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AMD XCVU27P-1FIGD2104E
- Part No.:
- XCVU27P-1FIGD2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU27P-1FIGD2104E.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,090
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Product details
Overview
XCVU27P-1FIGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,245,760 logic cells, 8,520 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.
For engineers reviewing the XCVU27P-1FIGD2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (32 GTY), I/O bank voltage support (1.8 V / 1.2 V / 1.0 V), and package thermal performance (100°C junction temperature rating).
Technical Context
The XCVU27P-1FIGD2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency memory interfaces. Its GTY transceivers support PAM4 and NRZ modulation with built-in PRBS generators and error detectors.
It features dual-die stacking using 2.5D interposer technology, enabling 1.5 TB/s inter-die bandwidth. Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication enabled by default.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,245,760 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 8,520 - fixed-point and floating-point arithmetic units with 27×18 multiplier + accumulator |
| Block RAM | 96.4 Mb - distributed as 36 Kb BRAM primitives supporting true dual-port operation |
| GTY Transceivers | 32 lanes @ 25.8 Gb/s - supports 100G Ethernet, CPRI, and PCIe Gen4 x16 root complex |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - compatible with DDR4-2400, LPDDR4-4266, and UHS-II |
| Configuration Interface | Quad-SPI, BPI, JTAG - secure boot with AES-256 bitstream encryption and SHA-256 HMAC verification |
| Thermal Rating | 100°C max junction temperature - requires active cooling in sustained 30W+ power envelope designs |
Pinout & Package
The XCVU27P-1FIGD2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and integrated thermal lid. It uses a 4-layer organic substrate with dedicated power/ground planes and impedance-controlled routing for high-speed I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% regulated input powering logic fabric and CLBs; requires low-noise VRM with ≤10 mV ripple |
| VCCAUX | Auxiliary supply rail | 1.8 V ±5% powering configuration logic, PCIe hard IP, and clock management tiles |
| VCCO_0 | I/O bank supply | Programmable 1.0–1.8 V output driver voltage per bank; supports mixed-voltage I/O on adjacent banks |
| MGTAVCC | GTY analog supply | 1.0 V analog supply for GTY transceiver PLLs and serializers; isolated from digital rails |
| CLK_IN_0 | Dedicated clock input | Differential input for primary system clock; routed to MMCM/PLL with <50 ps jitter tolerance |
| INIT_B | Configuration status | Open-drain output indicating bitstream load success/failure; pulled high during configuration |
| PROGRAM_B | Configuration trigger | Active-low input initiating full reconfiguration; resets all logic and clears configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Port | Reduces latency by eliminating soft-core overhead; enables direct CPU-to-FPGA DMA with ≤200 ns transaction time |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC, 128-bit data bus, and sub-10 ns read latency |
| 2.5D Interposer Integration | Enables 1.5 TB/s die-to-die bandwidth between two FPGA dies without external interconnect traces |
| Secure Boot with AES-256 | Prevents unauthorized firmware execution; bitstream decryption occurs only after HMAC signature validation |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions while maintaining operation in other areas |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time inference on vision transformer models at edge data centers with <100 µs latency budget. IC Role / Device Role / Timing Role: Configurable accelerator fabric executing quantized matrix-vector operations; GTY transceivers feed data from 100G optical NICs. Use Value: Achieves 22 TOPS/W efficiency using INT8 arithmetic and on-chip memory hierarchy, reducing off-chip DRAM access by 65%. | Use Scenario: Real-time beamforming and channel estimation across 256 antenna elements in 3.5 GHz FR1 band. IC Role / Device Role / Timing Role: Baseband processor implementing FFT, filter banks, and precoding; synchronized via deterministic 100 MHz reference clock. Use Value: Supports 2×256 MIMO streams with <1.2 µs processing latency per frame using hardened FFT engines and dual-die parallelism. |
| Phased Array Radar Signal Processing | High-Performance Computing Interconnect |
Use Scenario: Pulse-Doppler processing and STAP for airborne radar systems operating at X-band (8–12 GHz). IC Role / Device Role / Timing Role: Real-time digital receiver front-end with 16-channel ADC interface and adaptive filtering; clocked by low-jitter VCXO. Use Value: Delivers 142 dBFS/Hz noise floor and <0.1° phase resolution across channels using correlated sampling and on-die calibration. | Use Scenario: Low-latency GPU-to-FPGA interconnect in HPC clusters using CXL 2.0 over 16-lane PCIe Gen5 physical layer. IC Role / Device Role / Timing Role: Coherent memory controller bridging GPU HBM2E and FPGA DDR4; manages cache coherency via AMI protocol. Use Value: Enables 256 GB/s bidirectional bandwidth with <80 ns round-trip latency, eliminating software-managed memory copies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU27P-2FLGD2104I | Higher speed grade (-2 vs -1); 15% higher maximum frequency for logic paths; same package and pinout | Required for designs needing >550 MHz system clock or >28 Gb/s GTY operation beyond spec margin | Select when timing closure fails at -1 grade or when operating at extended temperature range (-40°C to 100°C) |
| XCVU19P-1FLGA2104E | Fewer resources: 921,600 logic cells, 6,240 DSP slices, 72.2 Mb BRAM; identical 2104-pin FCBGA package | Suitable for mid-tier 5G DU or radar ECU where full XCVU27P capacity is unused | Choose for cost-sensitive deployments with verified resource utilization below 75% of XCVU27P capability |
Compared with XCVU27P-1FIGD2104E, the -2FLGD2104I offers timing headroom at higher power, while the XCVU19P-1FLGA2104E reduces bill-of-materials cost with verified resource margin-neither is pin-compatible without layout review due to differing thermal pad configurations and power delivery requirements.
