AMD XCVU23P-3FSVJ1760E

Overview

XCVU23P-3FSVJ1760E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,584K logic cells, 9,024 DSP slices, and 104.5 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in AI acceleration and high-throughput data center compute platforms.

For engineers reviewing the XCVU23P-3FSVJ1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, power delivery requirements, thermal envelope, and configuration interface compatibility with host boot firmware.

Technical Context

The XCVU23P-3FSVJ1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 25G Ethernet MAC, memory controllers), and multi-voltage I/O banks supporting SSTL, HSTL, LVCMOS, and differential standards. It uses 16nm FinFET process technology and supports partial reconfiguration.

Configuration occurs via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are integrated for secure boot. The device includes dedicated clock management tiles with MMCM and PLL resources for low-jitter clock synthesis across multiple domains.

Key Specifications

Pinout & Package

The XCVU23P-3FSVJ1760E is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and power delivery design requires adherence to AMD's recommended PCB stack-up and decoupling layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU23P-3FSVJ1760E, the XCVU29P offers scalability for larger designs but increases PCB complexity and thermal load, while the XCVU13P trades performance for cost and environmental robustness-enabling tiered platform development across data center and edge tiers.

Availability

XCVU23P-3FSVJ1760E is available at Aetrix Electronics and suitable for AI accelerator cards, SmartNIC deployments, and 5G baseband systems requiring stable component supply and long-term production support.

Supply support for XCVU23P-3FSVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, and embedded markets.

The Virtex UltraScale+ family delivers programmable logic and hardened IP for demanding infrastructure applications where throughput, latency, and security are critical design constraints.

FAQ

What is the maximum supported DDR4 data rate for XCVU23P-3FSVJ1760E?

The XCVU23P-3FSVJ1760E supports DDR4-2400 (1200 MHz clock) with the UltraScale+ memory controller. This includes full support for address/command bus training, write leveling, and read/write leveling across all I/O banks assigned to the memory interface. The XCVU23P-3FSVJ1760E achieves this using dedicated PHY logic and calibrated delay elements aligned to system-level timing budgets.

Does XCVU23P-3FSVJ1760E support partial reconfiguration?

Yes, the XCVU23P-3FSVJ1760E fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. The XCVU23P-3FSVJ1760E implements frame-based reconfiguration with CRC protection and secure update mechanisms to ensure reliability during runtime updates.

What transceiver protocols are natively supported by XCVU23P-3FSVJ1760E?

The XCVU23P-3FSVJ1760E includes hardened transceiver blocks supporting PCIe Gen4, 25G Ethernet (IEEE 802.3by), CPRI, and JESD204B/C. These protocols are implemented in silicon with dedicated encoding/decoding, gearbox, and clock data recovery logic. The XCVU23P-3FSVJ1760E does not require external PHYs for these standards, reducing board area and power consumption.

What is the operating temperature range for XCVU23P-3FSVJ1760E?

The XCVU23P-3FSVJ1760E is rated for commercial temperature operation (0°C to +85°C ambient). Its thermal design requires active cooling in high-utilization configurations due to power dissipation up to 55W under worst-case switching activity. The XCVU23P-3FSVJ1760E includes on-die temperature sensors and thermal shutdown protection to prevent damage during transient overload conditions.

How is configuration security implemented in XCVU23P-3FSVJ1760E?

Configuration security in the XCVU23P-3FSVJ1760E uses AES-256 bitstream encryption and HMAC-SHA256 authentication. Keys are stored in eFUSE or external secure storage, and decryption occurs on-die before loading into configuration memory. The XCVU23P-3FSVJ1760E enforces secure boot flow with tamper detection and prevents fallback to unauthenticated bitstreams.