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AMD XCVU31P-1FSVH1924E
- Part No.:
- XCVU31P-1FSVH1924E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCVU31P-1FSVH1924E.pdf
- Description:
- IC FPGA 208 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,570
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Product details
Overview
XCVU31P-1FSVH1924E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3175K logic cells, 112.5 GBps transceiver bandwidth (32×28.2 Gbps GTY), and integrated 100G Ethernet MAC blocks. It targets 5G wireless infrastructure baseband processing and high-throughput data center acceleration.
For engineers reviewing the XCVU31P-1FSVH1924E datasheet, pinout, applications, or equivalent options, key selection factors include GTY transceiver count and speed grade (-1), system logic capacity, on-die memory resources (UltraRAM), and thermal design power (TDP) for air-cooled rack deployment.
Technical Context
The XCVU31P-1FSVH1924E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet, DDR4 controller), and multi-rate GTY transceivers supporting PAM4 and NRZ modulation. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration occurs via dual-mode JTAG or PCIe-based configuration over PCIe (COP). The device includes dedicated clock management tiles (CMTs) with MMCM and PLL support, and supports IEEE 1149.1/1149.6 boundary scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,175,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| GTY Transceivers | 32 × 28.2 Gbps - supports 100G KR4, 40G KR4, and CPRI/OBSAI protocols |
| Block RAM | 84.7 Mb - distributed as 36 Kb BRAM primitives for on-chip buffering and FIFOs |
| UltraRAM | 576 Mb - monolithic 288 Kb RAM blocks for large, low-latency memory arrays |
| DDR4 Interface | 2 × 72-bit @ 2400 Mbps - dual-channel memory controller with ECC support |
| PCIe Interface | Gen4 x16 hard IP - full-duplex 32 GT/s link with AXI4 streaming interface |
| TDP (Typical) | 45 W - thermal envelope requiring active airflow in 1U server chassis |
Pinout & Package
Package: FSVH1924 - 1924-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 0.85 V ±3% supply for logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, I/O banks, and transceiver analog circuitry |
| MGTAVCC | GTY analog supply | 0.92 V ±2% supply for GTY transceiver analog front-end; separate filtering required |
| CLK_IN_0 | Dedicated clock input | Differential input to MRCC clock management tile; supports 10–1200 MHz reference clocks |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error |
| PROGRAM_B | Configuration control | Active-low input to initiate FPGA reconfiguration from external source or internal flash |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute fabric | Combines programmable logic, hardened DSP slices (3,552), and UltraRAM for mixed-precision AI inference acceleration |
| Hardened 100G Ethernet MAC | Integrated 100G KR4/CR4 MAC with RS-FEC and CRC offload, reducing host CPU load in O-RAN DU deployments |
| Partial reconfiguration support | Enables dynamic function swapping without system reset-critical for multi-standard radio (5G/NR + LTE) baseband upgrades |
| PCIe Gen4 x16 hard IP | Provides deterministic <1.5 μs latency for host-to-FPGA DMA transfers in smartNIC applications |
| Advanced security features | Includes AES-256 bitstream encryption, HMAC authentication, and secure boot with eFUSE key storage |
Applications
| 5G Massive MIMO Baseband Unit | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays in open RAN architectures. IC Role / Device Role / Timing Role: Primary signal processing engine implementing Layer 1 PHY functions with deterministic sub-μs latency. Use Value: Enables concurrent execution of multiple numerologies (μ=0/1/2) and supports dynamic TDD slot switching via partial reconfiguration. | Use Scenario: Offloading packet classification, TLS termination, and RDMA transport processing in cloud-native servers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, handling time-critical datapath operations. Use Value: Delivers 100 Gbps line-rate processing with <200 ns packet latency and hardware-accelerated crypto engines. |
| High-Frequency Trading Engine | Test & Measurement Instrumentation |
Use Scenario: Low-latency order matching, market data feed parsing, and risk-checking logic deployed in FPGA-accelerated trading platforms. IC Role / Device Role / Timing Role: Deterministic real-time decision engine synchronized to nanosecond-accurate PTP clocks via integrated timing IP. Use Value: Achieves end-to-end latency under 350 ns from network ingress to trade execution signal, verified with PRBS-31 jitter testing. | Use Scenario: High-resolution signal generation and analysis in modular PXIe instruments for 5G FR2 and radar waveform validation. IC Role / Device Role / Timing Role: Reconfigurable digital up/down-converter (DUC/DDC) core with real-time spectral monitoring. Use Value: Supports 2 GHz instantaneous bandwidth using 32 GTY lanes in interleaved mode with on-chip FFT and peak detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSVH2104E | Lower speed grade (-2 vs -1), 2960K logic cells, same GTY count but reduced UltraRAM (432 Mb) | Suitable for cost-optimized 40G/50G systems where 100G throughput is not required | Select when TDP budget is tighter (<40 W) and partial reconfiguration depth is lower |
| XCVU37P-1FSVA2104E | Higher logic density (3725K cells), larger package (2104-pin), +15% UltraRAM, same -1 speed grade | Required for multi-100G aggregation (e.g., 4×100G line cards) with full FEC offload | Choose when expanding beyond single 100G port or adding additional hardened IP (e.g., second PCIe Gen4 x16) |
Compared with XCVU29P-2FSVH2104E and XCVU37P-1FSVA2104E, the XCVU31P-1FSVH1924E delivers optimal balance of transceiver bandwidth, logic capacity, and thermal footprint for single-slot 100G baseband and smartNIC designs-avoiding overdesign while meeting strict latency and reconfiguration requirements.
