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AMD XCVU23P-L2FSVJ1760E
- Part No.:
- XCVU23P-L2FSVJ1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCVU23P-L2FSVJ1760E.pdf
- Description:
- IC FPGA VIRTEX-UP LP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,172
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Product details
Overview
XCVU23P-L2FSVJ1760E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,548,000 logic cells, 9,024 DSP slices, and 116.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and radar signal processing.
For engineers reviewing the XCVU23P-L2FSVJ1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, memory bandwidth, and thermal envelope for air-cooled accelerator cards.
Technical Context
The XCVU23P-L2FSVJ1760E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ interconnect, and integrated hard IP including PCIe Gen4 root port, 100G Ethernet MAC, and DDR4/DDR5 memory controllers. It supports partial reconfiguration and real-time system monitoring via on-chip sensors.
Its -2L speed grade guarantees operation at 800 MHz for I/O and 550 MHz for internal logic under industrial temperature conditions (–40°C to +100°C junction), with power delivery optimized for 0.85 V core voltage and dual-rail I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum concurrent parallel logic functions and RTL complexity capacity |
| DSP Slices | 9,024 - enables high-throughput fixed/floating-point computation for AI inference or beamforming |
| Block RAM | 116.5 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 64 × 25.8 Gb/s - supports 100G/200G/400G Ethernet, CPRI, and JESD204C interfaces |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host CPU co-processing |
| Memory Support | DDR4-2400 / DDR5-4800 - enables direct connection to high-speed system memory with sub-100ns latency |
Pinout & Package
The XCVU23P-L2FSVJ1760E is housed in a 1760-pin Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in air-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | Supplies 0.85 V to programmable logic and routing fabric; requires low-noise regulation |
| VCCAUX | Auxiliary Power | Provides 1.8 V to configuration logic, PCIe hard IP, and transceiver reference circuits |
| MGTAVCC | Transceiver Analog Supply | Delivers 0.92 V to GTY analog circuitry; critical for jitter performance below 300 fs RMS |
| CLK_IN | Dedicated Clock Input | Accepts differential 100 MHz–750 MHz reference clocks for PLL/MMCM clock synthesis |
| PCIE_RX/TX | PCIe Differential Pair | Hardened Gen4 lanes supporting x1/x2/x4/x8/x16 configurations with automatic equalization |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset, reducing system downtime in mission-critical infrastructure |
| UltraScale+ Interconnect | Reduces routing congestion by up to 40% vs. 7-series FPGAs, improving timing closure for large designs |
| On-Chip Monitoring | Real-time die temperature, supply voltage, and current sensing with ±2°C accuracy for thermal management |
| Hardened 100G Ethernet MAC | Offloads 100Gbps packet processing from CPU, enabling line-rate forwarding in network appliances |
Applications
| Data Center Acceleration | Radar Signal Processing |
|---|---|
Use Scenario: Real-time AI inference acceleration for LLM token generation in cloud servers. IC Role / Device Role / Timing Role: Programmable compute fabric executing custom matrix multiplication kernels with deterministic latency. Use Value: 9,024 DSP slices deliver >100 TOPS INT8 throughput while maintaining sub-millisecond response time. | Use Scenario: Digital beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-speed signal correlator and FFT engine synchronizing to 100 MHz system clock with <1 ns jitter. Use Value: 64 GTY transceivers interface directly to ADC/DAC arrays at 25.8 Gb/s, eliminating external serializer/deserializer chips. |
| 5G Baseband Unit | High-Frequency Trading |
Use Scenario: Layer 1 PHY processing for massive MIMO in Open RAN distributed units (DU). IC Role / Device Role / Timing Role: Hardened 100G Ethernet MAC and JESD204C receiver handling fronthaul traffic and RF sample streams. Use Value: Integrated PCIe Gen4 x16 enables direct attachment to server CPUs, reducing protocol translation latency by >300 ns. | Use Scenario: Ultra-low-latency order matching and risk calculation in exchange co-location racks. IC Role / Device Role / Timing Role: Deterministic logic fabric executing custom trading algorithms with cycle-accurate timing control. Use Value: -2L speed grade ensures 550 MHz internal logic operation at 100°C junction, sustaining 50 ns end-to-end pipeline latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-L2FSVH2104E | Higher logic density (1,889,000 cells), larger 2104-pin package, higher power consumption | Better suited for multi-protocol 400G line cards requiring additional SerDes lanes | Select when design requires >128 GTY transceivers or >150 Mb block RAM |
| XCVU13P-L2FSVB2104E | Lower logic count (985,000 cells), same 2104-pin package, reduced GTY count (48 lanes) | Targeted at cost-sensitive 100G optical transport where full XCVU23P capacity is unused | Choose when PCIe Gen4 x8 and 48 GTY lanes meet bandwidth requirements |
Compared with XCVU23P-L2FSVJ1760E, the XCVU29P offers greater scalability for future-proofing but increases thermal load, while the XCVU13P reduces BOM cost and cooling demands at the expense of DSP and transceiver headroom.
