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AMD XCVU29P-2FIGD2104I
- Part No.:
- XCVU29P-2FIGD2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU29P-2FIGD2104I.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,601
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Product details
Overview
XCVU29P-2FIGD2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,857K logic cells, 114.4 Mb of block RAM, 10,240 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 28 Gbps GTY transceivers. It targets AI acceleration, 5G baseband processing, and high-end radar signal conditioning in aerospace and defense systems.
For engineers reviewing the XCVU29P-2FIGD2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal design power (TDP) budgeting, and configuration interface options (e.g., dual BPI, QSPI, JTAG).
Technical Context
The XCVU29P-2FIGD2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting protocols including CPRI, JESD204B/C, and OTN. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration is performed via master SPI or BPI mode using external flash; bitstream encryption and HMAC authentication are integrated for secure boot. The device includes dedicated clock management tiles (CMTs) with MMCM and PLL resources for low-jitter clock synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,857,000 - determines maximum combinational/sequential logic capacity for complex algorithm mapping |
| Block RAM | 114.4 Mb - enables large on-die data buffering for streaming applications like beamforming or packet buffering |
| DSP Slices | 10,240 - supports high-throughput fixed/floating-point math for real-time FFT, filtering, and ML inference kernels |
| GTY Transceivers | 64 lanes @ 28 Gbps - provides raw serial bandwidth for 100G+ interconnects and high-speed ADC/DAC interfaces |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V - ensures compatibility with diverse memory and sensor interfaces |
| Thermal Design Power | 55 W (typical) - defines active cooling requirements and PCB thermal layout constraints |
| Configuration Interface | Quad-SPI, BPI x16, JTAG - enables flexible, field-upgradable bitstream loading and debug access |
Pinout & Package
The XCVU29P-2FIGD2104I is housed in a 2104-ball FCBGA package (Fine-Pitch Column Grid Array) with 0.8 mm pitch, designed for high-density routing and thermal dissipation in high-performance compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O Bank 0 | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and monitoring |
| HR[0:71] | High-Range I/O Bank | Supports 1.8 V/2.5 V/3.3 V single-ended and differential standards for memory and analog interface connectivity |
| HP[0:107] | High-Performance I/O Bank | Enables 1.2 V/1.35 V/1.8 V operation with sub-100 ps skew for DDR4 and high-speed SerDes reference clocks |
| GTY_TX/RX[0:63] | Transceiver Differential Pair | Carries serialized data at up to 28 Gbps; requires controlled impedance routing and AC coupling capacitors |
| VRP/VRN | Reference Voltage Pins | Provide precision bias for differential input receivers in HP/HR banks; must be decoupled per bank |
| CONFIG_IO | Configuration Mode Select | Determines boot source (QSPI/BPI/JTAG); tied high/low during power-up to set startup behavior |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort and timing closure risk for host interface subsystems |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing without external PHY or FEC offload IC |
| Secure Boot with AES-256 & HMAC | Prevents unauthorized firmware execution and ensures bitstream integrity in regulated environments |
| Partial Reconfiguration Support | Allows dynamic logic swapping during runtime-critical for adaptive radar and multi-mode comms systems |
| UltraScale+ Memory Controller IP | Provides verified, timing-closed DDR4-2400 and RLDRAM3 controllers with ECC support |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and digital beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with high-speed ADCs/DACs. Use Value: 28 Gbps transceivers enable direct sampling of IF signals up to 10 GHz, eliminating analog downconversion stages. | Use Scenario: Distributed unit (DU) and active antenna unit (AAU) processing in open RAN infrastructure. IC Role / Device Role / Timing Role: Implements Layer 1 PHY functions (FFT/iFFT, channel coding, precoding) and fronthaul transport (eCPRI over 25G Ethernet). Use Value: 100G Ethernet MAC + RS-FEC handles full-bandwidth eCPRI compression with deterministic latency under 10 μs. |
| AI Inference Acceleration | Test & Measurement Equipment |
Use Scenario: Low-latency, high-throughput inference for vision-guided robotics and autonomous vehicle perception stacks. IC Role / Device Role / Timing Role: Configurable logic implements custom CNN accelerators; DSP slices perform quantized matrix-vector multiply-accumulate operations. Use Value: 10,240 DSP slices deliver >20 TOPS INT8 throughput while maintaining sub-100 ns decision latency. | Use Scenario: High-resolution oscilloscopes and protocol analyzers requiring real-time pattern generation and deep memory capture. IC Role / Device Role / Timing Role: Manages multi-channel ADC sampling, on-the-fly data compression, and PCIe Gen4 x16 host data streaming. Use Value: PCIe Gen4 x16 interface sustains 16 GT/s bidirectional throughput for continuous 10+ GS/s waveform transfer to host memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FLGD2104I | Same logic capacity and transceiver count, but uses FLGD2104 (lead-free, RoHS-compliant) package variant with identical pinout and thermal profile | Identical use cases; selected when lead-free compliance is mandated by end-market regulations (e.g., EU medical devices) | Drop-in replacement where RoHS-6 compliance is required; no PCB or firmware changes needed |
| XCVU19P-2FLGA2104I | Lower logic density (1,582K cells), reduced DSP count (6,144), and 32 GTY lanes @ 25 Gbps; same 2104-ball FCBGA footprint | Suitable for cost-sensitive 5G small cells or mid-tier test equipment where full XCVU29P bandwidth is unnecessary | Offers ~35% lower TDP and bill-of-materials cost; requires logic and transceiver resource validation in existing designs |
Compared with XCVU29P-2FIGD2104I, the XCVU29P-2FLGD2104I offers identical performance with lead-free compliance, while the XCVU19P-2FLGA2104I trades raw capacity for lower power and cost-making it viable for scaled-down implementations where 28 Gbps transceivers or >2K DSP slices are not required.
