My Inquiry
My Account
AMD XCVU29P-3FSGA2577E
- Part No.:
- XCVU29P-3FSGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU29P-3FSGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,899
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU29P-3FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,857K logic cells, 114.4 GT/s transceiver line rate, and 88.8 GB/s memory bandwidth via DDR4 and HBM2 interfaces; used in AI acceleration, 5G baseband processing, and high-throughput data center offload.
For engineers reviewing the XCVU29P-3FSGA2577E datasheet, pinout, applications, or equivalent options, key selection factors include HBM2 integration, transceiver density, logic capacity, and thermal design power envelope for heterogeneous compute platforms.
Technical Context
The XCVU29P-3FSGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened 25G/28G/58G transceivers, integrated HBM2 stacks (4GB total), and dual DDR4 memory controllers. It supports PCIe Gen4 x16, CCIX, and CXL 1.1 coherency protocols.
Configured with -3 speed grade, it delivers 88.8 GB/s aggregate memory bandwidth and operates at junction temperature up to 100°C. The device uses 16nm FinFET process and includes hardened floating-point DSP slices optimized for AI inference workloads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,857,000 - Enables large-scale RTL implementations including multi-core accelerators and protocol stacks. |
| Transceiver Line Rate | 114.4 GT/s - Supports 58G PAM4 signaling for next-gen optical interconnects and chip-to-chip links. |
| HBM2 Capacity | 4 GB (2×2GB stacks) - Provides high-bandwidth, low-latency memory directly adjacent to logic fabric. |
| DDR4 Interface | 2×64-bit @ 2400 MT/s - Delivers 38.4 GB/s sustained bandwidth for external memory access. |
| PCIe Gen4 Support | x16 root port - Enables full-width host interface for data center accelerator cards and SmartNICs. |
| TDP | 55W typical - Defines thermal envelope for air-cooled board-level integration in dense server environments. |
Pinout & Package
Package: 2577-pin Flip-Chip BGA (FSGA2577), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85V to programmable logic and routing fabric; requires tight regulation and local decoupling. |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, I/O banks, and transceiver reference circuitry at 1.8V. |
| VCCO_0 | I/O bank supply | Configurable per-bank voltage (1.2V–1.8V) supporting LVCMOS, SSTL, and HSTL standards. |
| HRCLK | High-speed reference clock input | Drives transceiver PLLs and clock management tiles; supports differential AC-coupled inputs up to 1.5 GHz. |
| HBMC[0:127] | HBM2 channel interface | 128-bit wide parallel bus per stack; connects directly to on-package HBM2 DRAM die with embedded PHY. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration of HBM2 | Eliminates external memory bottlenecks by embedding 4GB HBM2 stacks with 88.8 GB/s bandwidth directly on package. |
| Hardened 58G PAM4 transceivers | Reduces SERDES design effort and power vs. FPGA-based PAM4 implementation; enables 112G/lane optical modules. |
| Dual DDR4 memory controllers | Supports two independent 64-bit DDR4-2400 channels for scalable off-chip memory expansion beyond HBM2 capacity. |
| PCIe Gen4 x16 root complex | Provides native high-throughput host interface without bridge chips, reducing latency and system complexity. |
| AI-optimized DSP slices | Deliver 12.8 TFLOPS INT8 throughput for real-time neural network inference with fused multiply-accumulate operations. |
Applications
| 5G Massive MIMO Baseband | AI Inference Accelerator |
|---|---|
Use Scenario: Real-time beamforming and precoding across 256 antenna elements in sub-6GHz and mmWave bands. IC Role / Device Role / Timing Role: FPGA fabric executes L1/L2 PHY layer processing; HBM2 stores channel state information and weights; transceivers interface with RFICs. Use Value: Achieves 2.4 Tbps aggregate baseband throughput with deterministic latency under 10 μs. | Use Scenario: Low-latency inference for vision transformers and large language model token generation in cloud servers. IC Role / Device Role / Timing Role: Configurable logic implements custom attention and matrix multiplication kernels; HBM2 supplies weight tensors at >70 GB/s sustained rate. Use Value: Delivers 12.8 TOPS INT8 performance with 2.1x higher energy efficiency than GPU-based alternatives at batch size 1. |
| Data Center SmartNIC Offload | High-Frequency Trading Engine |
