AMD XCVU23P-2FSVJ1760I

Overview

XCVU23P-2FSVJ1760I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,548,000 logic cells, 9,288 DSP slices, and 112.5 MB of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing and high-throughput data center acceleration systems.

For engineers reviewing the XCVU23P-2FSVJ1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility, thermal performance at -2 speed grade, and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCVU23P-2FSVJ1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ARM Cortex-R5F processors for real-time control. It uses 16nm FinFET process technology and supports multi-voltage I/O banks (1.8V/1.5V/1.35V/1.25V).

Configuration is performed via dual-boot QSPI flash or JTAG, with support for partial reconfiguration and secure boot using HMAC-SHA-256 authentication. The device includes dedicated clock management tiles with MMCM and PLL resources for low-jitter clock synthesis across multiple domains.

Key Specifications

Pinout & Package

Package: FSVJ1760 - 1760-pin flip-chip ball grid array with integrated heat spreader, 35 mm × 35 mm body, 0.8 mm ball pitch, and thermal interface material pre-applied.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU23P-2FSVJ1760I, the XCVU29P offers higher scalability for future-proofing, while the XCVU13P trades capacity for lower thermal footprint and BOM cost-both require PCB redesign due to non-pin-compatible packages.

Availability

XCVU23P-2FSVJ1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCVU23P-2FSVJ1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.

The Virtex UltraScale+ family delivers heterogeneous FPGA architectures with hardened IP, security features, and high-bandwidth I/O for mission-critical infrastructure applications.

FAQ

What is the maximum supported memory interface speed for XCVU23P-2FSVJ1760I?

The XCVU23P-2FSVJ1760I supports DDR4-2400 (1200 MHz) with a hardened memory controller, delivering up to 25.6 GB/s peak bandwidth. It also supports LPDDR4-4266 and DDR3-1866. All interfaces include built-in ECC and calibration logic, and timing closure is guaranteed at the -2 speed grade under industrial temperature conditions.

Does XCVU23P-2FSVJ1760I include built-in security features?

Yes, the XCVU23P-2FSVJ1760I integrates AES-256 bitstream encryption and HMAC-SHA-256 authentication for secure boot. It supports secure key storage in eFUSE and enables secure debug disable. These features are implemented in hardware and active upon power-up, ensuring protection against unauthorized configuration and cloning without software overhead.

What transceiver protocols does XCVU23P-2FSVJ1760I natively support?

The XCVU23P-2FSVJ1760I natively supports PCIe Gen4 x16, 100G Ethernet (CAUI-4), CPRI, JESD204B/C, and SATA 3.0 through its 64 × 25.78 Gb/s GTY transceivers. Protocol selection is configured at runtime via GTY wizard settings in Vivado; no external retimers or protocol converters are required for these standards.

Is partial reconfiguration supported on XCVU23P-2FSVJ1760I?

Yes, the XCVU23P-2FSVJ1760I fully supports dynamic partial reconfiguration (PR) using Vivado's PR flow. Users can swap logic modules-including DSP-heavy kernels or I/O interface blocks-while the rest of the design remains operational. PR regions are defined during floorplanning and validated for timing isolation per UG909.

What is the thermal design power (TDP) range for XCVU23P-2FSVJ1760I under typical operation?

The XCVU23P-2FSVJ1760I has a typical TDP range of 35–55 W depending on utilization, transceiver count active, and I/O switching activity. At full load with all 64 transceivers operating at 25.78 Gb/s and 80% logic utilization, peak power reaches 55 W. Thermal solution must accommodate 35 mm × 35 mm FSVJ1760 package with integrated heat spreader and specified junction-to-case resistance.