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AMD XCVU23P-2VSVA1365E
- Part No.:
- XCVU23P-2VSVA1365E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1365-BFBGA, FCBGA
- Datasheet:
-
XCVU23P-2VSVA1365E.pdf
- Description:
- IC FPGA VIRTEX-UP 1365FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,014
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Product details
Overview
XCVU23P-2VSVA1365E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,472K logic cells, 8,520 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G wireless infrastructure.
For engineers reviewing the XCVU23P-2VSVA1365E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance in air-cooled systems, and support for partial reconfiguration in dynamic workloads.
Technical Context
The XCVU23P-2VSVA1365E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers. It supports up to 96 GTY transceiver lanes operating at 25.8 Gb/s with PAM4 capability.
Its configuration interface includes dual-boot SPIx4, JTAG, and ICAP for secure bitstream loading and runtime reconfiguration. The device uses 16 nm FinFET process technology and operates across extended industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,472,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 8,520 - enables parallel high-throughput arithmetic for AI inference and signal processing kernels |
| Block RAM | 96.4 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external DRAM |
| GTY Transceivers | 96 lanes @ 25.8 Gb/s - supports 100G/200G/400G Ethernet, CPRI/eCPRI, and high-speed serial interconnects |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V - enables direct interfacing with ADCs, DACs, and memory devices |
| Configuration Interface | SPIx4, JTAG, ICAP - allows secure, field-upgradable, and partial reconfiguration during operation |
Pinout & Package
The XCVU23P-2VSVA1365E is housed in a 1365-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in air-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% power domain for logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply rail | 1.8 V supply for configuration logic, SelectIO banks, and transceiver analog circuitry |
| MGTAVCC | Transceiver analog supply | 1.0 V supply dedicated to GTY transceiver PLLs and analog front-end; sensitive to ripple |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential reference clocks up to 1.2 GHz for transceiver and fabric timing |
| INIT_B | Configuration status indicator | Open-drain output signaling successful bitstream load or configuration error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Port | Reduces soft-logic resource usage by ~250K LUTs and eliminates PCIe protocol stack integration effort |
| UltraScale+ Memory Controller (DDR4/LPDDR4) | Supports 2,400 MT/s with ECC and AXI4 interface, enabling deterministic memory access for real-time compute |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions without system reset, critical for adaptive radar and multi-standard radio |
| Secure Boot with AES-GCM & RSA-4096 | Ensures authenticated and encrypted bitstream loading, meeting DO-254 and IEC 62443-3-3 requirements |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne and ground-based radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers interface with high-speed ADC/DACs and RFSoCs. Use Value: 96 GTY lanes enable full-bandwidth digitization of multiple RF channels with sub-ns synchronization. | Use Scenario: Digital pre-distortion (DPD), channel estimation, and layer-1 processing in 5G NR base stations. IC Role / Device Role / Timing Role: Configurable accelerator for OFDM modulation/demodulation and massive MIMO matrix inversion. Use Value: 8,520 DSP slices deliver >2.1 TMAC/s for real-time DPD coefficient updates at 100 MHz clock rate. |
| AI Inference Accelerator | High-Speed Test Equipment |
Use Scenario: Low-latency inference engine for vision-guided robotics and edge AI gateways. IC Role / Device Role / Timing Role: Programmable hardware accelerator executing quantized CNN layers with custom memory hierarchy. Use Value: 96.4 Mb block RAM enables on-chip storage of model weights and activation buffers, eliminating DRAM bottlenecks. | Use Scenario: Bit-error-rate testing, jitter tolerance analysis, and protocol validation in 100G/400G test platforms. IC Role / Device Role / Timing Role: High-fidelity pattern generator and error detector using deterministic GTY transceiver timing. Use Value: 25.8 Gb/s GTY lanes with built-in PRBS generators and eye monitors support IEEE 802.3bs compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU23P-2FSVA1365I | Same logic capacity and transceiver count, but -2 speed grade and Industrial temperature rating (–40°C to +100°C) | Targeted for harsh-environment deployments where extended thermal margin is required | Select when operating ambient exceeds 85°C or thermal derating must be minimized |
| XCVU29P-2FSVA1760E | Higher density (2,164K LC, 11,520 DSP) and larger 1760-pin FCBGA package with additional I/O banks | Used in next-generation 800G optical transport and multi-die AI training accelerators | Choose when scaling beyond 1.4M LC or requiring >128 GTY lanes and expanded memory interface width |
Compared with XCVU23P-2VSVA1365E, the XCVU23P-2FSVA1365I offers identical functionality with guaranteed performance at higher junction temperatures, while the XCVU29P-2FSVA1760E extends logic and I/O resources for more demanding system-level integration-neither is pin-compatible, and both require board redesign.
