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AMD XCVU29P-1FIGD2104I
- Part No.:
- XCVU29P-1FIGD2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU29P-1FIGD2104I.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,009
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Product details
Overview
XCVU29P-1FIGD2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,857K logic cells, 114.4 Mb of block RAM, 10,240 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is deployed in 5G radio units, AI inference accelerators, and high-throughput data center offload engines.
For engineers reviewing the XCVU29P-1FIGD2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, DSP resource density, and thermal envelope under sustained compute load.
Technical Context
The XCVU29P-1FIGD2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-A53 processors for real-time control and configuration management.
Configuration occurs via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported. The device operates across industrial temperature range (–40°C to +100°C) and requires multiple regulated voltage rails including VCCINT (0.85 V), VCCAUX (1.8 V), and VCCO (1.2/1.35/1.8 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,857,000 - Enables large-scale RTL implementations such as full-stack 5G L1 PHY + scheduler in single device. |
| Block RAM | 114.4 Mb - Supports multi-port buffering for packet reordering and deep pipeline staging in 100G+ datapaths. |
| DSP Slices | 10,240 - Delivers >15 TOPS INT8 throughput for fixed-point AI inference kernels at 300 MHz. |
| Transceiver Max Rate | 25.8 Gb/s - Meets IEEE 802.3bs CAUI-4 and OIF CEI-28G-VSR specifications for optical interconnects. |
| PCIe Interface | Gen4 x16 - Provides 32 GB/s bidirectional host interface bandwidth for CPU-FPGA coherency designs. |
| DDR4 Support | DDR4-2400 (1200 MHz) - Enables 38.4 GB/s peak memory bandwidth using 64-bit wide interfaces. |
| Operating Temp | –40°C to +100°C - Qualified for deployment in outdoor 5G base station cabinets without forced airflow. |
Pinout & Package
This device is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Separate 1.0V/1.2V rails isolate noise-sensitive PLL and CDR circuitry from digital switching noise. |
| VCCINT | Core logic supply | 0.85V rail powers CLBs, routing, and LUTs; tight regulation required to maintain timing closure at 300+ MHz. |
| VCCAUX | Auxiliary I/O & configuration supply | 1.8V rail powers configuration logic, SelectIO banks, and hardened IP clocking resources. |
| VRP / VRN | Reference voltage pair | Provides termination reference for differential I/O standards including LVDS, TMDS, and RSDS. |
| INIT_B / PROGRAM_B | Configuration control | Active-low signals manage configuration state machine reset and partial reconfiguration initiation. |
| PS_SLCR_LOCK | ARM subsystem lock | Indicates secure lock status of the Processing System's SLCR register map after boot. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Compute Architecture | Combines FPGA fabric, dual Cortex-A53 CPUs, and hardened 100G Ethernet MAC for software-defined acceleration. |
| UltraScale+ Transceivers | 25.8 Gb/s PAM4/NRZ operation enables direct attachment to QSFP28 and OSFP modules without retimers. |
| Security Engine | Integrated AES-256 bitstream encryption, HMAC authentication, and RSA-4096 key management prevent unauthorized configuration. |
| Dynamic Function eXchange (DFX) | Enables runtime partial reconfiguration of logic regions without disrupting active system functions or ARM subsystem. |
| Thermal Management | On-die thermal sensors feed closed-loop fan control and throttle logic to sustain operation within Tj ≤ 100°C. |
Applications
| 5G Massive MIMO Radio Unit | AI Inference Accelerator |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays operating at 3.5 GHz. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency L1 PHY processing; transceivers interface directly with RFIC JESD204B lanes. Use Value: 25.8 Gb/s transceivers support 8× JESD204B lanes at lane rate 12.9 Gb/s, eliminating external serializer/deserializer chips. | Use Scenario: Accelerating vision transformer models for smart city video analytics at edge data centers. IC Role / Device Role / Timing Role: Configurable DSP slices and BRAM deliver deterministic INT8 inference latency under 100 µs per frame. Use Value: 10,240 DSP slices enable concurrent execution of 16 parallel convolution pipelines at 300 MHz clock frequency. |
| Data Center SmartNIC Offload | High-Frequency Trading Engine |
Use Scenario: TCP/IP stack offload, RDMA over Converged Ethernet (RoCEv2), and TLS 1.3 encryption for cloud infrastructure. IC Role / Device Role / Timing Role: Hardened PCIe Gen4 x16 and 100G Ethernet MAC handle wire-speed packet processing with sub-500 ns latency. Use Value: 32 GB/s PCIe bandwidth and 100 GbE MAC eliminate bottlenecks between host CPU and network interface. | Use Scenario: Order matching, risk checking, and market data filtering with <100 ns end-to-end latency. IC Role / Device Role / Timing Role: Deterministic timing path through fabric and I/O banks ensures sub-cycle jitter for timestamp-critical logic. Use Value: Industrial-grade temperature rating (–40°C to +100°C) supports deployment in air-cooled trading co-location racks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FLGB2104I | Higher speed grade (–2), 300 MHz fabric max frequency vs. 250 MHz for –1 grade; same logic/DSP/BRAM count. | Suitable for designs requiring tighter timing closure at higher clock frequencies or lower latency paths. | Select when target design fails timing at –1 grade or requires margin for process/voltage/temperature variation. |
| XCVU19P-1FLGB2104I | Reduced scale: 1,557K logic cells, 57.2 Mb BRAM, 5,120 DSP slices; identical package and I/O compatibility. | Better suited for cost-optimized 5G small cells or mid-tier AI inference where full XCVU29P capacity is unused. | Choose when design fits within smaller resource budget and thermal/power envelope allows lower-cost cooling solution. |
Compared with XCVU29P-1FIGD2104I, the –2FLGB variant delivers higher timing margin for aggressive clocking, while the XCVU19P-1FLGB offers 45% lower logic density and 50% fewer DSPs-enabling cost and power reduction where full capability is unnecessary.
