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AMD XCVU23P-2VSVA1365I
- Part No.:
- XCVU23P-2VSVA1365I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1365-BFBGA, FCBGA
- Datasheet:
-
XCVU23P-2VSVA1365I.pdf
- Description:
- IC FPGA VIRTEX-UP 1365FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,303
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Product details
Overview
XCVU23P-2VSVA1365I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,227,200 logic cells, 14,520 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in radar signal processing and high-throughput data acquisition systems.
For engineers reviewing the XCVU23P-2VSVA1365I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, thermal envelope, and I/O bank voltage support for heterogeneous interface integration.
Technical Context
The XCVU23P-2VSVA1365I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and ultra-low-latency memory interfaces. It integrates 64 DDR4 PHYs supporting up to 2400 MT/s and includes 128 GTY transceivers configurable for protocols including CPRI, JESD204B/C, and 100G KR4.
Its configuration relies on dual-boot capability via Quad-SPI or BPI flash, with AES-256 bitstream encryption and HMAC authentication. The device uses a 1365-pin flip-chip ceramic substrate (FCBGA) package with 800 user I/Os distributed across 32 I/O banks supporting LVDS, SSTL, HSTL, and MIPI standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,227,200 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 14,520 - enables concurrent high-precision filtering, FFT, and matrix operations in real-time signal chains |
| Block RAM | 96.4 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external DRAM latency |
| GTY Transceivers | 128 × 28 Gbps - supports multi-lane serial protocols including JESD204C for ADC/DAC interfacing |
| I/O Banks | 32 - allows independent voltage and standard assignment per bank for mixed-signal interface coexistence |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - validated for deployment in sealed enclosures without active cooling in outdoor infrastructure |
Pinout & Package
Package: 1365-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, ceramic substrate with integrated thermal slug.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe hard IP, and clock management tiles |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8 V per bank; sets output swing and input threshold for connected peripherals |
| MGTAVCC | Transceiver analog supply | 1.0 V supply for GTY transceiver analog circuitry; sensitive to ripple and noise |
| CLK_IN | Dedicated clock input | Accepts differential reference clocks up to 1.2 GHz for PLL/MMCM clock synthesis |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort and ensures compliance with protocol timing and link training requirements |
| 100G Ethernet MAC Hard IP | Offloads MAC-layer processing, enabling deterministic latency for time-sensitive networking applications |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of configured logic functionality |
| UltraScale+ Heterogeneous Integration | Enables co-placement of programmable logic, hardened IP, and memory controllers on single die for system-on-chip consolidation |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions without disrupting active system operation |
Applications
| Radar Beamforming System | 5G Massive MIMO Baseband Unit |
|---|---|
Use Scenario: Real-time adaptive beam steering using thousands of antenna elements with sub-microsecond latency constraints. IC Role / Device Role / Timing Role: FPGA fabric executes phase rotation and weighting algorithms; GTY transceivers interface with RFICs via JESD204C. Use Value: 128 GTY lanes at 28 Gbps enable full-rate IQ data transport from 64+ RFICs without bottlenecks. | Use Scenario: Distributed unit (DU) processing of OFDM symbol generation, channel estimation, and precoding for 256-antenna arrays. IC Role / Device Role / Timing Role: DSP slices perform parallel matrix inversion and FFTs; PCIe Gen4 x16 connects to host CPU for control plane coordination. Use Value: 14,520 DSP slices sustain >2 TeraMAC/s throughput required for real-time 5G NR Layer 1 processing. |
| High-Energy Physics Trigger Processor | AI Accelerator Co-Processor |
Use Scenario: Nanosecond-level coincidence detection and track reconstruction from particle detector sensor streams. IC Role / Device Role / Timing Role: Low-latency logic paths implement custom trigger logic; DDR4 PHYs buffer event data before readout. Use Value: 64 DDR4 PHYs at 2400 MT/s provide 153.6 GB/s aggregate memory bandwidth for burst-mode data capture. | Use Scenario: Offloading sparse tensor operations and quantized inference kernels from host GPU/CPU. IC Role / Device Role / Timing Role: Configurable logic implements custom systolic arrays; GTY transceivers connect to CXL-enabled memory pools. Use Value: Heterogeneous integration allows tight coupling between compute fabric and high-speed memory interfaces, reducing off-chip data movement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSVH2104I | Higher logic density (2,852,000 LC), larger package (2104-pin FCBGA), 160 GTY transceivers | Suitable for systems requiring >2× more DSP resources and additional transceiver lanes for multi-protocol aggregation | Select when XCVU23P-2VSVA1365I resource utilization exceeds 90% in critical paths or when future scalability is required |
| XCVU19P-2FLGA2104I | Fewer logic cells (1,582,000), same 2104-pin package, lower transceiver count (96 GTY) | Better suited for cost-sensitive deployments where PCIe Gen4 and 100G Ethernet are not simultaneously required | Choose when design fits within reduced logic and DSP budget and thermal/power envelope is tighter than XCVU23P-2VSVA1365I |
Compared with XCVU23P-2VSVA1365I, the XCVU29P-2FSVH2104I offers headroom for architectural expansion, while the XCVU19P-2FLGA2104I trades raw capacity for lower power and cost-both require PCB redesign due to different package footprints and thermal solutions.