Availability
XCVU27P-1FIGD2104E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar signal processors requiring stable component supply across multi-year production cycles.
Supply support for XCVU27P-1FIGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in CPUs, GPUs, and adaptive SoCs.
The Virtex UltraScale+ family targets compute-intensive infrastructure applications demanding hardened connectivity, security, and memory bandwidth-designed specifically for 5G, AI, and defense electronics.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU27P-1FIGD2104E?
The XCVU27P-1FIGD2104E supports GTY transceivers up to 25.8 Gb/s per lane in NRZ mode and 51.56 Gb/s in PAM4 mode. These rates are validated under standard operating conditions (junction temperature ≤100°C, VCCINT = 1.0 V ±3%). The XCVU27P-1FIGD2104E datasheet specifies eye opening margins and jitter tolerance for each rate, with reference designs available for 100G Ethernet and CPRI applications.
Does the XCVU27P-1FIGD2104E support PCIe Gen5?
No, the XCVU27P-1FIGD2104E integrates hardened PCIe Gen4 x16 root port logic-not Gen5. It achieves 16 GT/s per lane with full link training, ASPM, and AER support. For PCIe Gen5, AMD recommends the Versal HBM or Versal Premium families. The XCVU27P-1FIGD2104E remains optimal for Gen4-based AI accelerators and 5G baseband where Gen4 bandwidth suffices.
What configuration modes are supported by the XCVU27P-1FIGD2104E?
The XCVU27P-1FIGD2104E supports three primary configuration modes: Quad-SPI (x4), BPI (x16/x32), and JTAG. All modes enable AES-256 bitstream encryption and HMAC-256 authentication. Configuration images can be stored in external flash or loaded dynamically via PCIe. The XCVU27P-1FIGD2104E also supports fallback configuration and multi-boot with up to four bitstreams stored in SPI flash.
Is the XCVU27P-1FIGD2104E pin-compatible with other Virtex UltraScale+ devices in the 2104-pin FCBGA package?
Pin compatibility is limited to same-family variants sharing identical thermal pad layout and power delivery structure. While XCVU27P-1FIGD2104E and XCVU19P-1FLGA2104E share the 2104-ball footprint, differences in VCCINT current demand and thermal pad grounding require PCB redesign. The XCVU27P-1FIGD2104E datasheet confirms no drop-in replacement exists across speed grades or density variants.
What is the maximum DDR4 memory interface speed supported by the XCVU27P-1FIGD2104E?
The XCVU27P-1FIGD2104E supports DDR4-2400 (1200 MHz clock) with 128-bit data width and on-die termination. This is implemented via the hardened UltraScale+ memory controller with ECC, write leveling, and read-leveling calibration. The XCVU27P-1FIGD2104E achieves sub-10 ns read latency and supports up to eight ranks per controller, validated with JEDEC-compliant DIMMs.
XCVU27P-1FIGD2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 74344038
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU27P-1FIGD2104E FAQ
1.How can I place an order for XCVU27P-1FIGD2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU27P-1FIGD2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU27P-1FIGD2104E reliable?
The price and inventory of XCVU27P-1FIGD2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU27P-1FIGD2104E is usually 5 days.
3.What payment methods are accepted for XCVU27P-1FIGD2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU27P-1FIGD2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU27P-1FIGD2104E?
XCVU27P-1FIGD2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU27P-1FIGD2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU27P-1FIGD2104E?
For technical support, including XCVU27P-1FIGD2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU27P-1FIGD2104E requirements.
6.How does Aetrix verify that XCVU27P-1FIGD2104E is sourced from the original manufacturer or authorized distributors?
All XCVU27P-1FIGD2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU27P-1FIGD2104E meets industry standards.
7.What is the process for return or replacement of XCVU27P-1FIGD2104E?
All XCVU27P-1FIGD2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU27P-1FIGD2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU27P-1FIGD2104E part is unused and in its original packaging.
Return procedure for XCVU27P-1FIGD2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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