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AMD XCVU23P-L2VSVA1365E
- Part No.:
- XCVU23P-L2VSVA1365E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1365-BFBGA, FCBGA
- Datasheet:
-
XCVU23P-L2VSVA1365E.pdf
- Description:
- IC FPGA VIRTEX-UP LP 1365FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,790
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Product details
Overview
XCVU23P-L2VSVA1365E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,476,900 logic cells, 8,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G baseband processing.
For engineers reviewing the XCVU23P-L2VSVA1365E datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (0.35–1.8 V), thermal design power (TDP) of 75 W, transceiver lane count (64 GTY), and package-specific routing constraints for the 1365-pin Flip-Chip BGA (FVBGA).
Technical Context
The XCVU23P-L2VSVA1365E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated hard IP including 100G Ethernet MACs and 100G Interlaken cores. Its configuration uses dual-boot secure bitstream with AES-256 and SHA-256 authentication.
It supports partial reconfiguration and dynamic function exchange (DFX), enabling runtime hardware updates without system reset. The device operates across -40°C to +100°C junction temperature range and complies with JESD204B/C interface timing for high-speed ADC/DAC interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,476,900 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 8,520 - enables parallel fixed/floating-point computation for radar, beamforming, and ML inference |
| Block RAM | 72.5 Mb - supports large on-chip buffering for video frame stores, packet queues, or coefficient tables |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - provides native 100G Ethernet, CPRI/eCPRI, and optical interconnect capability |
| I/O Standards | Supports LVDS, MIPI D-PHY, SSTL, HSTL, and differential signaling up to 1.8 V - enables direct interface to image sensors, memory, and FMC mezzanine cards |
| TDP | 75 W - defines thermal envelope requiring active cooling and PCB copper pour planning |
| Package | FVBGA-1365 - 35 mm × 35 mm footprint with 1.0 mm ball pitch, requiring 10-layer minimum PCB stack-up |
Pinout & Package
The XCVU23P-L2VSVA1365E is housed in a 1365-ball Flip-Chip Very-thin Fine-pitch Ball Grid Array (FVBGA) package with 1.0 mm ball pitch and 35 mm × 35 mm body size. Thermal and power integrity require dedicated VCCINT/VCCAUX/VCCO planes and thermal vias under the die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as SDIO, UART, SPI, or GPIO; shared with PS peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| GTY_RXN/P[0:63] | Differential transceiver input | Accepts AC-coupled high-speed serial data; requires precise trace length matching and impedance control (85 Ω differential) |
| GTY_TXN/P[0:63] | Differential transceiver output | Drives 25.8 Gb/s serial streams; mandates pre-emphasis and receiver equalization tuning per channel |
| VCCINT | Core supply | 0.85 V ±3% supply for logic fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration logic, clocking, and transceiver analog circuitry |
| CONFIG_DONE | Configuration status | Open-drain output indicating successful bitstream loading; used for system boot sequencing and FPGA readiness handshake |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and timing closure risk for telecom infrastructure designs |
| PCIe Gen4 x16 Root Port | Enables direct host CPU co-processing without bridge chips, lowering latency in AI training accelerators |
| Secure Boot with AES-256 | Prevents unauthorized firmware execution and protects intellectual property in deployed edge devices |
| Partial Reconfiguration Support | Allows dynamic hardware function swapping-e.g., switching between radar waveform generators-without full system reboot |
| UltraScale+ Memory Controller | Native DDR4-2400 and LPDDR4-4266 support eliminates external PHY, simplifying memory subsystem layout |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with high-speed ADCs/DACs. Use Value: 8,520 DSP slices enable concurrent multi-beam processing; 25.8 Gb/s transceivers sustain 12-bit @ 4 GSPS ADC links. | Use Scenario: Digital front-end (DFE) and layer-1 processing in 5G NR macro base stations. IC Role / Device Role / Timing Role: Implements numerology-aware OFDM modulation/demodulation, channel estimation, and precoding in real time. Use Value: Hardened 100G Ethernet MAC handles fronthaul traffic; PCIe Gen4 x16 connects to server-class CPUs for L2/L3 offload. |
| AI Inference Acceleration | High-Speed Test Equipment |
Use Scenario: Low-latency inferencing for vision-based industrial inspection using custom CNN models. IC Role / Device Role / Timing Role: Configurable logic implements quantized convolution pipelines; block RAM stores weights and activation buffers. Use Value: 72.5 Mb block RAM accommodates >10M parameter models; partial reconfiguration allows model hot-swapping. | Use Scenario: Bit-error-rate testing (BERT) and protocol validation in 100G/400G optical transceiver modules. IC Role / Device Role / Timing Role: Generates and analyzes PRBS patterns at 25.8 Gb/s; synchronizes multiple test channels via deterministic clocking. Use Value: GTY transceivers provide built-in pattern generators/checkers; TDP of 75 W fits within rack-mounted instrument thermal limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-L2VSVA2104E | Higher logic density (1,889,000 LCs), 96 GTY lanes, 100 W TDP, larger 2104-ball FVBGA package | Better suited for multi-100G line cards and full-stack AI training clusters requiring more parallel compute resources | Select when >1.5M logic cells or >80 GTY lanes are required; verify PCB redesign for 2104-ball footprint and thermal management |
| XCVU13P-L2FSVA1152E | Lower logic count (942,000 LCs), 48 GTY lanes, 55 W TDP, 1152-ball FCBGA package | Targeted at cost-sensitive 5G small cells and embedded vision where full XCVU23P capacity is unused | Choose for reduced BOM cost and simpler thermal design; confirm GTY lane count suffices for target serial interface bandwidth |
Compared with XCVU23P-L2VSVA1365E, the XCVU29P offers higher scalability at increased power and board area cost, while the XCVU13P delivers targeted functionality with lower thermal and layout complexity-enabling tiered platform development across performance bands.