Availability
XCVU23P-L2FSVJ1760E is available at Aetrix Electronics and suitable for data center acceleration, radar signal processing, and 5G baseband unit development requiring stable component supply across multi-year production cycles.
Supply support for XCVU23P-L2FSVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, and high-performance embedded systems.
The Virtex UltraScale+ family targets compute-intensive infrastructure applications demanding high logic density, hardened I/O, and deterministic real-time performance - exemplified by the XCVU23P-L2FSVJ1760E.
FAQ
What is the maximum operating junction temperature for XCVU23P-L2FSVJ1760E?
The XCVU23P-L2FSVJ1760E is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated under the -2L speed grade and applies to continuous operation when thermal management meets AMD's recommended airflow and heatsink specifications per UG578.
Does XCVU23P-L2FSVJ1760E support PCIe Gen5?
No, the XCVU23P-L2FSVJ1760E integrates hardened PCIe Gen4 x16 endpoints only. It does not support Gen5 signaling or associated electrical specifications. Designs requiring PCIe Gen5 must use AMD Versal HBM or newer Virtex UltraScale+ variants explicitly qualified for Gen5.
What DDR memory standards are supported by XCVU23P-L2FSVJ1760E?
The XCVU23P-L2FSVJ1760E supports DDR4-2400 and DDR5-4800 memory interfaces through dedicated hard memory controllers. These controllers implement JEDEC-compliant timing, calibration, and error correction, enabling direct connection without external PHYs.
Is partial reconfiguration supported on XCVU23P-L2FSVJ1760E?
Yes, the XCVU23P-L2FSVJ1760E fully supports partial reconfiguration using Vivado Design Suite. This capability allows dynamic loading of logic modules into designated regions without resetting the entire device, preserving state in active subsystems during runtime updates.
What is the ball pitch of the XCVU23P-L2FSVJ1760E package?
The XCVU23P-L2FSVJ1760E uses a 1760-pin Flip-Chip BGA package with a 1.0 mm ball pitch. This pitch enables high I/O density while maintaining manufacturability with standard PCB fabrication tolerances and automated optical inspection.
XCVU23P-L2FSVJ1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128700
- Number of Logic Elements/Cells:
- 2252250
- Total RAM Bits:
- 77909197
- Number of I/O:
- 644
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCVU23P-L2FSVJ1760E FAQ
1.How can I place an order for XCVU23P-L2FSVJ1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU23P-L2FSVJ1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU23P-L2FSVJ1760E reliable?
The price and inventory of XCVU23P-L2FSVJ1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU23P-L2FSVJ1760E is usually 5 days.
3.What payment methods are accepted for XCVU23P-L2FSVJ1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU23P-L2FSVJ1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU23P-L2FSVJ1760E?
XCVU23P-L2FSVJ1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU23P-L2FSVJ1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU23P-L2FSVJ1760E?
For technical support, including XCVU23P-L2FSVJ1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU23P-L2FSVJ1760E requirements.
6.How does Aetrix verify that XCVU23P-L2FSVJ1760E is sourced from the original manufacturer or authorized distributors?
All XCVU23P-L2FSVJ1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU23P-L2FSVJ1760E meets industry standards.
7.What is the process for return or replacement of XCVU23P-L2FSVJ1760E?
All XCVU23P-L2FSVJ1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU23P-L2FSVJ1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU23P-L2FSVJ1760E part is unused and in its original packaging.
Return procedure for XCVU23P-L2FSVJ1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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