Availability
XCVU23P-2VSVA1365I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-energy physics instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XCVU23P-2VSVA1365I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family targets high-throughput, low-latency, and thermally constrained systems in defense, communications infrastructure, and scientific instrumentation.
FAQ
What is the maximum supported DDR4 data rate for XCVU23P-2VSVA1365I?
The XCVU23P-2VSVA1365I supports DDR4 interfaces up to 2400 MT/s using its integrated DDR4 PHYs. This rate is validated across all 64 PHY channels under industrial temperature conditions and requires compliant board layout and termination. The XCVU23P-2VSVA1365I datasheet specifies timing margins and calibration procedures for reliable operation at this speed.
Does XCVU23P-2VSVA1365I include hardened PCIe Gen4 IP?
Yes, the XCVU23P-2VSVA1365I integrates a hardened PCIe Gen4 x16 endpoint/root port controller. This IP block handles physical layer signaling, link training, and transaction layer protocol without consuming programmable logic resources. The XCVU23P-2VSVA1365I supports both endpoint and root complex configurations per UG578.
What transceiver protocols are supported by the GTY transceivers in XCVU23P-2VSVA1365I?
The GTY transceivers in XCVU23P-2VSVA1365I support JESD204B/C, CPRI, 100G KR4, IEEE 802.3bj, and PCIe Gen4. Protocol support is implemented via configurable transceiver primitives and associated channel bonding logic. The XCVU23P-2VSVA1365I documentation confirms native encoding and lane alignment for each protocol.
Is XCVU23P-2VSVA1365I qualified for industrial temperature operation?
Yes, the XCVU23P-2VSVA1365I is rated for industrial temperature range (-40°C to +100°C) and undergoes burn-in and characterization across this range. Its thermal design guide specifies junction-to-case resistance and recommended heatsink interface materials. The XCVU23P-2VSVA1365I packaging includes a ceramic substrate with thermal slug for efficient heat dissipation.
How many I/O banks does XCVU23P-2VSVA1365I have, and what standards do they support?
The XCVU23P-2VSVA1365I has 32 user-configurable I/O banks. Each bank supports selectable standards including LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling with programmable drive strength. The XCVU23P-2VSVA1365I allows independent VCCO and VREF per bank for mixed-voltage interface integration.
XCVU23P-2VSVA1365I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1365-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128700
- Number of Logic Elements/Cells:
- 2252250
- Total RAM Bits:
- 77909197
- Number of I/O:
- 364
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1365-FCBGA (35x35)
XCVU23P-2VSVA1365I FAQ
1.How can I place an order for XCVU23P-2VSVA1365I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU23P-2VSVA1365I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU23P-2VSVA1365I reliable?
The price and inventory of XCVU23P-2VSVA1365I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU23P-2VSVA1365I is usually 5 days.
3.What payment methods are accepted for XCVU23P-2VSVA1365I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU23P-2VSVA1365I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU23P-2VSVA1365I?
XCVU23P-2VSVA1365I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU23P-2VSVA1365I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU23P-2VSVA1365I?
For technical support, including XCVU23P-2VSVA1365I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU23P-2VSVA1365I requirements.
6.How does Aetrix verify that XCVU23P-2VSVA1365I is sourced from the original manufacturer or authorized distributors?
All XCVU23P-2VSVA1365I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU23P-2VSVA1365I meets industry standards.
7.What is the process for return or replacement of XCVU23P-2VSVA1365I?
All XCVU23P-2VSVA1365I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU23P-2VSVA1365I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU23P-2VSVA1365I part is unused and in its original packaging.
Return procedure for XCVU23P-2VSVA1365I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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