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AMD XCVU27P-2FSGA2577E
- Part No.:
- XCVU27P-2FSGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU27P-2FSGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,682
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Product details
Overview
XCVU27P-2FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,240K logic cells, 96.4 Mb of block RAM, 8,520 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 28.3 Gb/s transceivers. It targets AI acceleration, high-end networking, and radar signal processing in data center and defense systems.
For engineers reviewing the XCVU27P-2FSGA2577E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory bandwidth, DSP throughput, and thermal envelope under sustained compute load.
Technical Context
The XCVU27P-2FSGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency interconnect. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.
Its 28.3 Gb/s GTY transceivers comply with IEEE 802.3bj/802.3by and support PAM4 encoding; the device integrates 128 100G Ethernet channels via integrated MACs and FEC engines, and delivers 12.8 TB/s aggregate on-chip memory bandwidth using UltraRAM and BRAM primitives.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,240,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| Block RAM | 96.4 Mb - provides low-latency, deterministic on-die memory for buffering and lookup tables |
| DSP Slices | 8,520 - enables parallel fixed/floating-point computation for AI inference kernels |
| Transceiver Max Rate | 28.3 Gb/s - supports 100G/200G/400G Ethernet and CPRI/eCPRI over single lanes |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host-FPGA co-processing |
| DDR4 Support | DDR4-2400 - enables 19.2 GB/s peak memory bandwidth per 64-bit interface |
| Package | FSGA2577 - 2577-ball flip-chip BGA, 40 × 40 mm, 0.8 mm pitch, thermal lid |
Pinout & Package
FSGA2577 is a thermally enhanced flip-chip BGA package with 2577 I/O balls arranged in a 40 × 40 mm array, 0.8 mm pitch, and integrated heat spreader. Pin functions are defined per AMD UG579 v1.15 and include dedicated configuration, JTAG, power, ground, high-speed transceiver banks (GTY), and programmable I/O banks supporting LVDS, SSTL, HSTL, and MIPI.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O bank | Configurable as GPIO, SDIO, UART, SPI, or CAN controller interfaces |
| GTY_TXN/GTY_TXP | Differential transceiver output | Drives 28.3 Gb/s serial lanes with programmable pre-emphasis and equalization |
| GTY_RXN/GTY_RXP | Differential transceiver input | Receives 28.3 Gb/s serial lanes with adaptive CDR and DFE equalization |
| HP[0:71] | High-performance I/O bank | Supports DDR4-2400, LPDDR4-4267, and QDR-IV at up to 1.2 V |
| VCCINT/VCCAUX/VCCO | Power supply rails | Three independent voltage domains: 0.85 V core, 1.8 V auxiliary, and bank-selectable I/O (1.2–1.8 V) |
| PROGRAM_B/INIT_B/DONE | Configuration control | Controls bitstream loading sequence, status reporting, and configuration completion handshake |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute fabric | Combines programmable logic, hardened PCIe Gen4, 100G Ethernet MAC, and DDR4 PHY for system-level integration |
| UltraScale+ architecture | Enables 2× higher logic density and 30% lower power vs. prior Virtex-7 generation at same performance |
| Partial reconfiguration | Allows dynamic swapping of logic partitions without resetting entire device or halting I/O operation |
| 28.3 Gb/s GTY transceivers | Supports PAM4 and NRZ signaling for 400G Ethernet and optical transport applications |
| Integrated UltraRAM | Provides 288 Mb of distributed, low-power, single-port RAM with <1 ns access time |
Applications
| AI Inference Acceleration | 5G Baseband Processing |
|---|---|
Use Scenario: Real-time deep learning inference on streaming video or sensor data in edge servers. IC Role / Device Role / Timing Role: Programmable accelerator executing custom CNN/RNN kernels with deterministic latency. Use Value: Delivers >12 TOPS/W efficiency using 8,520 DSP slices and on-chip UltraRAM for weight caching. | Use Scenario: Massive MIMO precoding and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: Real-time baseband processor handling 100+ antenna streams with sub-100 ns timing closure. Use Value: Achieves 12.8 TB/s on-chip memory bandwidth and 28.3 Gb/s transceiver links to Fronthaul interfaces. |
| Radar Signal Processing | Data Center SmartNIC Offload |
Use Scenario: Pulse-Doppler and beamforming processing in AESA radar systems. IC Role / Device Role / Timing Role: High-throughput digital signal processor implementing FFT, CFAR, and STAP algorithms. Use Value: Leverages 1,240K logic cells and 96.4 Mb block RAM for multi-channel real-time FFT pipelines. | Use Scenario: TLS encryption, packet classification, and RDMA acceleration in cloud server NICs. IC Role / Device Role / Timing Role: Co-processor tightly coupled to CPU via PCIe Gen4 x16 with hardware-enforced isolation. Use Value: Reduces host CPU load by offloading 400 Gbps encrypted traffic using hardened crypto engines and DMA controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSGD2104E | Higher logic count (1,450K LC), larger FSGD2104 package (2104-ball), no thermal lid | Better suited for ultra-wide datapaths requiring >1.3M LC; less suitable for thermal-constrained 40×40 mm modules | Select when additional logic and DSP resources outweigh thermal and board space constraints |
| XCVU19P-2FSGD2104E | Lower logic count (920K LC), same FSGD2104 package, reduced GTY count (48 vs. 64) | Targeted at cost-optimized 100G/200G systems where full XCVU27P transceiver density is unnecessary | Select when PCIe Gen4 x8 and 48 GTY lanes meet bandwidth requirements and BOM cost is critical |
Compared with XCVU29P-2FSGD2104E and XCVU19P-2FSGD2104E, the XCVU27P-2FSGA2577E uniquely balances 1,240K logic cells, 64 GTY transceivers, and thermal-lid packaging in a 40×40 mm footprint-making it optimal for SWaP-constrained AI and radar platforms requiring Gen4 PCIe and 28.3 Gb/s serial I/O.
