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AMD XCVU27P-3FIGD2104E
- Part No.:
- XCVU27P-3FIGD2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU27P-3FIGD2104E.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,393
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Product details
Overview
XCVU27P-3FIGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,584,000 logic cells, 9,024 DSP slices, and 116.5 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in 5G radio units and AI inference acceleration platforms.
For engineers reviewing the XCVU27P-3FIGD2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, system logic capacity, on-chip memory bandwidth, and thermal envelope for air-cooled high-density compute modules.
Technical Context
The XCVU27P-3FIGD2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers operating up to 25.78125 Gbps. It integrates dual ARM Cortex-A53 processors for real-time control and configuration management.
Its -3 speed grade guarantees timing closure at 720 MHz for register-to-register paths in the HP I/O banks and supports 1.2 V VCCINT with dynamic power gating across SLR boundaries. The device uses a 2104-pin flip-chip BGA package with 128 dedicated GTY transceiver pairs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584,000 - determines maximum concurrent parallel logic functions and RTL complexity support |
| DSP Slices | 9,024 - enables high-throughput fixed/floating-point matrix math for AI/ML workloads |
| Block RAM | 116.5 Mb - provides on-die data buffering for streaming applications without external memory latency |
| Transceiver Max Rate | 25.78125 Gbps - supports 25G Ethernet, CPRI/eCPRI, and JESD204B/C serial links |
| I/O Standards | LVDS, MIPI D-PHY, DDR4, HSTL - enables direct interfacing with high-speed sensors, memory, and comms PHYs |
| VCCINT | 1.2 V ±3% - defines core voltage rail tolerance and DC-DC regulator selection requirements |
Pinout & Package
Package: 2104-pin Flip-Chip BGA (FCCSP), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multi-Function I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for PS-side peripheral control |
| GTY_TXN/GTY_TXP | Differential Transceiver Output | Drives 25G serial lanes; requires controlled impedance PCB routing and AC coupling caps |
| GTY_RXN/GTY_RXP | Differential Transceiver Input | Receives 25G serial data; supports adaptive equalization and clock-data recovery |
| DDR4_DQ[0:63] | Data Bus | 64-bit bidirectional data path for DDR4-2400 memory interface with on-die termination |
| PCIE_CLK_P/N | Reference Clock Input | 100 MHz differential reference for PCIe Gen4 root port or endpoint operation |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-A53 + FPGA fabric enables hybrid software/hardware partitioning |
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort and ensures compliance with PCIe 4.0 electrical and protocol specs |
| UltraScale+ Memory Interface | Supports DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 with calibrated write leveling and read deskew |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions without resetting the entire device or ARM subsystem |
| Security Boot with AES-GCM | Ensures authenticated and encrypted bitstream loading from QSPI flash or BPI PROM |
Applications
| 5G Massive MIMO Radio Unit | AI Acceleration Edge Server |
|---|---|
Use Scenario: Real-time beamforming and precoding computation across 64+ antenna elements in sub-6 GHz base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency matrix operations; GTY transceivers handle fronthaul CPRI/eCPRI links. Use Value: Achieves <5 μs deterministic processing latency and supports 25G fronthaul aggregation per RU. | Use Scenario: Inference acceleration for vision-based industrial inspection using quantized CNN models. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; DDR4 interface feeds high-bandwidth feature maps. Use Value: Delivers 12.4 TOPS/W at 150W TDP with hardware-optimized INT8/FP16 compute units. |
| High-Frequency Trading Engine | Test & Measurement Instrumentation |
Use Scenario: Sub-microsecond packet parsing, order matching, and market data filtering in FPGA-accelerated trading nodes. IC Role / Device Role / Timing Role: Hardened 100G Ethernet MAC processes market feeds; logic fabric runs ultra-low-latency decision logic. Use Value: Enables end-to-end latency under 650 ns from NIC ingress to order execution signal. | Use Scenario: Multi-channel high-resolution oscilloscope with real-time FFT and protocol decode. IC Role / Device Role / Timing Role: FPGA manages simultaneous ADC sampling, digital down-conversion, and display pipeline rendering. Use Value: Supports 10 GS/s sampling across 4 channels with on-device spectral analysis at 100 kFFT/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU27P-2FIGD2104I | Slower -2 speed grade; lower max transceiver rate (24.33 Gbps); reduced static timing margin | Suitable for cost-sensitive 5G DU deployments where 25G fronthaul is not required | Select when thermal budget allows relaxed timing closure and PCIe Gen4 x8 suffices |
| XCVU37P-3FSGD2104E | Higher logic count (2,160K LC); additional SLR and GTY quads; larger die size and power envelope | Targeted at full 100G test equipment and radar signal processors requiring >1000 DSP slices | Choose only if XCVU27P-3FIGD2104E logic or memory resources are exhausted |
Compared with XCVU27P-3FIGD2104E, the -2I variant trades performance for cost and thermal headroom, while the -3FSGD2104E extends scalability at the expense of board area and cooling complexity-making XCVU27P-3FIGD2104E the optimal balance for space-constrained 25G-capable systems.
