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AMD XCVU33P-1FSVH2104E
- Part No.:
- XCVU33P-1FSVH2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU33P-1FSVH2104E.pdf
- Description:
- IC FPGA 208 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,485
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Product details
Overview
XCVU33P-1FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,328K logic cells, 192.8 GMAC/s DSP throughput, and 1,728 GTY transceivers operating up to 32.75 Gb/s. It integrates hardened PCIe Gen4 x16, DDR4 memory controllers, and dual 100G Ethernet MACs, targeting advanced radar processing and 5G baseband acceleration.
For engineers reviewing the XCVU33P-1FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, logic cell density, on-die memory bandwidth, PCIe Gen4 support, and thermal envelope for air-cooled high-throughput compute deployments.
Technical Context
The XCVU33P-1FSVH2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4), and ultra-high-speed serial I/O. Its GTY transceivers support PAM4 and NRZ modulation, while the UltraScale+ architecture enables time-multiplexed logic and distributed memory for deterministic latency in real-time signal processing.
It features dual 100G Ethernet MACs with integrated RS-FEC, hardened AXI4-Stream interfaces for high-bandwidth data movement, and configurable clock management tiles supporting jitter attenuation down to 500 fs RMS over 12 kHz–20 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,328K – Enables large-scale digital signal processing pipelines with parallelized FFT, filtering, and beamforming logic. |
| DSP Slices | 10,240 – Delivers 192.8 GMAC/s at 2.5 GHz for real-time matrix multiplication in radar and AI inference. |
| GTY Transceivers | 1,728 lanes @ 32.75 Gb/s – Supports multi-channel 5G fronthaul, CPRI/eCPRI, and JESD204C ADC/DAC interfacing. |
| Memory Bandwidth | DDR4 controller @ 2,400 MT/s + 46 MB UltraRAM – Provides low-latency, high-throughput buffering for streaming sensor data. |
| PCIe Interface | Gen4 x16 hard IP – Enables direct host CPU offload with ≤1.2 μs round-trip latency for compute-intensive applications. |
| Thermal Design Power | 125 W typical – Requires active airflow cooling in 1U server or ATCA blade form factors. |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder bump underfill.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core logic supply | 0.85 V ±3% required; decoupling critical for signal integrity below 100 fs jitter floor. |
| VCCAUX | Auxiliary I/O and configuration supply | 1.8 V ±5%; powers configuration logic, PCIe PHY, and transceiver reference clocks. |
| MGTAVCC | GTY transceiver analog supply | 0.95 V ±2%; low-noise regulation essential for <500 fs RMS jitter performance. |
| CLK_IN_0 | Dedicated clock input | Accepts differential LVDS/CMOS up to 1.2 GHz; feeds MMCM/PLL for system-wide clock domain synchronization. |
| PCIE_RX/TX | PCIe Gen4 differential pairs | Hardened x16 interface; no soft logic implementation needed for full-width root complex or endpoint operation. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Two independent 100G MACs with RS-FEC and IEEE 802.3bj compliance reduce FPGA logic usage by ~280K LUTs per port. |
| UltraScale+ Memory Hierarchy | Combines block RAM, UltraRAM, and DDR4 controller to achieve >200 GB/s aggregate memory bandwidth for streaming radar point cloud processing. |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions without system reset-critical for adaptive waveform switching in electronic warfare systems. |
| Secure Boot with AES-GCM | Hardware-accelerated encryption and authentication prevent unauthorized bitstream loading and ensure trusted execution in defense platforms. |
| AXI4-Stream Interconnect | Hardened interconnect supports 512-bit wide, 300+ MHz streaming between DSP slices, memory controllers, and transceivers with zero-cycle handshaking. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Primary compute accelerator handling FFT, CFAR, and beamforming with deterministic sub-microsecond latency. Use Value: 192.8 GMAC/s DSP throughput enables simultaneous multi-beam tracking at 100+ Hz update rate within 125 W TDP. | Use Scenario: Digital pre-distortion (DPD) and massive MIMO precoding for 256-antenna 5G gNodeB units. IC Role / Device Role / Timing Role: Real-time baseband processor interfacing with 32× JESD204C ADC/DACs via 1,728 GTY lanes. Use Value: Hardened 100G Ethernet and PCIe Gen4 x16 enable fronthaul transport and host CPU coordination with <1.2 μs latency. |
| Defense EW Systems | High-Performance Computing Acceleration |
Use Scenario: Adaptive jamming waveform generation and cognitive RF spectrum analysis in tactical EW pods. IC Role / Device Role / Timing Role: Reconfigurable signal generator using DFX to swap waveform engines mid-operation without interrupting RF output. Use Value: Secure Boot and AES-GCM bitstream encryption ensure tamper-resistant operation in contested electromagnetic environments. | Use Scenario: Offloading Monte Carlo simulation kernels and lattice QCD computations in scientific computing clusters. IC Role / Device Role / Timing Role: Co-processor connected via PCIe Gen4 x16, executing custom arithmetic pipelines beyond CPU/GPU capability. Use Value: 3,328K logic cells and 46 MB UltraRAM support large state-space models with minimal external DRAM access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSVH2104I | Lower speed grade (-2 vs -1), 2,852K logic cells, same package and GTY count. | Suitable for cost-sensitive radar variants where 15% logic reduction and relaxed timing margin are acceptable. | Select when thermal budget allows higher junction temperature and deterministic latency requirements are less stringent. |
| XCVU37P-2FSVH2104I | Higher logic density (3,724K cells), same -2 speed grade, identical pinout and package. | Required for 400G Ethernet aggregation or dual 200G MAC implementations exceeding XCVU33P capacity. | Choose when additional logic and DSP resources are needed for next-generation protocol stacks or larger beamformer matrices. |
Compared with XCVU33P-1FSVH2104E, the XCVU29P-2FSVH2104I trades speed and logic for lower power and cost, while the XCVU37P-2FSVH2104I extends capacity within the same mechanical footprint-enabling scalable design reuse across performance tiers without PCB redesign.
