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AMD XCVU23P-1VSVA1365I
- Part No.:
- XCVU23P-1VSVA1365I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1365-BFBGA, FCBGA
- Datasheet:
-
XCVU23P-1VSVA1365I.pdf
- Description:
- IC FPGA VIRTEX-UP 1365FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,744
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Product details
Overview
XCVU23P-1VSVA1365I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,472K logic cells, 9,824 DSP slices, and 112.5 MB of block RAM. It supports PCIe Gen4 x16, 25G/28G/58G transceivers, and DDR4 memory interfaces, deployed in AI acceleration and high-end test equipment.
For engineers reviewing the XCVU23P-1VSVA1365I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, I/O voltage support (1.8V/1.2V), and thermal design power (TDP) for cooling integration.
Technical Context
The XCVU23P-1VSVA1365I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting 25–58 Gb/s PAM4/NRZ. It integrates dual ARM Cortex-A53 processors for system management and real-time control.
Configuration is performed via quad-SPI or BPI flash, with secure bitstream encryption and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C) and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,472,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 9,824 - enables high-throughput fixed/floating-point math for AI inference and signal processing |
| Block RAM | 112.5 MB - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM latency |
| Transceiver Max Rate | 58 Gb/s (PAM4) - supports 400G Ethernet and coherent optical interface designs |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - enables direct interfacing with sensors, memory, and high-speed serdes PHYs |
| TDP | 55 W (typical) - defines thermal envelope requiring active heatsink and airflow planning in PCB layout |
Pinout & Package
The XCVU23P-1VSVA1365I is housed in a 1365-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm pitch, designed for high-density routing and thermal dissipation in multilayer PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise, high-current VRM with tight regulation |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, PCIe hard IP, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.95 V to high-speed serial transceivers; sensitive to ripple and noise |
| PROGRAM_B | Configuration reset input | Active-low signal initiating full reconfiguration from boot source; synchronous to configuration clock |
| INIT_B | Configuration status output | Open-drain indicator signaling successful bitstream loading or error during configuration |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential clocks up to 1.2 GHz for MMCM/PLL clock synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL overhead and timing closure risk for host interface; supports SR-IOV and ATS |
| UltraScale+ architecture with ASIC-like performance | Enables 800+ MHz system clocking and sub-10 ns path delays in critical datapaths |
| Integrated dual-core ARM Cortex-A53 | Allows embedded Linux execution and real-time firmware control without external processor |
| Secure boot with AES-256 & HMAC-SHA256 | Prevents unauthorized bitstream loading and ensures runtime integrity verification |
| Partial reconfiguration support | Permits dynamic logic swapping in operational systems-e.g., switching between radar waveform engines |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; transceivers interface with ADC/DACs at 2.4 GSPS. Use Value: 58 Gb/s transceivers enable direct JESD204C connectivity to RF sampling converters, eliminating intermediate serialization layers. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR base stations with 64+ antenna elements. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD lookup tables and feedback loop filters; PCIe Gen4 connects to host CPU for calibration data exchange. Use Value: 9,824 DSP slices deliver >2 TeraMAC/s throughput required for real-time wideband DPD correction. |
| AI Inference Accelerator | High-End Test Equipment |
Use Scenario: Low-latency inferencing for vision-guided robotics using quantized CNN models. IC Role / Device Role / Timing Role: Logic fabric maps convolution layers to LUTs and DSPs; DDR4 interface streams weights and activations at 25.6 GB/s. Use Value: 112.5 MB block RAM stores entire model parameters on-chip, avoiding off-chip memory bottlenecks and reducing inference latency by >40%. | Use Scenario: High-speed digital pattern generation and analysis in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Generates synchronized multi-channel stimulus waveforms and captures response data with sub-100 ps timing resolution. Use Value: UltraScale+ I/O banks support 2.5 V LVCMOS and differential standards simultaneously, enabling mixed-voltage DUT interfacing without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSVA2104I | Higher logic density (2.2M cells), 128.5 MB BRAM, 64 Gb/s transceivers; larger FCBGA-2104 package | Targets 800G Ethernet and multi-die AI training accelerators requiring greater on-chip memory | Select when >1.47M logic cells or >112.5 MB BRAM are needed; verify PCB redesign for 2104-pin footprint |
| XCVU13P-2FSVA1152E | Lower speed grade (-2), commercial temp range (0°C to +85°C), 1152-pin FCBGA, reduced DSP count (7,680) | Suitable for cost-sensitive prototyping and non-industrial deployment where extended temperature is not required | Choose for evaluation or volume production with relaxed thermal and performance requirements; lower BOM cost |
Compared with XCVU23P-1VSVA1365I, the XCVU29P offers higher scalability for next-gen infrastructure, while the XCVU13P trades performance and ruggedness for cost and footprint efficiency-enabling tiered platform development across lab, prototype, and production stages.