Availability
XCVU31P-1FSVH1924E is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading systems, and test & measurement instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XCVU31P-1FSVH1924E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications such as wireless infrastructure, cloud acceleration, and advanced test equipment-designed for deterministic real-time performance and long-lifecycle reliability.
FAQ
What is the maximum supported data rate per GTY transceiver in XCVU31P-1FSVH1924E?
The XCVU31P-1FSVH1924E supports up to 28.2 Gbps per GTY transceiver lane using NRZ signaling, and 56.4 Gbps using PAM4 modulation. This enables 100G KR4/CR4 and 400G KR8 configurations when lanes are bonded. The -1 speed grade guarantees operation at this rate under specified junction temperature and voltage conditions. XCVU31P-1FSVH1924E transceiver compliance is validated per IEEE 802.3cd and OIF CEI-11G-LR standards.
Does XCVU31P-1FSVH1924E support partial reconfiguration, and what tools enable it?
Yes, XCVU31P-1FSVH1924E fully supports partial reconfiguration through Vivado Design Suite v2022.2 or later. The feature allows dynamic swapping of logical partitions without resetting the entire device, enabling runtime adaptation in multi-standard radios. XCVU31P-1FSVH1924E requires dedicated ICAP and FRAME_ECC interfaces for secure, error-corrected bitstream loading during operation.
What memory interfaces are natively supported by XCVU31P-1FSVH1924E?
XCVU31P-1FSVH1924E integrates dual 72-bit DDR4 memory controllers supporting 2400 Mbps data rates with on-die termination and ECC. It also supports LPDDR4 (up to 4266 Mbps) and RLDRAM3 (up to 2133 Mbps) via programmable I/O banks. XCVU31P-1FSVH1924E does not include native GDDR6 or HBM2 controllers-those require external PHY or soft IP implementation.
Is XCVU31P-1FSVH1924E qualified for automotive applications?
No, XCVU31P-1FSVH1924E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for commercial and industrial temperature ranges (0°C to 100°C junction), with no ASIL certification or fault-tolerant architecture. For automotive use cases, AMD offers the Xilinx Automotive (XA) variants-XCVU31P is not part of that qualified family. XCVU31P-1FSVH1924E remains appropriate for industrial and telecom environments only.
What configuration modes are supported by XCVU31P-1FSVH1924E?
XCVU31P-1FSVH1924E supports master/slave SPI, BPI, and JTAG configuration modes, plus PCIe-based configuration over PCIe (COP) for hot-pluggable systems. Configuration bitstreams can be loaded from external flash, host CPU via PCIe, or JTAG debugger. XCVU31P-1FSVH1924E requires a valid 2.5 V or 3.3 V auxiliary supply during configuration and supports dual-boot fallback for field updates.
XCVU31P-1FSVH1924E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54960
- Number of Logic Elements/Cells:
- 961800
- Total RAM Bits:
- 24746394
- Number of I/O:
- 208
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCVU31P-1FSVH1924E FAQ
1.How can I place an order for XCVU31P-1FSVH1924E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU31P-1FSVH1924E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU31P-1FSVH1924E reliable?
The price and inventory of XCVU31P-1FSVH1924E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU31P-1FSVH1924E is usually 5 days.
3.What payment methods are accepted for XCVU31P-1FSVH1924E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU31P-1FSVH1924E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU31P-1FSVH1924E?
XCVU31P-1FSVH1924E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU31P-1FSVH1924E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU31P-1FSVH1924E?
For technical support, including XCVU31P-1FSVH1924E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU31P-1FSVH1924E requirements.
6.How does Aetrix verify that XCVU31P-1FSVH1924E is sourced from the original manufacturer or authorized distributors?
All XCVU31P-1FSVH1924E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU31P-1FSVH1924E meets industry standards.
7.What is the process for return or replacement of XCVU31P-1FSVH1924E?
All XCVU31P-1FSVH1924E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU31P-1FSVH1924E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU31P-1FSVH1924E part is unused and in its original packaging.
Return procedure for XCVU31P-1FSVH1924E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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