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AMD XCVU23P-2FSVJ1760E
- Part No.:
- XCVU23P-2FSVJ1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCVU23P-2FSVJ1760E.pdf
- Description:
- IC FPGA VIRTEX-UP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,188
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Product details
Overview
XCVU23P-2FSVJ1760E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,225,920 logic cells, 14,520 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G radio unit processing.
For engineers reviewing the XCVU23P-2FSVJ1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal envelope (Tj ≤ 100°C), and configuration interface options (e.g., dual BPI, QSPI, JTAG).
Technical Context
The XCVU23P-2FSVJ1760E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.
Configuration is performed via master SPI or slave parallel mode using 1.8 V or 3.3 V I/O banks. The device uses AMD's Vivado Design Suite for synthesis, implementation, and bitstream generation, with support for SystemVerilog and HLS-based design entry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,225,920 - determines maximum combinational/sequential logic capacity for complex algorithm mapping |
| DSP Slices | 14,520 - enables high-throughput fixed/floating-point computation for radar, AI inference, and signal processing |
| Block RAM | 104.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| GTY Transceivers | 64 lanes @ up to 25.8 Gb/s - supports 100G/400G Ethernet, CPRI/eCPRI, and high-speed serial interconnects |
| I/O Pins | 832 user-configurable - enables wide parallel interfaces (e.g., DDR4 x72, AXI4-Stream) and mixed-voltage connectivity |
| Speed Grade | -2 - guarantees timing closure at highest operating frequency for critical paths in high-performance designs |
| Max Junction Temp | 100°C - defines thermal management requirements for sustained operation in telecom and industrial enclosures |
Pinout & Package
The XCVU23P-2FSVJ1760E is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO banks and integrated thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M3 | Configuration Mode Select | Determines boot source (e.g., QSPI, BPI, JTAG) during power-up reset sequence |
| CCLK | Configuration Clock | Drives synchronous loading of configuration bitstream from external flash into FPGA fabric |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration success or failure |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration cycle |
| HR Bank 0–27 | High-Range I/O | Supports 1.8 V/2.5 V/3.3 V signaling with programmable slew rate and drive strength |
| HP Bank 0–52 | High-Performance I/O | Optimized for 1.2 V/1.35 V/1.5 V interfaces including DDR4 and LPDDR4 memory controllers |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100G transport with forward error correction for optical fronthaul applications |
| DDR4/LPDDR4 Memory Interface | Supports up to 2400 MT/s with built-in calibration and training for reliable high-speed memory access |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions while maintaining system operation for adaptive workloads |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× DSP throughput versus previous Virtex-7 generation |
Applications
| AI Inference Acceleration | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Real-time neural network inference at edge data centers with low-latency response requirements. IC Role / Device Role / Timing Role: Configurable hardware accelerator executing convolution and matrix multiplication kernels. Use Value: Achieves >12 TOPS/W efficiency using hardened DSP slices and on-chip BRAM for weight caching. | Use Scenario: Massive MIMO baseband processing in Open RAN-compliant 5G RU deployments. IC Role / Device Role / Timing Role: Baseband processor handling CPRI/eCPRI framing, FFT/iFFT, and digital pre-distortion. Use Value: GTY transceivers enable direct 25G optical interface; hardened 100G MAC supports fronthaul aggregation. |
| Radar Signal Processing | High-Speed Test Equipment |
Use Scenario: Automotive and defense radar systems requiring real-time beamforming and pulse-Doppler processing. IC Role / Device Role / Timing Role: Real-time signal processor implementing adaptive filtering and range-Doppler map generation. Use Value: 14,520 DSP slices support simultaneous multi-channel FFTs; deterministic latency under 10 ns. | Use Scenario: Automated test equipment for semiconductor validation requiring precise pattern generation and capture. IC Role / Device Role / Timing Role: High-speed digital pattern generator and analyzer with sub-nanosecond timing resolution. Use Value: 832 I/O pins enable parallel 128-bit vector testing; -2 speed grade ensures setup/hold timing margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU23P-2FHGB2104E | 2104-pin FCBGA, larger footprint (40 mm × 40 mm), higher I/O count (1,024), increased power envelope | Better suited for multi-die interconnect and ultra-wide memory interfaces (e.g., HBM2 controller) | Select when board space and thermal budget allow for expanded I/O and memory bandwidth needs |
| XCVU13P-2FSVA2104E | Lower logic density (1,182,240 LUTs), fewer GTY transceivers (48 lanes), same -2 speed grade | Targeted at cost-optimized 5G DU and mid-tier AI inference where full XCVU23P capacity is unnecessary | Choose for balanced performance/cost in applications not requiring maximum transceiver or DSP resources |
Compared with XCVU23P-2FSVJ1760E, the XCVU23P-2FHGB2104E offers greater I/O scalability but requires PCB redesign, while the XCVU13P-2FSVA2104E reduces logic and transceiver capacity to lower BOM and thermal cost-both serve distinct positioning within the Virtex UltraScale+ portfolio.
