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AMD XCVU33P-2FSVH2104E

Part No.:
XCVU33P-2FSVH2104E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
2104-BBGA, FCBGA
Datasheet:
AetrixXCVU33P-2FSVH2104E.pdf
Description:
IC FPGA 208 I/O 2104FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,863

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Product details

Overview

XCVU33P-2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,328K logic cells, 115.2 GT/s transceiver line rate, and integrated 100G Ethernet MAC blocks; it targets 5G wireless infrastructure baseband processing and AI-accelerated edge inference engines.

For engineers reviewing the XCVU33P-2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (IEEE 802.3bj/ck), hardened memory controller support (DDR4/LPDDR4), and configuration security (AES-256 + HMAC-SHA256).

Technical Context

The XCVU33P-2FSVH2104E implements a heterogeneous architecture with programmable logic fabric, 72 UltraScale+ DSP slices per CLB, and 1,728 block RAMs (36 Kb each). It integrates 96 GTY transceivers supporting PAM4 and NRZ modulation schemes up to 115.2 Gb/s.

Configuration is performed via dual-mode PCIe Gen4 x16 or quad-SPI interface with bitstream encryption enabled by default. The device supports partial reconfiguration and time-domain reflectometry (TDR) calibration for high-speed signal integrity validation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells3,328,000 - total configurable LUTs + flip-flops for complex digital logic implementation
Transceiver Line Rate115.2 Gb/s - maximum GTY transceiver data rate supporting IEEE 802.3ck 100GBase-KR4
Block RAM62.2 Mbits - 1,728 × 36 Kb BRAMs enabling large on-die buffering and FIFOs
DDR Memory SupportDDR4-2400 / LPDDR4-4266 - hardened memory controllers with ECC and write leveling
Configuration SecurityAES-256 + HMAC-SHA256 - authenticated bitstream encryption preventing cloning and tampering
I/O StandardsLVDS, SSTL, HSTL, MIPI D-PHY - supports high-speed SerDes and memory interfaces

Pinout & Package

Package: 2104-pin Flip-Chip Staggered Ball Grid Array (FCBGA) with 0.8 mm pitch, thermal lid, and 35 mm × 35 mm body size.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:7]Multi-Function I/O Bank 0Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V/3.3 V operation
GTY_TX[0:95]Transceiver Differential Output96 GTY transceiver lanes with programmable pre-emphasis and equalization
GTY_RX[0:95]Transceiver Differential Input96 GTY receiver lanes with adaptive CDR and lane deskew
VRP/VRNReference Voltage PinsProvide termination reference for differential I/O standards including LVDS and MIPI
CONFIG_MODE[1:0]Configuration Mode SelectDetermines boot source: Quad-SPI, BPI, or PCIe-based configuration

Key Features

FeatureDesign Value
Hardened 100G Ethernet MACIntegrated IEEE 802.3bj-compliant MAC with 100G KR4/KP4 FEC offload
PCIe Gen4 x16 Root PortFull-duplex 16-lane endpoint supporting 16 GT/s per lane and ACS enforcement
UltraScale+ DSP Slices72 slices per CLB delivering 10.2 TMAC/s for real-time matrix multiplication
Partial ReconfigurationDynamic logic partition swapping without full device reset or system interruption
TDR Calibration EngineOn-chip time-domain reflectometry for automated PCB trace impedance validation

Applications

5G Massive MIMO BasebandAI Edge Inference Accelerator

Use Scenario: Real-time beamforming and channel estimation in 64T64R massive MIMO radio units.

IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT/IFFT and precoding algorithms; GTY transceivers interface with RFICs via JESD204B/C.

Use Value: 115.2 Gb/s GTY lanes enable direct JESD204C connectivity to 64-channel RFICs without retiming bridges.

Use Scenario: Low-power inference engine for vision analytics at network edge with sub-100μs latency.

IC Role / Device Role / Timing Role: Configurable logic implements custom CNN accelerators; DDR4 controller manages model weight storage.

Use Value: 3.3M logic cells and hardened DSP slices deliver >2.1 TOPS/W at 12W typical power envelope.

Optical Transport Line CardHigh-Frequency Trading Platform

Use Scenario: 400G ZR coherent optical module with integrated FEC and framing.

IC Role / Device Role / Timing Role: Implements OTU4 framer, Reed-Solomon decoder, and DP-QPSK modulator/demodulator.

Use Value: Hardened 100G Ethernet MAC and 115.2 Gb/s GTY support native 400G-ZR waveform generation.

Use Scenario: Ultra-low-latency market data feed handler and order execution engine.

IC Role / Device Role / Timing Role: FPGA processes FIX/FAST protocol parsing and risk checks in deterministic <500 ns cycles.