Availability
XCVU23P-2VSVA1365E is available at Aetrix Electronics and suitable for AI acceleration, 5G baseband processing, and high-speed test equipment requiring stable component supply and long-term production support.
Supply support for XCVU23P-2VSVA1365E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, embedded, and client markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications including aerospace, defense, wired/wireless infrastructure, and advanced test instrumentation.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCVU23P-2VSVA1365E?
The XCVU23P-2VSVA1365E supports GTY transceivers operating up to 25.8 Gb/s per lane, validated for PAM4 and NRZ signaling. This rate is specified under the -2 speed grade at junction temperatures up to +100°C and requires proper PCB stackup and equalization tuning. XCVU23P-2VSVA1365E achieves this performance using adaptive feed-forward equalization (FFE) and decision feedback equalization (DFE) within each GTY channel.
Does XCVU23P-2VSVA1365E support PCIe Gen5?
No, XCVU23P-2VSVA1365E does not support PCIe Gen5. It integrates hardened PCIe Gen4 x16 Root Port and Endpoint blocks, compliant with PCI-SIG specification rev 4.0. While some GTY transceivers can be configured for custom protocols near 32 Gb/s, PCIe Gen5 (32 GT/s) is not implemented or verified in XCVU23P-2VSVA1365E silicon.
What is the I/O voltage range supported by XCVU23P-2VSVA1365E SelectIO banks?
XCVU23P-2VSVA1365E SelectIO banks support I/O standards from 1.2 V to 1.8 V, including SSTL-12, SSTL-15, HSTL-I, HSTL-II, and LVCMOS. Each bank is independently configurable for voltage and standard, enabling mixed-voltage interfaces with memory, sensors, and SerDes PHYs without level shifters.
Is partial reconfiguration supported on XCVU23P-2VSVA1365E?
Yes, XCVU23P-2VSVA1365E fully supports partial reconfiguration through ICAP and PCIe-based configuration interfaces. This capability allows dynamic logic partition swapping during operation, verified for use cases like multi-standard wireless baseband and adaptive radar waveform generation. XCVU23P-2VSVA1365E requires Vivado 2022.1 or later for PR flow implementation.
What thermal solution is recommended for XCVU23P-2VSVA1365E in continuous operation?
XCVU23P-2VSVA1365E is rated for junction temperatures up to +100°C and is qualified for extended industrial operation. For continuous full-load operation, AMD recommends a 25–35 W thermal solution with forced-air cooling (≥200 LFM) and a 15 mm² copper thermal pad area under the package. Thermal design must account for VCCINT, VCCAUX, and MGTAVCC power domains separately, as specified in UG578.
XCVU23P-2VSVA1365E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1365-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128700
- Number of Logic Elements/Cells:
- 2252250
- Total RAM Bits:
- 77909197
- Number of I/O:
- 364
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1365-FCBGA (35x35)
XCVU23P-2VSVA1365E FAQ
1.How can I place an order for XCVU23P-2VSVA1365E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU23P-2VSVA1365E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU23P-2VSVA1365E reliable?
The price and inventory of XCVU23P-2VSVA1365E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU23P-2VSVA1365E is usually 5 days.
3.What payment methods are accepted for XCVU23P-2VSVA1365E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU23P-2VSVA1365E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU23P-2VSVA1365E?
XCVU23P-2VSVA1365E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU23P-2VSVA1365E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU23P-2VSVA1365E?
For technical support, including XCVU23P-2VSVA1365E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU23P-2VSVA1365E requirements.
6.How does Aetrix verify that XCVU23P-2VSVA1365E is sourced from the original manufacturer or authorized distributors?
All XCVU23P-2VSVA1365E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU23P-2VSVA1365E meets industry standards.
7.What is the process for return or replacement of XCVU23P-2VSVA1365E?
All XCVU23P-2VSVA1365E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU23P-2VSVA1365E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU23P-2VSVA1365E part is unused and in its original packaging.
Return procedure for XCVU23P-2VSVA1365E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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