Availability
XCVU23P-2FSVJ1760E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and high-speed test equipment requiring stable component supply across long production lifecycles.
Supply support for XCVU23P-2FSVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data center, embedded, and client markets.
The Virtex UltraScale+ family targets demanding infrastructure applications including AI acceleration, 5G wireless, and high-performance computing, delivering scalable logic, memory, and transceiver resources in a single device.
FAQ
What is the maximum supported data rate per GTY transceiver lane in the XCVU23P-2FSVJ1760E?
The XCVU23P-2FSVJ1760E supports up to 25.8 Gb/s per GTY transceiver lane, validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and PCIe Gen4. This rate is guaranteed under specified temperature and voltage conditions per AMD UG578 v1.14. The XCVU23P-2FSVJ1760E achieves this using adaptive equalization and clock-data recovery circuitry integrated into each GTY channel.
Does the XCVU23P-2FSVJ1760E support DDR4 memory interfaces, and what speeds are achievable?
Yes, the XCVU23P-2FSVJ1760E includes hardened DDR4 PHYs supporting data rates up to 2400 MT/s across up to 72-bit wide interfaces. It implements write-leveling, read-leveling, and gate-training sequences per JEDEC DDR4 specification. The XCVU23P-2FSVJ1760E also supports LPDDR4 at 4266 MT/s, enabling memory-constrained edge AI applications.
What configuration modes are supported by the XCVU23P-2FSVJ1760E?
The XCVU23P-2FSVJ1760E supports master SPI, slave parallel (BPI), JTAG, and fallback configuration modes. Configuration can be initiated from QSPI flash, parallel NOR flash, or host processor via EMIO. The XCVU23P-2FSVJ1760E also supports dual-image fallback for field-upgradable reliability in telecom systems.
Is partial reconfiguration supported on the XCVU23P-2FSVJ1760E, and what tools enable it?
Yes, the XCVU23P-2FSVJ1760E fully supports partial reconfiguration using AMD Vivado Design Suite v2023.1+. This allows dynamic replacement of logic modules without resetting the entire device. The XCVU23P-2FSVJ1760E implements frame-based PR with secure bitstream encryption and CRC checking for integrity verification during runtime updates.
What thermal management guidance applies to the XCVU23P-2FSVJ1760E in continuous operation?
The XCVU23P-2FSVJ1760E specifies a maximum junction temperature (Tj) of 100°C and requires active cooling in most high-utilization scenarios. Thermal design must account for 35 mm × 35 mm FCBGA package, thermal vias under the die, and recommended copper pour on inner layers. The XCVU23P-2FSVJ1760E datasheet (UG578) provides detailed thermal resistance values (θJA, θJB) for standard PCB stack-ups.
XCVU23P-2FSVJ1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128700
- Number of Logic Elements/Cells:
- 2252250
- Total RAM Bits:
- 77909197
- Number of I/O:
- 644
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCVU23P-2FSVJ1760E FAQ
1.How can I place an order for XCVU23P-2FSVJ1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU23P-2FSVJ1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU23P-2FSVJ1760E reliable?
The price and inventory of XCVU23P-2FSVJ1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU23P-2FSVJ1760E is usually 5 days.
3.What payment methods are accepted for XCVU23P-2FSVJ1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU23P-2FSVJ1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU23P-2FSVJ1760E?
XCVU23P-2FSVJ1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU23P-2FSVJ1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU23P-2FSVJ1760E?
For technical support, including XCVU23P-2FSVJ1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU23P-2FSVJ1760E requirements.
6.How does Aetrix verify that XCVU23P-2FSVJ1760E is sourced from the original manufacturer or authorized distributors?
All XCVU23P-2FSVJ1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU23P-2FSVJ1760E meets industry standards.
7.What is the process for return or replacement of XCVU23P-2FSVJ1760E?
All XCVU23P-2FSVJ1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU23P-2FSVJ1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU23P-2FSVJ1760E part is unused and in its original packaging.
Return procedure for XCVU23P-2FSVJ1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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