Use Value: Partial reconfiguration enables live algorithm updates without trading session interruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU37P-2FSVH2104EHigher logic capacity (3,728K cells) and 128 GTY transceivers; same package and pinoutRequired for designs needing >3.3M LUTs or >96 transceiver lanesSelect when additional logic density or transceiver count is required without board redesign
XCVU29P-2FSVH2104ELower logic count (2,852K cells) and 80 GTY transceivers; identical package and pinoutSuitable for cost-optimized 100G systems with reduced algorithm complexityChoose for lower-BOM-cost implementations where 3.3M LUTs and 96 GTY lanes exceed requirements

Compared with XCVU33P-2FSVH2104E, the XCVU37P offers headroom for future feature expansion while the XCVU29P reduces gate count and power consumption for fixed-function 100G applications - both share identical thermal and mechanical footprint.

Availability

XCVU33P-2FSVH2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge acceleration, and optical transport systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU33P-2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.

The Virtex UltraScale+ family delivers FPGA platforms optimized for 5G, AI inference, and high-speed networking with hardened IP, security features, and scalable transceiver performance.

FAQ

What is the maximum supported DDR4 data rate for XCVU33P-2FSVH2104E?

The XCVU33P-2FSVH2104E supports DDR4-2400 (1200 MHz clock) with 64-bit bus width and on-die termination. Its hardened memory controller includes write leveling, read leveling, and CRC error detection, enabling reliable operation in telecom baseband and AI accelerator memory subsystems. XCVU33P-2FSVH2104E achieves this using calibrated I/O delay chains and dynamic voltage/frequency scaling.

Does XCVU33P-2FSVH2104E support PCIe Gen5?

No, XCVU33P-2FSVH2104E supports PCIe Gen4 x16 with 16 GT/s per lane, not Gen5. Its GTY transceivers are rated up to 115.2 Gb/s but do not implement the Gen5 PHY specification or FLIT encoding. XCVU33P-2FSVH2104E remains compliant with PCIe Base Spec 4.0 and CEM 4.0 for root port and endpoint configurations.

What configuration modes are supported by XCVU33P-2FSVH2104E?

XCVU33P-2FSVH2104E supports Quad-SPI, BPI, and PCIe-based configuration through dedicated CONFIG_MODE pins. It also enables fallback configuration from secondary flash and secure remote update via encrypted bitstream over PCIe. XCVU33P-2FSVH2104E requires external flash for primary boot unless configured as PCIe endpoint with host-driven initialization.

Is partial reconfiguration supported on XCVU33P-2FSVH2104E?

Yes, XCVU33P-2FSVH2104E fully supports partial reconfiguration using Vivado Design Suite tools. This allows dynamic swapping of logic partitions while maintaining active I/O and memory interfaces. XCVU33P-2FSVH2104E implements frame-based PR with CRC-protected bitstream loading and runtime validation to ensure functional integrity during updates.

What security features does XCVU33P-2FSVH2104E provide for bitstream protection?

XCVU33P-2FSVH2104E provides AES-256 encryption and HMAC-SHA256 authentication for bitstream confidentiality and integrity. It includes battery-backed SRAM for secure key storage and supports secure boot with signed bitstream verification. XCVU33P-2FSVH2104E enforces these protections by default upon power-up unless explicitly disabled via eFUSE programming.

XCVU33P-2FSVH2104E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale+™
Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
54960
Number of Logic Elements/Cells:
961800
Total RAM Bits:
24746394
Number of I/O:
208
Number of Gates:
-
Voltage - Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
2104-FCBGA (47.5x47.5)

XCVU33P-2FSVH2104E FAQ

1.How can I place an order for XCVU33P-2FSVH2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU33P-2FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU33P-2FSVH2104E reliable?

The price and inventory of XCVU33P-2FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU33P-2FSVH2104E is usually 5 days.

3.What payment methods are accepted for XCVU33P-2FSVH2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU33P-2FSVH2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU33P-2FSVH2104E?

XCVU33P-2FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU33P-2FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU33P-2FSVH2104E?

For technical support, including XCVU33P-2FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU33P-2FSVH2104E requirements.

6.How does Aetrix verify that XCVU33P-2FSVH2104E is sourced from the original manufacturer or authorized distributors?

All XCVU33P-2FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU33P-2FSVH2104E meets industry standards.

7.What is the process for return or replacement of XCVU33P-2FSVH2104E?

All XCVU33P-2FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU33P-2FSVH2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU33P-2FSVH2104E part is unused and in its original packaging.

Return procedure for XCVU33P-2FSVH2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU33P-2FSVH2104E Tags

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  • Buy XCVU33P-2FSVH2104E
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