AMD XCVU23P-2FSVJ1760E

Overview

XCVU23P-2FSVJ1760E from AMD is an FPGA orderable option positioned for configurable logic, memory-interface support, and embedded digital acceleration in space-conscious hardware. The combination of the Virtex UltraScale+ architecture and 1760-BBGA, FCBGA, which is aligned with denser logic integration, broader connectivity, and heavier routing demands makes this part suitable when the board needs field-programmable logic density, scalable I/O reach, and a package choice aligned to manufacturing and routing constraints.

Virtex UltraScale+ devices provide very high logic density, large on-chip memory resources, and advanced connectivity positioning for accelerator, communications, and high-throughput digital systems. For engineers reviewing the XCVU23P-2FSVJ1760E datasheet, XCVU23P-2FSVJ1760E pinout, XCVU23P-2FSVJ1760E application, or XCVU23P-2FSVJ1760E equivalent, this device is widely used in embedded processing platforms, digital interface bridges, industrial control systems, communications equipment, sensor aggregation hardware, and programmable accelerator subsystems.

Technical Context

In real hardware, XCVU23P-2FSVJ1760E is used as an FPGA platform rather than a fixed-function controller. The selected Virtex UltraScale+ density and speed grade 2 orderable option. matter because logic capacity, memory blocks, DSP availability, and I/O reach all influence whether the device can absorb the intended control, buffering, and protocol workload.

The exact orderable code is important here: 1760-BBGA, FCBGA affects escape routing and memory-interface planning, speed grade 2 orderable option. affects timing margin, and the commercial temperature option indicated by the suffix. determines whether the part can be approved for the target deployment range. That combination often decides which device is actually released into a production BOM.

Higher Virtex UltraScale+ density point for compute-heavy programmable logic, dense memory-side integration, and large subsystem acceleration fabrics. In practice, this means XCVU23P-2FSVJ1760E is typically chosen when the system needs FPGA flexibility for control-heavy datapaths, local acceleration, interface bridging, or memory-connected logic while still respecting board-area and package constraints.

Key Specifications

Pinout & Package

The XCVU23P-2FSVJ1760E pinout includes configurable user I/O, dedicated power rails, configuration and JTAG connections, clock-capable pins, and package-specific escape resources within 1760-BBGA, FCBGA package.

For PCB design, the main concerns are clean power distribution, configuration-access planning, clock integrity, and package-aware escape routing around memory and high-activity interface banks.

Key Features

• Configurable FPGA fabric supports board-specific logic, control, and interface integration.
• Package options scale I/O reach for compact through higher-density digital platforms.
• Orderable speed grades help align the device with board timing and interface targets.
• Suitable for consolidating subsystem logic, buffering, and programmable control functions.
• Supports embedded system flexibility across industrial, communications, and computing use cases.
• Field-programmable behavior preserves updateability across platform revisions.

Applications

Equivalent & Alternatives

When evaluating a XCVU23P-2FSVJ1760E equivalent, engineers should compare family architecture, package, speed grade, operating range, memory-interface planning, and overall programmable logic fit.

Compared with XCVU23P-2FSVJ1760E, XCVU23P-2FSVJ1760E selection depends on exact package, speed grade, qualification suffix, and board-routing fit. XCVU23P-2FSVJ1760E vs XCVU13P-2FHGA2104E selection depends on whether the design should remain in the same FPGA family path or shift to another density or architecture with different integration tradeoffs.

Quality

XCVU23P-2FSVJ1760E should be sourced as original AMD programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.

Production validation should include power-sequencing review, configuration reliability, timing-closure confirmation, clock integrity checks, and signal-integrity review on high-activity I/O paths.

Availability

XCVU23P-2FSVJ1760E is suitable for configurable digital logic, subsystem integration, and FPGA-based interface or control functions in embedded, industrial, and communications platforms.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.

For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce programmable-logic procurement risk.

Manufacturer

AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.

Virtex UltraScale+ devices provide very high logic density, large on-chip memory resources, and advanced connectivity positioning for accelerator, communications, and high-throughput digital systems. Higher Virtex UltraScale+ density point for compute-heavy programmable logic, dense memory-side integration, and large subsystem acceleration fabrics.

FAQ

What is XCVU23P-2FSVJ1760E used for?

XCVU23P-2FSVJ1760E is used for configurable logic, interface concentration, memory-side support, and embedded digital subsystem integration in FPGA-based hardware.

Where can I find the XCVU23P-2FSVJ1760E datasheet download?

The XCVU23P-2FSVJ1760E datasheet can be accessed from the confirmed source used for this FPGA family and orderable option.

What should be considered in XCVU23P-2FSVJ1760E pinout design?

Designers should account for configuration access, power domains, clock planning, and package-driven escape routing around high-activity I/O and memory-related signals.

Is XCVU23P-2FSVJ1760E a CPLD?

No. It is an FPGA orderable option in an AMD programmable logic family intended for broader configurable logic and subsystem integration tasks.

What are common XCVU23P-2FSVJ1760E equivalent solutions?

Common candidates include XCVU23P-2FSVJ1760E and XCVU13P-2FHGA2104E depending on package, family architecture, logic density, and system-level integration needs.