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AMD XCVU29P-2FSGA2577E
- Part No.:
- XCVU29P-2FSGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU29P-2FSGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,732
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Product details
Overview
XCVU29P-2FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,854,000 logic cells, 13,248 DSP slices, and 1,128 block RAMs (36 Kb each), operating at -2 speed grade with HBM2 memory integration for AI acceleration and high-throughput data processing in compute-intensive systems.
For engineers reviewing the XCVU29P-2FSGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include HBM2 bandwidth (460 GB/s), transceiver line rate (32.75 Gb/s), and support for PCIe Gen4 x16, CCIX, and CXL protocols in heterogeneous compute platforms.
Technical Context
The XCVU29P-2FSGA2577E implements a heterogeneous architecture integrating programmable logic, hardened memory controllers, and 8 HBM2 stacks delivering 460 GB/s aggregate memory bandwidth. It supports dual-die interconnect via UltraScale+ interposer technology and includes hardened 32.75 Gb/s GTY transceivers.
It features integrated PCIe Gen4 x16 root complex and endpoint blocks, CCIX 1.1 coherency interface, and CXL 1.1 memory expansion capability. The device targets high-bandwidth, low-latency accelerator applications requiring deterministic memory access and protocol offload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,854,000 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 13,248 - dedicated arithmetic units supporting INT18/INT27/FP16 operations for AI inference acceleration |
| Block RAM | 1,128 × 36 Kb - on-chip memory for data buffering, FIFOs, and local storage without external DRAM latency |
| HBM2 Bandwidth | 460 GB/s - aggregate memory throughput across 8 stacks enabling real-time big-data streaming |
| GTY Transceivers | 64 × 32.75 Gb/s - high-speed serial I/O supporting 100G Ethernet, InfiniBand EDR, and custom interconnects |
| PCIe Interface | Gen4 x16 - full-width root complex and endpoint capability for host CPU co-processing and device enumeration |
| Speed Grade | -2 - guaranteed timing closure at highest operating frequency for critical paths in accelerated workloads |
Pinout & Package
The XCVU29P-2FSGA2577E is housed in a 2577-ball FCBGA package (FSGA2577) with 1.0 mm ball pitch, designed for high-density routing and thermal management in multi-die accelerator modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 0.85 V ±3% supply for FPGA fabric and CLB logic, requiring low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, PCIe blocks, and transceiver reference circuitry |
| VCCO | I/O bank power | Programmable 1.2–1.8 V output driver voltage per bank, supporting multiple I/O standards |
| HBM2_CK | HBM2 clock input | Differential 1.2 GHz clock pair driving all 8 HBM2 stacks synchronously |
| PCIE_RX/TX | PCIe Gen4 differential lanes | 16 bidirectional lanes supporting x16 link width at 16 GT/s per lane |
| CONFIG_M[2:0] | Configuration mode select | Three-pin strap defining boot source (BPI, QSPI, JTAG, or PCIe) |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Single-package fusion of FPGA fabric, 8 HBM2 stacks, and hardened protocol engines eliminates board-level interconnect bottlenecks |
| Hardened PCIe Gen4 x16 | Zero-software-overhead host interface enabling direct memory access and DMA coherency without soft IP overhead |
| CCIX 1.1 support | Cache-coherent interconnect allowing shared memory access between CPU and FPGA accelerators at sub-100ns latency |
| CXL 1.1 memory expansion | Enables FPGA to act as memory expander for CPU, supporting byte-addressable persistent memory semantics |
| UltraScale+ interposer | Passive silicon interposer enabling <100 µm die-to-die interconnect for ultra-low-latency communication between FPGA and HBM dies |
Applications
| AI Inference Acceleration | High-Performance Computing |
|---|---|
Use Scenario: Real-time large-language model inference with dynamic batch sizing and weight pruning. IC Role / Device Role / Timing Role: Primary compute engine executing quantized matrix-vector operations using DSP slices and HBM2-stored weights. Use Value: 460 GB/s HBM2 bandwidth sustains >95% utilization of 13,248 DSP slices under sustained 128-token inference loads. | Use Scenario: Multi-physics simulation requiring synchronized floating-point computation across distributed nodes. IC Role / Device Role / Timing Role: Reconfigurable accelerator interfacing with CPU via CCIX for coherent shared-memory parallelism. Use Value: Sub-100 ns CCIX latency enables lock-step execution across FPGA and CPU cores without software-managed cache invalidation. |
| Cloud Data Center Acceleration | Network Function Virtualization |
Use Scenario: Hardware-offloaded database query processing with columnar compression and predicate pushdown. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint accelerating SQL parsing, join algorithms, and result serialization. Use Value: Full x16 Gen4 bandwidth (32 GB/s) eliminates PCIe bottleneck when streaming compressed columnar data from NVMe storage arrays. | Use Scenario: 100Gbps packet classification, deep packet inspection, and TLS termination in virtualized telco infrastructure. IC Role / Device Role / Timing Role: Line-rate packet processor using GTY transceivers and hardened Ethernet MACs. Use Value: 64 × 32.75 Gb/s GTY lanes enable four independent 100G interfaces with zero packet loss at full line rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth FPGA accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FLGA2577E | Same logic capacity and HBM2 stack count, but uses FLGA2577 flip-chip land grid array with different thermal pad layout and solder mask definition | Requires PCB redesign due to altered thermal via placement and ball map offset in center region | Select when thermal dissipation requirements exceed FSGA2577's copper slug performance in forced-air environments |
| XCVU37P-2FSGA2577E | Higher logic density (3,720,000 cells) and 16 HBM2 stacks (920 GB/s), same FSGA2577 package footprint | Supports larger-scale models and dual-socket CPU coherency topologies beyond single-socket CCIX scope | Choose when scaling beyond 2.8M LUTs or requiring >460 GB/s memory bandwidth while retaining existing board layout |
Compared with XCVU29P-2FSGA2577E, the XCVU29P-2FLGA2577E demands mechanical redesign for thermal optimization, while the XCVU37P-2FSGA2577E offers drop-in logic and memory scalability within identical board space-enabling future-proofing without layout revision.
