AMD XCVU33P-2FSVH2104E
- Part No.:
- XCVU33P-2FSVH2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU33P-2FSVH2104E.pdf
- Description:
- IC FPGA 208 I/O 2104FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCVU33P-2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,328K logic cells, 115.2 GT/s transceiver line rate, and integrated 100G Ethernet MAC blocks; it targets 5G wireless infrastructure baseband processing and AI-accelerated edge inference engines.
For engineers reviewing the XCVU33P-2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (IEEE 802.3bj/ck), hardened memory controller support (DDR4/LPDDR4), and configuration security (AES-256 + HMAC-SHA256).
Technical Context
The XCVU33P-2FSVH2104E implements a heterogeneous architecture with programmable logic fabric, 72 UltraScale+ DSP slices per CLB, and 1,728 block RAMs (36 Kb each). It integrates 96 GTY transceivers supporting PAM4 and NRZ modulation schemes up to 115.2 Gb/s.
Configuration is performed via dual-mode PCIe Gen4 x16 or quad-SPI interface with bitstream encryption enabled by default. The device supports partial reconfiguration and time-domain reflectometry (TDR) calibration for high-speed signal integrity validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,328,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| Transceiver Line Rate | 115.2 Gb/s - maximum GTY transceiver data rate supporting IEEE 802.3ck 100GBase-KR4 |
| Block RAM | 62.2 Mbits - 1,728 × 36 Kb BRAMs enabling large on-die buffering and FIFOs |
| DDR Memory Support | DDR4-2400 / LPDDR4-4266 - hardened memory controllers with ECC and write leveling |
| Configuration Security | AES-256 + HMAC-SHA256 - authenticated bitstream encryption preventing cloning and tampering |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - supports high-speed SerDes and memory interfaces |
Pinout & Package
Package: 2104-pin Flip-Chip Staggered Ball Grid Array (FCBGA) with 0.8 mm pitch, thermal lid, and 35 mm × 35 mm body size.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multi-Function I/O Bank 0 | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V/3.3 V operation |
| GTY_TX[0:95] | Transceiver Differential Output | 96 GTY transceiver lanes with programmable pre-emphasis and equalization |
| GTY_RX[0:95] | Transceiver Differential Input | 96 GTY receiver lanes with adaptive CDR and lane deskew |
| VRP/VRN | Reference Voltage Pins | Provide termination reference for differential I/O standards including LVDS and MIPI |
| CONFIG_MODE[1:0] | Configuration Mode Select | Determines boot source: Quad-SPI, BPI, or PCIe-based configuration |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Integrated IEEE 802.3bj-compliant MAC with 100G KR4/KP4 FEC offload |
| PCIe Gen4 x16 Root Port | Full-duplex 16-lane endpoint supporting 16 GT/s per lane and ACS enforcement |
| UltraScale+ DSP Slices | 72 slices per CLB delivering 10.2 TMAC/s for real-time matrix multiplication |
| Partial Reconfiguration | Dynamic logic partition swapping without full device reset or system interruption |
| TDR Calibration Engine | On-chip time-domain reflectometry for automated PCB trace impedance validation |
Applications
| 5G Massive MIMO Baseband | AI Edge Inference Accelerator |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in 64T64R massive MIMO radio units. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT/IFFT and precoding algorithms; GTY transceivers interface with RFICs via JESD204B/C. Use Value: 115.2 Gb/s GTY lanes enable direct JESD204C connectivity to 64-channel RFICs without retiming bridges. | Use Scenario: Low-power inference engine for vision analytics at network edge with sub-100μs latency. IC Role / Device Role / Timing Role: Configurable logic implements custom CNN accelerators; DDR4 controller manages model weight storage. Use Value: 3.3M logic cells and hardened DSP slices deliver >2.1 TOPS/W at 12W typical power envelope. |
| Optical Transport Line Card | High-Frequency Trading Platform |
Use Scenario: 400G ZR coherent optical module with integrated FEC and framing. IC Role / Device Role / Timing Role: Implements OTU4 framer, Reed-Solomon decoder, and DP-QPSK modulator/demodulator. Use Value: Hardened 100G Ethernet MAC and 115.2 Gb/s GTY support native 400G-ZR waveform generation. | Use Scenario: Ultra-low-latency market data feed handler and order execution engine. IC Role / Device Role / Timing Role: FPGA processes FIX/FAST protocol parsing and risk checks in deterministic <500 ns cycles. Use Value: Partial reconfiguration enables live algorithm updates without trading session interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU37P-2FSVH2104E | Higher logic capacity (3,728K cells) and 128 GTY transceivers; same package and pinout | Required for designs needing >3.3M LUTs or >96 transceiver lanes | Select when additional logic density or transceiver count is required without board redesign |
| XCVU29P-2FSVH2104E | Lower logic count (2,852K cells) and 80 GTY transceivers; identical package and pinout | Suitable for cost-optimized 100G systems with reduced algorithm complexity | Choose for lower-BOM-cost implementations where 3.3M LUTs and 96 GTY lanes exceed requirements |
Compared with XCVU33P-2FSVH2104E, the XCVU37P offers headroom for future feature expansion while the XCVU29P reduces gate count and power consumption for fixed-function 100G applications - both share identical thermal and mechanical footprint.