Availability
XCVU23P-1VSVA1365I is available at Aetrix Electronics and suitable for AI accelerator cards, 5G baseband units, and high-end test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU23P-1VSVA1365I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through its Xilinx product portfolio.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications including radar, 5G infrastructure, and AI inference-designed for deterministic performance under thermal and power constraints.
FAQ
What is the maximum supported transceiver data rate for XCVU23P-1VSVA1365I?
The XCVU23P-1VSVA1365I supports up to 58 Gb/s using PAM4 modulation and 28 Gb/s using NRZ. This capability is verified in the UltraScale+ transceiver specifications and enables direct JESD204C and 400G Ethernet implementations. The actual achievable rate depends on board layout, reference clock stability, and signal integrity tuning.
Does XCVU23P-1VSVA1365I include a hard processor subsystem?
Yes, the XCVU23P-1VSVA1365I integrates a dual-core ARM Cortex-A53 application processor subsystem with 256 KB of shared L2 cache and peripherals including UART, I²C, SPI, and Gigabit Ethernet MAC. This allows running Linux or bare-metal firmware alongside programmable logic, eliminating the need for an external microcontroller in many system-on-chip designs.
What configuration modes does XCVU23P-1VSVA1365I support?
XCVU23P-1VSVA1365I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI is commonly used for fast parallel bitstream loading from flash, while JTAG enables boundary-scan testing and in-system programming. Configuration security features include AES-256 decryption and HMAC-SHA256 authentication to prevent unauthorized bitstream access.
Is XCVU23P-1VSVA1365I qualified for industrial temperature operation?
Yes, the XCVU23P-1VSVA1365I is rated for the industrial temperature range of –40°C to +100°C (case temperature). This qualification is specified in the device's ordering information and thermal characteristics table, making it suitable for deployment in outdoor base stations, avionics, and industrial automation equipment without derating.
How much block RAM is available on XCVU23P-1VSVA1365I?
The XCVU23P-1VSVA1365I provides 112.5 MB of total block RAM distributed across 2,880 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or split into two 18 Kb ports. This on-chip memory supports high-bandwidth buffering, large lookup tables, and local storage for AI model weights-reducing dependency on external DDR4 interfaces.
XCVU23P-1VSVA1365I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1365-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128700
- Number of Logic Elements/Cells:
- 2252250
- Total RAM Bits:
- 77909197
- Number of I/O:
- 364
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1365-FCBGA (35x35)
XCVU23P-1VSVA1365I FAQ
1.How can I place an order for XCVU23P-1VSVA1365I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU23P-1VSVA1365I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU23P-1VSVA1365I reliable?
The price and inventory of XCVU23P-1VSVA1365I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU23P-1VSVA1365I is usually 5 days.
3.What payment methods are accepted for XCVU23P-1VSVA1365I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU23P-1VSVA1365I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU23P-1VSVA1365I?
XCVU23P-1VSVA1365I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU23P-1VSVA1365I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU23P-1VSVA1365I?
For technical support, including XCVU23P-1VSVA1365I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU23P-1VSVA1365I requirements.
6.How does Aetrix verify that XCVU23P-1VSVA1365I is sourced from the original manufacturer or authorized distributors?
All XCVU23P-1VSVA1365I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU23P-1VSVA1365I meets industry standards.
7.What is the process for return or replacement of XCVU23P-1VSVA1365I?
All XCVU23P-1VSVA1365I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU23P-1VSVA1365I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU23P-1VSVA1365I part is unused and in its original packaging.
Return procedure for XCVU23P-1VSVA1365I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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