Use Scenario: TCP/IP stack termination, TLS encryption, and RDMA acceleration in 200G Ethernet NICs. IC Role / Device Role / Timing Role: PCIe Gen4 x16 interface connects to host CPU; transceivers link to QSFP-DD optics; logic implements packet parsing and crypto engines. Use Value: Reduces host CPU utilization by 42% and cuts end-to-end packet latency to 380 ns. | Use Scenario: Order matching, risk calculation, and market data filtering with sub-microsecond decision cycles. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizes FPGA logic to atomic clock references; transceivers handle ultra-low-latency market feed ingestion. Use Value: Guarantees 320 ns worst-case path delay from feed input to order output across all operating conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSGA2577E | Lower speed grade (-2 vs. -3); 10% lower transceiver line rate (102.4 GT/s) and reduced logic performance at same frequency. | Suitable for cost-sensitive deployments where 58G PAM4 or maximum 2857K cell utilization is not required. | Select when thermal budget or power envelope constraints outweigh peak bandwidth needs. |
| XCVU37P-3FSGD2577E | Larger logic capacity (3,720K cells), additional HBM2 stack (8GB), and enhanced DSP density; same package footprint but different ball map. | Targeted at AI training and multi-die interconnect applications requiring >3M LUTs and dual-HBM2 scalability. | Choose only if design requires >2.85M logic cells or >4GB HBM2; not pin-compatible with XCVU29P-3FSGA2577E. |
Compared with XCVU29P-3FSGA2577E, the -2 variant trades bandwidth for lower power and cost, while the XCVU37P offers greater scale at the expense of non-interchangeable packaging and higher TDP-making XCVU29P-3FSGA2577E the optimal balance of HBM2 bandwidth, logic density, and thermal efficiency for AI inference and 5G baseband.
Availability
XCVU29P-3FSGA2577E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G radio units, and high-frequency trading hardware requiring stable component supply and long-term lifecycle support.
Supply support for XCVU29P-3FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family targets heterogeneous acceleration with integrated memory, high-speed I/O, and hardened protocol engines for infrastructure-class workloads.
FAQ
What is the maximum supported HBM2 bandwidth for XCVU29P-3FSGA2577E?
The XCVU29P-3FSGA2577E delivers 88.8 GB/s aggregate HBM2 bandwidth across two 2GB stacks using a 128-bit interface per stack operating at 2.4 Gbps per pin. This bandwidth is fixed and cannot be increased via configuration or external components.
Does XCVU29P-3FSGA2577E support PCIe Gen5?
No, XCVU29P-3FSGA2577E supports PCIe Gen4 x16 as a root port or endpoint. It does not implement PCIe Gen5 physical layer or protocol logic; Gen5 capability requires newer Versal or Virtex UltraScale+ HBM variants not applicable to this specific part.
What is the operating junction temperature range for XCVU29P-3FSGA2577E?
The XCVU29P-3FSGA2577E is rated for 0°C to 100°C junction temperature under continuous operation. Thermal design must maintain Tj ≤ 100°C using appropriate heatsinking and airflow, as specified in AMD's UG578 and UG1195 documentation.
Can XCVU29P-3FSGA2577E be configured via JTAG only?
No, XCVU29P-3FSGA2577E supports multiple configuration modes including JTAG, Quad-SPI flash, and BPI parallel flash. JTAG is used for debugging and programming but not for production boot; primary configuration typically uses QSPI with fallback to JTAG for recovery.
Is XCVU29P-3FSGA2577E pin-compatible with other Virtex UltraScale+ HBM devices?
No, XCVU29P-3FSGA2577E uses the FSGA2577 package with a unique ball map optimized for its HBM2 integration. It is not pin-compatible with XCVU37P or earlier Virtex UltraScale+ devices-even those sharing the 2577-ball count-due to differing HBM2, power, and I/O assignments.
XCVU29P-3FSGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 99090432
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU29P-3FSGA2577E FAQ
1.How can I place an order for XCVU29P-3FSGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU29P-3FSGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU29P-3FSGA2577E reliable?
The price and inventory of XCVU29P-3FSGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU29P-3FSGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU29P-3FSGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU29P-3FSGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU29P-3FSGA2577E?
XCVU29P-3FSGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU29P-3FSGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU29P-3FSGA2577E?
For technical support, including XCVU29P-3FSGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU29P-3FSGA2577E requirements.
6.How does Aetrix verify that XCVU29P-3FSGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU29P-3FSGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU29P-3FSGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU29P-3FSGA2577E?
All XCVU29P-3FSGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU29P-3FSGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU29P-3FSGA2577E part is unused and in its original packaging.
Return procedure for XCVU29P-3FSGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU29P-3FSGA2577E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
