16 controllers compliant with PCI Express Base Specification Revision 4.0. These controllers operate at 16 GT/s per lane and support Advanced Error Reporting (AER), Message Signaled Interrupts (MSI-X), and SR-IOV. The XCVU23P-1FSVJ1760I does not require external PCIe switch logic for endpoint or root complex functionality.

What configuration modes are supported by XCVU23P-1FSVJ1760I?

The XCVU23P-1FSVJ1760I supports master SPI, slave SPI, JTAG, and BPI configuration modes. Dual-boot capability allows fallback to secondary bitstream stored in QSPI flash upon CRC failure. Configuration security features include AES-256 decryption and HMAC-SHA256 authentication, both enforced during every boot cycle of the XCVU23P-1FSVJ1760I.

Can XCVU23P-1FSVJ1760I perform partial reconfiguration?

Yes, the XCVU23P-1FSVJ1760I fully supports partial reconfiguration (PR) through its ICAP and PCAP interfaces. PR enables dynamic swapping of logic modules-such as filter coefficients or modulation schemes-without disrupting active I/O or clock domains. This capability is natively implemented in the XCVU23P-1FSVJ1760I silicon and requires no external controller.

What is the thermal design power (TDP) rating for XCVU23P-1FSVJ1760I?

The XCVU23P-1FSVJ1760I has a specified thermal design power (TDP) of 55 W under typical operating conditions with 50% logic utilization and active transceivers. This value guides heatsink sizing and airflow requirements. Actual power consumption varies with design utilization, clock frequencies, and I/O activity, but the XCVU23P-1FSVJ1760I's thermal lid and FC-FBGA package are engineered to sustain continuous operation within this envelope.