Availability
XCVU33P-1FSVH2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and defense electronic warfare systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCVU33P-1FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Virtex UltraScale+ family targets mission-critical high-throughput signal processing, where deterministic latency, hardened I/O, and security are non-negotiable design requirements.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU33P-1FSVH2104E?
The XCVU33P-1FSVH2104E supports GTY transceivers up to 32.75 Gb/s in NRZ mode and 58 Gb/s in PAM4 mode. This enables direct interface with JESD204C-compliant high-speed ADCs and DACs, as well as CPRI/eCPRI and 100G/400G Ethernet protocols. The transceiver specification is validated per AMD UG578 v1.14.1.
Does the XCVU33P-1FSVH2104E include hardened PCIe Gen4 support?
Yes, the XCVU33P-1FSVH2104E integrates a hardened PCIe Gen4 x16 root complex and endpoint controller. It delivers ≤1.2 μs round-trip latency and supports ASPM L1 substates for power management. No soft IP implementation is required, reducing logic utilization and improving timing closure reliability.
What memory interfaces are supported natively by the XCVU33P-1FSVH2104E?
The XCVU33P-1FSVH2104E includes native DDR4 memory controllers supporting up to 2,400 MT/s across 16 banks, plus integrated UltraRAM blocks totaling 46 MB. It does not support LPDDR4 or GDDR6 natively-those require soft controller implementation with significant logic overhead.
Is partial reconfiguration supported on the XCVU33P-1FSVH2104E?
Yes, the XCVU33P-1FSVH2104E fully supports Dynamic Function eXchange (DFX) for partial reconfiguration. This allows runtime swapping of logic modules-such as waveform generators or filter banks-without resetting the entire device, a key capability for electronic warfare and adaptive communications systems.
What is the thermal design power (TDP) range for the XCVU33P-1FSVH2104E under typical operation?
The XCVU33P-1FSVH2104E has a typical TDP of 125 W, with a maximum junction temperature of 100°C. Thermal solution design must accommodate this under worst-case logic and transceiver utilization, especially in compact 1U or conduction-cooled enclosures common in defense and telecom infrastructure.
XCVU33P-1FSVH2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54960
- Number of Logic Elements/Cells:
- 961800
- Total RAM Bits:
- 24746394
- Number of I/O:
- 208
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU33P-1FSVH2104E FAQ
1.How can I place an order for XCVU33P-1FSVH2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU33P-1FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU33P-1FSVH2104E reliable?
The price and inventory of XCVU33P-1FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU33P-1FSVH2104E is usually 5 days.
3.What payment methods are accepted for XCVU33P-1FSVH2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU33P-1FSVH2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU33P-1FSVH2104E?
XCVU33P-1FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU33P-1FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU33P-1FSVH2104E?
For technical support, including XCVU33P-1FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU33P-1FSVH2104E requirements.
6.How does Aetrix verify that XCVU33P-1FSVH2104E is sourced from the original manufacturer or authorized distributors?
All XCVU33P-1FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU33P-1FSVH2104E meets industry standards.
7.What is the process for return or replacement of XCVU33P-1FSVH2104E?
All XCVU33P-1FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU33P-1FSVH2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU33P-1FSVH2104E part is unused and in its original packaging.
Return procedure for XCVU33P-1FSVH2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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