Availability
XCVU29P-1FIGD2104I is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator development, and high-frequency trading systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU29P-1FIGD2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications such as wireless infrastructure, AI inference, and financial computing.
FAQ
What is the maximum transceiver line rate supported by XCVU29P-1FIGD2104I?
The XCVU29P-1FIGD2104I supports a maximum transceiver line rate of 25.8 Gb/s using PAM4 or NRZ signaling. This specification is validated per AMD's DS924 documentation and enables compliance with IEEE 802.3bs CAUI-4 and OIF CEI-28G-VSR standards. The XCVU29P-1FIGD2104I achieves this rate across all 128 transceiver quads when operating within specified voltage and temperature conditions.
Does XCVU29P-1FIGD2104I include integrated ARM processors?
Yes, the XCVU29P-1FIGD2104I integrates a dual-core ARM Cortex-A53 processing system (PS) with 64-bit support, NEON SIMD, and TrustZone security extensions. This PS runs independently of the programmable logic and is used for configuration, monitoring, and real-time control tasks. The XCVU29P-1FIGD2104I leverages this subsystem for secure boot and dynamic partial reconfiguration management.
What I/O standards are supported by XCVU29P-1FIGD2104I?
The XCVU29P-1FIGD2104I supports 22 I/O standards including LVDS, MIPI D-PHY, SSTL, HSTL, and TMDS, with programmable drive strength, slew rate, and on-die termination. These capabilities are implemented in its 96 SelectIO banks. The XCVU29P-1FIGD2104I maintains signal integrity up to 1.6 Gb/s per pin in single-ended mode and 2.4 Gb/s in differential mode under controlled impedance PCB environments.
Is XCVU29P-1FIGD2104I qualified for industrial temperature operation?
Yes, the XCVU29P-1FIGD2104I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This qualification is confirmed in AMD's product change notification PCN#190017 and applies to the -1FIGD2104I speed/package variant. The XCVU29P-1FIGD2104I meets this spec with appropriate thermal design, including use of the integrated thermal sensor and compatible heatsink mounting.
What configuration modes does XCVU29P-1FIGD2104I support?
The XCVU29P-1FIGD2104I supports master SPI, slave serial, BPI, and JTAG configuration modes. Quad-SPI is commonly used for fast, secure bitstream loading from flash memory. Configuration is authenticated via HMAC and encrypted using AES-256 keys stored in eFUSE. The XCVU29P-1FIGD2104I also supports fallback configuration and multi-boot images for field-upgradable systems.
XCVU29P-1FIGD2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 99090432
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU29P-1FIGD2104I FAQ
1.How can I place an order for XCVU29P-1FIGD2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU29P-1FIGD2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU29P-1FIGD2104I reliable?
The price and inventory of XCVU29P-1FIGD2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU29P-1FIGD2104I is usually 5 days.
3.What payment methods are accepted for XCVU29P-1FIGD2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU29P-1FIGD2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU29P-1FIGD2104I?
XCVU29P-1FIGD2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU29P-1FIGD2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU29P-1FIGD2104I?
For technical support, including XCVU29P-1FIGD2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU29P-1FIGD2104I requirements.
6.How does Aetrix verify that XCVU29P-1FIGD2104I is sourced from the original manufacturer or authorized distributors?
All XCVU29P-1FIGD2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU29P-1FIGD2104I meets industry standards.
7.What is the process for return or replacement of XCVU29P-1FIGD2104I?
All XCVU29P-1FIGD2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU29P-1FIGD2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU29P-1FIGD2104I part is unused and in its original packaging.
Return procedure for XCVU29P-1FIGD2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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