AMD XCVU31P-3FSVH1924E

Overview

XCVU31P-3FSVH1924E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,328K logic cells, 1,536 DSP slices, and 104.5 Mb of block RAM; supports PCIe Gen4 x16, 32 GTY transceivers (32.75 Gb/s), and DDR4 memory interfaces up to 2400 MT/s; used in high-throughput data center acceleration and radar signal processing systems.

For engineers reviewing the XCVU31P-3FSVH1924E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, on-chip memory depth, DSP resource density, and thermal envelope for air-cooled compute modules.

Technical Context

The XCVU31P-3FSVH1924E implements a hardened PCIe Gen4 x16 root port and supports AXI4-Stream interfaces for high-bandwidth data ingestion. It integrates dual 100G Ethernet MACs with RS-FEC and 32 GTY transceivers configurable as PAM4 or NRZ.

Its UltraScale+ architecture uses asymmetric clocking domains for memory controllers and transceivers, enabling independent frequency scaling. The device includes hardened shell logic for partial reconfiguration and supports IEEE 1149.1/1149.6 JTAG boundary scan.

Key Specifications

Pinout & Package

Package: FSVH1924 - 1924-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermal lid, and 35×35 mm body size; designed for conduction-cooled carrier cards and high-density compute modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA compute applications.

Compared with XCVU31P-3FSVH1924E, the XCVU29P offers reduced power and footprint for constrained deployments, while the XCVU37P adds headroom for future-proofing and heterogeneous integration-neither is pin-compatible, but all three share identical I/O banking structure and toolchain support.

Availability

XCVU31P-3FSVH1924E is available at Aetrix Electronics and suitable for data center acceleration, radar signal processing, and 5G baseband applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCVU31P-3FSVH1924E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA solutions for data centers, communications, and aerospace applications.

The Virtex UltraScale+ family targets high-bandwidth, low-latency compute-intensive workloads including AI acceleration, real-time signal processing, and next-generation networking infrastructure.

FAQ

What is the maximum supported DDR4 data rate for XCVU31P-3FSVH1924E?

The XCVU31P-3FSVH1924E supports DDR4 memory interfaces operating at up to 2400 MT/s. This capability is implemented through dedicated HP I/O banks with programmable output drive strength, on-die termination, and phase-aligned clocking. The XCVU31P-3FSVH1924E achieves this rate with full JEDEC compliance and includes built-in calibration logic for write leveling and read leveling across all DIMM slots.

Does XCVU31P-3FSVH1924E include a hardened PCIe Gen4 controller?

Yes, the XCVU31P-3FSVH1924E integrates a hardened PCIe Gen4 x16 root port compliant with PCI Express Base Specification Revision 4.0. This hard IP block handles link training, transaction layer packet routing, and DMA arbitration without consuming programmable logic resources. The XCVU31P-3FSVH1924E uses this controller for low-latency, high-throughput host communication in AI accelerator cards and smart NICs.

How many GTY transceivers does XCVU31P-3FSVH1924E provide, and what is their maximum speed?

The XCVU31P-3FSVH1924E includes 32 GTY transceivers, each capable of operation up to 32.75 Gb/s in NRZ mode or 58 Gb/s in PAM4 mode. These transceivers support protocols including 100G/400G Ethernet, CPRI/eCPRI, and proprietary high-speed serial links. The XCVU31P-3FSVH1924E configures them via dedicated transceiver wizard IP and supports lane reversal, gearbox, and PRBS pattern generation.

Is partial reconfiguration supported on XCVU31P-3FSVH1924E?

Yes, the XCVU31P-3FSVH1924E supports dynamic partial reconfiguration using UltraScale+ shell logic and frame-based bitstream loading. This allows runtime swapping of functional modules-such as switching between different encryption algorithms or radar waveform generators-without resetting the entire device. The XCVU31P-3FSVH1924E implements secure configuration frames and CRC-protected bitstream segments to ensure integrity during reconfiguration.

What package type is used for XCVU31P-3FSVH1924E?

The XCVU31P-3FSVH1924E uses the FSVH1924 package: a 1924-pin Fine-Pitch Flip-Chip Ball Grid Array with 0.8 mm pitch, 35×35 mm body size, and integrated thermal lid. This package supports high-power dissipation up to 75 W under forced-air cooling and is qualified for industrial temperature range (−40°C to +100°C junction). The XCVU31P-3FSVH1924E requires controlled impedance PCB stackup and specific solder paste stencil design per AMD's packaging guidelines.