Availability
XCVU27P-2FSGA2577E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G baseband processing, and radar signal processing requiring stable component supply across long-life industrial and defense programs.
Supply support for XCVU27P-2FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, embedded, and client markets.
The Virtex UltraScale+ family delivers FPGA-based adaptive compute platforms targeting AI acceleration, 5G infrastructure, and real-time signal processing with hardened interfaces and scalable logic resources.
FAQ
What is the maximum supported transceiver data rate for XCVU27P-2FSGA2577E?
The XCVU27P-2FSGA2577E supports a maximum transceiver data rate of 28.3 Gb/s using its GTY transceivers. This rate enables compliance with IEEE 802.3bj/802.3by for 100G/200G/400G Ethernet and supports both NRZ and PAM4 modulation schemes in production configurations per AMD UG578 v1.14.
Does XCVU27P-2FSGA2577E support PCIe Gen4 x16 root complex functionality?
Yes, the XCVU27P-2FSGA2577E integrates a hardened PCIe Gen4 x16 root complex block compliant with PCI Express Base Specification Revision 4.0. It supports link training, ASPM, AER, and MSI-X, and delivers 32 GB/s bidirectional bandwidth when configured as a host-facing endpoint in data center accelerator designs.
What memory interfaces does XCVU27P-2FSGA2577E natively support?
The XCVU27P-2FSGA2577E natively supports DDR4-2400 (up to 64-bit), LPDDR4-4267, and QDR-IV SRAM interfaces through dedicated hard PHYs. These are implemented in HP I/O banks with programmable drive strength, on-die termination, and calibrated delay chains for timing closure at full speed.
Is partial reconfiguration supported on XCVU27P-2FSGA2577E?
Yes, XCVU27P-2FSGA2577E fully supports partial reconfiguration as defined in AMD UG909 v2023.2. It allows dynamic swapping of logical partitions while maintaining active I/O, clocking, and configuration state-enabling runtime adaptation in radar, networking, and AI workloads without system reset.
What is the thermal design power (TDP) range for XCVU27P-2FSGA2577E under typical operating conditions?
The XCVU27P-2FSGA2577E has a specified thermal design power range of 45–75 W depending on configuration, clock frequency, and I/O activity. Its FSGA2577 package includes an integrated heat spreader and is validated for use with standard 40×40 mm heatsinks per AMD AR70217 and UG579 v1.15 thermal guidelines.
XCVU27P-2FSGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 74344038
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU27P-2FSGA2577E FAQ
1.How can I place an order for XCVU27P-2FSGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU27P-2FSGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU27P-2FSGA2577E reliable?
The price and inventory of XCVU27P-2FSGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU27P-2FSGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU27P-2FSGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU27P-2FSGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU27P-2FSGA2577E?
XCVU27P-2FSGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU27P-2FSGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU27P-2FSGA2577E?
For technical support, including XCVU27P-2FSGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU27P-2FSGA2577E requirements.
6.How does Aetrix verify that XCVU27P-2FSGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU27P-2FSGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU27P-2FSGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU27P-2FSGA2577E?
All XCVU27P-2FSGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU27P-2FSGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU27P-2FSGA2577E part is unused and in its original packaging.
Return procedure for XCVU27P-2FSGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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