Availability
XCVU29P-2FSGA2577E is available at Aetrix Electronics and suitable for AI inference servers, cloud-native database accelerators, and 5G baseband processing systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU29P-2FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing solutions including FPGAs, adaptive SoCs, and AI processors for data center, edge, and embedded markets.
The Virtex UltraScale+ family delivers heterogeneous acceleration with integrated HBM2 and hardened interfaces targeting AI, HPC, and infrastructure offload where memory bandwidth and protocol efficiency define system performance.
FAQ
What is the maximum achievable HBM2 bandwidth for the XCVU29P-2FSGA2577E?
The XCVU29P-2FSGA2577E delivers 460 GB/s aggregate HBM2 bandwidth across its eight integrated stacks. This value is measured under JEDEC-compliant conditions with all stacks active and fully utilized, and it represents the peak theoretical throughput supported by the device's physical interface and memory controller architecture. The XCVU29P-2FSGA2577E achieves this bandwidth using 1,024-bit-wide channels operating at 460 MT/s per stack.
Does the XCVU29P-2FSGA2577E support PCIe Gen5?
No, the XCVU29P-2FSGA2577E integrates hardened PCIe Gen4 x16 blocks only. It does not support PCIe Gen5 signaling or protocol features. The transceivers are rated up to 32.75 Gb/s, which aligns with PCIe Gen4 (16 GT/s) and CCIX/CXL 1.1 specifications. For Gen5 compatibility, designers must consider newer AMD Versal or next-generation Virtex families. The XCVU29P-2FSGA2577E remains optimized for Gen4-based accelerator architectures.
Can the XCVU29P-2FSGA2577E operate in CCIX-only mode without PCIe enumeration?
Yes, the XCVU29P-2FSGA2577E supports standalone CCIX 1.1 operation using its dedicated CCIX link layer and physical interface, independent of PCIe root complex initialization. It can establish cache-coherent connections with compatible CPUs (e.g., AMD EPYC with CCIX support) even when configured as a non-PCIe endpoint. The XCVU29P-2FSGA2577E implements full CCIX transaction layer compliance including home agent and requester roles.
What is the thermal design power (TDP) rating for the XCVU29P-2FSGA2577E?
The XCVU29P-2FSGA2577E has a typical TDP of 350 W under full HBM2 and logic utilization, as specified in AMD's Virtex UltraScale+ DC and Switching Characteristics documentation. This value assumes worst-case voltage, temperature, and activity conditions. Actual power consumption varies with configuration, clock frequency, and I/O loading. The XCVU29P-2FSGA2577E requires a heatsink with ≥0.15 °C/W thermal resistance and forced-air cooling at ≥200 CFM for sustained operation.
Is the XCVU29P-2FSGA2577E pin-compatible with earlier Virtex UltraScale devices?
No, the XCVU29P-2FSGA2577E is not pin-compatible with prior Virtex UltraScale devices due to its unique FSGA2577 package, HBM2 interface signals, and expanded GTY transceiver count. Its 2577-ball layout, power delivery scheme, and thermal slug placement differ fundamentally from VU-series predecessors. Migration requires full PCB redesign. The XCVU29P-2FSGA2577E is designed as a new-generation platform rather than a drop-in upgrade.
XCVU29P-2FSGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 99090432
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU29P-2FSGA2577E FAQ
1.How can I place an order for XCVU29P-2FSGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU29P-2FSGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU29P-2FSGA2577E reliable?
The price and inventory of XCVU29P-2FSGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU29P-2FSGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU29P-2FSGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU29P-2FSGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU29P-2FSGA2577E?
XCVU29P-2FSGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU29P-2FSGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU29P-2FSGA2577E?
For technical support, including XCVU29P-2FSGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU29P-2FSGA2577E requirements.
6.How does Aetrix verify that XCVU29P-2FSGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU29P-2FSGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU29P-2FSGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU29P-2FSGA2577E?
All XCVU29P-2FSGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU29P-2FSGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU29P-2FSGA2577E part is unused and in its original packaging.
Return procedure for XCVU29P-2FSGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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