Availability
XCVU29P-2FIGD2104I is available at Aetrix Electronics and suitable for AI accelerator cards, 5G radio units, and defense-grade radar subsystems requiring stable component supply across extended production lifecycles.
Supply support for XCVU29P-2FIGD2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, GPU, and data center acceleration solutions.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure, emphasizing hardened connectivity, security, and power efficiency in aerospace, communications, and test equipment.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU29P-2FIGD2104I?
The XCVU29P-2FIGD2104I supports GTY transceivers operating at up to 28 Gbps per lane. This rate is validated across process corners and temperature ranges per AMD UG578 v1.14. Applications requiring sustained 28 Gbps operation must adhere to specific PCB stackup, trace length matching, and AC coupling capacitor placement guidelines defined in the device packaging specification.
Does the XCVU29P-2FIGD2104I include hardened PCIe Gen4 controller logic?
Yes, the XCVU29P-2FIGD2104I integrates a hardened PCIe Gen4 x16 endpoint/root port controller. This block operates at 16 GT/s per lane, supports AXI4 streaming interfaces, and includes integrated TLP parsing, credit management, and error reporting-eliminating the need for soft-core PCIe implementations and reducing timing closure complexity.
What configuration modes does the XCVU29P-2FIGD2104I support?
The XCVU29P-2FIGD2104I supports Quad-SPI, BPI x16, and JTAG configuration modes. Configuration mode is selected at power-up via CONFIG_IO pins. Bitstream encryption and HMAC authentication are enforced in all modes when enabled, and fallback configuration is supported via dual-flash mirroring for field reliability.
Is partial reconfiguration supported on the XCVU29P-2FIGD2104I?
Yes, partial reconfiguration is fully supported on the XCVU29P-2FIGD2104I. It enables dynamic logic module swapping without resetting the entire device, using frame-based bitstream updates. This capability is used in adaptive radar and software-defined radio systems where functional modes change in real time while maintaining system uptime.
What I/O standards are supported by the HP and HR banks of the XCVU29P-2FIGD2104I?
The HP banks of the XCVU29P-2FIGD2104I support 1.2 V, 1.35 V, and 1.8 V standards including SSTL12, SSTL135, and DIFF_HSTL_I_12. The HR banks support 1.8 V, 2.5 V, and 3.3 V standards such as LVCMOS18, LVDS_25, and MIPI_DPHY. Each bank requires dedicated VCCO and VRP/VRN supplies configured per I/O standard.
XCVU29P-2FIGD2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 99090432
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU29P-2FIGD2104I FAQ
1.How can I place an order for XCVU29P-2FIGD2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU29P-2FIGD2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU29P-2FIGD2104I reliable?
The price and inventory of XCVU29P-2FIGD2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU29P-2FIGD2104I is usually 5 days.
3.What payment methods are accepted for XCVU29P-2FIGD2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU29P-2FIGD2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU29P-2FIGD2104I?
XCVU29P-2FIGD2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU29P-2FIGD2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU29P-2FIGD2104I?
For technical support, including XCVU29P-2FIGD2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU29P-2FIGD2104I requirements.
6.How does Aetrix verify that XCVU29P-2FIGD2104I is sourced from the original manufacturer or authorized distributors?
All XCVU29P-2FIGD2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU29P-2FIGD2104I meets industry standards.
7.What is the process for return or replacement of XCVU29P-2FIGD2104I?
All XCVU29P-2FIGD2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU29P-2FIGD2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU29P-2FIGD2104I part is unused and in its original packaging.
Return procedure for XCVU29P-2FIGD2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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