Availability
XCVU23P-L2VSVA1365E is available at Aetrix Electronics and suitable for AI accelerator development, 5G infrastructure deployment, and defense-grade radar systems requiring stable component supply and long-term program support.
Supply support for XCVU23P-L2VSVA1365E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family targets high-throughput, low-latency signal processing in mission-critical infrastructure where deterministic timing, security, and I/O flexibility are essential.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU23P-L2VSVA1365E?
The XCVU23P-L2VSVA1365E supports GTY transceivers operating at up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204C. Performance depends on PCB interconnect quality, reference clock jitter (< 500 fs RMS), and proper equalization settings configured via Vivado tools. The XCVU23P-L2VSVA1365E does not support rates beyond 25.8 Gb/s in production silicon.
Does the XCVU23P-L2VSVA1365E support partial reconfiguration?
Yes, the XCVU23P-L2VSVA1365E fully supports partial reconfiguration (PR) through the Vivado Design Suite. This capability allows dynamic replacement of logical partitions without resetting the entire device. The XCVU23P-L2VSVA1365E implements PR using frame-based bitstream updates and includes dedicated configuration logic to ensure safe, glitch-free transitions during runtime. PR is commonly used in radar and communications systems for waveform agility.
What I/O standards are supported by the XCVU23P-L2VSVA1365E banks?
The XCVU23P-L2VSVA1365E supports LVDS, MIPI D-PHY, SSTL-12/15/18, HSTL-I/II, and differential signaling standards across its 32 I/O banks. Each bank is independently configurable for voltage levels from 0.35 V to 1.8 V. The XCVU23P-L2VSVA1365E does not support RSDS or BLVDS. Compatibility with specific standards depends on bank type (HR vs. HP) and VCCO setting, as defined in UG571.
Is the XCVU23P-L2VSVA1365E qualified for automotive applications?
No, the XCVU23P-L2VSVA1365E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for industrial temperature range (–40°C to +100°C junction) and used in aerospace, defense, and telecom infrastructure. For automotive use, AMD offers the XCVU13P-2LFSVA1152I variant with extended temperature screening and qualification documentation.
What configuration modes does the XCVU23P-L2VSVA1365E support?
The XCVU23P-L2VSVA1365E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. It also enables dual-boot secure configuration using AES-256 encrypted bitstreams stored in external QSPI flash. Configuration startup time is typically 120 ms from power-on to CONFIG_DONE assertion. The XCVU23P-L2VSVA1365E does not support iCAP or ICAP-only modes without external controller assistance.
XCVU23P-L2VSVA1365E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1365-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128700
- Number of Logic Elements/Cells:
- 2252250
- Total RAM Bits:
- 77909197
- Number of I/O:
- 364
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1365-FCBGA (35x35)
XCVU23P-L2VSVA1365E FAQ
1.How can I place an order for XCVU23P-L2VSVA1365E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU23P-L2VSVA1365E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU23P-L2VSVA1365E reliable?
The price and inventory of XCVU23P-L2VSVA1365E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU23P-L2VSVA1365E is usually 5 days.
3.What payment methods are accepted for XCVU23P-L2VSVA1365E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU23P-L2VSVA1365E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU23P-L2VSVA1365E?
XCVU23P-L2VSVA1365E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU23P-L2VSVA1365E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU23P-L2VSVA1365E?
For technical support, including XCVU23P-L2VSVA1365E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU23P-L2VSVA1365E requirements.
6.How does Aetrix verify that XCVU23P-L2VSVA1365E is sourced from the original manufacturer or authorized distributors?
All XCVU23P-L2VSVA1365E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU23P-L2VSVA1365E meets industry standards.
7.What is the process for return or replacement of XCVU23P-L2VSVA1365E?
All XCVU23P-L2VSVA1365E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU23P-L2VSVA1365E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU23P-L2VSVA1365E part is unused and in its original packaging.
Return procedure for XCVU23P-L2VSVA1365E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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