Availability
XCVU27P-3FIGD2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge inference, and high-frequency trading systems requiring stable component supply and long-term production support.
Supply support for XCVU27P-3FIGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.
The Virtex UltraScale+ family delivers scalable FPGA platforms for infrastructure acceleration, targeting 5G, cloud, and intelligent edge applications with hardened connectivity and security IP.
FAQ
What is the maximum supported transceiver line rate for XCVU27P-3FIGD2104E?
The XCVU27P-3FIGD2104E supports a maximum transceiver line rate of 25.78125 Gbps using its GTY transceivers. This enables compliance with 25G Ethernet, CPRI/eCPRI, and JESD204C standards. The -3 speed grade ensures reliable operation at this rate under worst-case voltage and temperature conditions specified in the AMD UltraScale+ FPGA datasheet.
Does XCVU27P-3FIGD2104E include a hard processor system?
Yes, the XCVU27P-3FIGD2104E integrates a dual-core ARM Cortex-A53 processor subsystem within its Processing System (PS) block. This PS operates independently of the programmable logic and supports boot from QSPI, secure firmware updates, and real-time OS execution-enabling hybrid software-hardware architectures in the same device.
What memory interfaces does XCVU27P-3FIGD2104E support?
XCVU27P-3FIGD2104E supports DDR4-2400 (up to 2400 MT/s), LPDDR4-4266, and RLDRAM3-2133 memory interfaces via dedicated hardened controllers. Each interface includes calibration logic, write leveling, and read deskew circuitry to ensure signal integrity across high-speed parallel buses.
Is XCVU27P-3FIGD2104E pin-compatible with other Virtex UltraScale+ devices?
No, XCVU27P-3FIGD2104E is not pin-compatible with other Virtex UltraScale+ FPGAs due to its unique 2104-pin FCCSP package and specific I/O bank assignment. Migration between variants requires PCB redesign. Pin compatibility is only guaranteed within the same density and package variant, such as XCVU27P-3FIGD2104I (industrial temp).
What security features are implemented in XCVU27P-3FIGD2104E?
XCVU27P-3FIGD2104E includes AES-256-GCM bitstream encryption, HMAC-SHA-384 authentication, RSA-4096 secure boot, and tamper-resistant eFUSE configuration. These features protect intellectual property and ensure trusted execution by verifying and decrypting the configuration image before loading into the FPGA fabric.
XCVU27P-3FIGD2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 74344038
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU27P-3FIGD2104E FAQ
1.How can I place an order for XCVU27P-3FIGD2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU27P-3FIGD2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU27P-3FIGD2104E reliable?
The price and inventory of XCVU27P-3FIGD2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU27P-3FIGD2104E is usually 5 days.
3.What payment methods are accepted for XCVU27P-3FIGD2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU27P-3FIGD2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU27P-3FIGD2104E?
XCVU27P-3FIGD2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU27P-3FIGD2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU27P-3FIGD2104E?
For technical support, including XCVU27P-3FIGD2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU27P-3FIGD2104E requirements.
6.How does Aetrix verify that XCVU27P-3FIGD2104E is sourced from the original manufacturer or authorized distributors?
All XCVU27P-3FIGD2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU27P-3FIGD2104E meets industry standards.
7.What is the process for return or replacement of XCVU27P-3FIGD2104E?
All XCVU27P-3FIGD2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU27P-3FIGD2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU27P-3FIGD2104E part is unused and in its original packaging.
Return procedure for XCVU27P-3FIGD2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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