Availability
XCVU33P-2FSVH2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge acceleration, and optical transport systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU33P-2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Virtex UltraScale+ family delivers FPGA platforms optimized for 5G, AI inference, and high-speed networking with hardened IP, security features, and scalable transceiver performance.
FAQ
What is the maximum supported DDR4 data rate for XCVU33P-2FSVH2104E?
The XCVU33P-2FSVH2104E supports DDR4-2400 (1200 MHz clock) with 64-bit bus width and on-die termination. Its hardened memory controller includes write leveling, read leveling, and CRC error detection, enabling reliable operation in telecom baseband and AI accelerator memory subsystems. XCVU33P-2FSVH2104E achieves this using calibrated I/O delay chains and dynamic voltage/frequency scaling.
Does XCVU33P-2FSVH2104E support PCIe Gen5?
No, XCVU33P-2FSVH2104E supports PCIe Gen4 x16 with 16 GT/s per lane, not Gen5. Its GTY transceivers are rated up to 115.2 Gb/s but do not implement the Gen5 PHY specification or FLIT encoding. XCVU33P-2FSVH2104E remains compliant with PCIe Base Spec 4.0 and CEM 4.0 for root port and endpoint configurations.
What configuration modes are supported by XCVU33P-2FSVH2104E?
XCVU33P-2FSVH2104E supports Quad-SPI, BPI, and PCIe-based configuration through dedicated CONFIG_MODE pins. It also enables fallback configuration from secondary flash and secure remote update via encrypted bitstream over PCIe. XCVU33P-2FSVH2104E requires external flash for primary boot unless configured as PCIe endpoint with host-driven initialization.
Is partial reconfiguration supported on XCVU33P-2FSVH2104E?
Yes, XCVU33P-2FSVH2104E fully supports partial reconfiguration using Vivado Design Suite tools. This allows dynamic swapping of logic partitions while maintaining active I/O and memory interfaces. XCVU33P-2FSVH2104E implements frame-based PR with CRC-protected bitstream loading and runtime validation to ensure functional integrity during updates.
What security features does XCVU33P-2FSVH2104E provide for bitstream protection?
XCVU33P-2FSVH2104E provides AES-256 encryption and HMAC-SHA256 authentication for bitstream confidentiality and integrity. It includes battery-backed SRAM for secure key storage and supports secure boot with signed bitstream verification. XCVU33P-2FSVH2104E enforces these protections by default upon power-up unless explicitly disabled via eFUSE programming.
XCVU33P-2FSVH2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54960
- Number of Logic Elements/Cells:
- 961800
- Total RAM Bits:
- 24746394
- Number of I/O:
- 208
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU33P-2FSVH2104E FAQ
1.How can I place an order for XCVU33P-2FSVH2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU33P-2FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU33P-2FSVH2104E reliable?
The price and inventory of XCVU33P-2FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU33P-2FSVH2104E is usually 5 days.
3.What payment methods are accepted for XCVU33P-2FSVH2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU33P-2FSVH2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU33P-2FSVH2104E?
XCVU33P-2FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU33P-2FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU33P-2FSVH2104E?
For technical support, including XCVU33P-2FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU33P-2FSVH2104E requirements.
6.How does Aetrix verify that XCVU33P-2FSVH2104E is sourced from the original manufacturer or authorized distributors?
All XCVU33P-2FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU33P-2FSVH2104E meets industry standards.
7.What is the process for return or replacement of XCVU33P-2FSVH2104E?
All XCVU33P-2FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU33P-2FSVH2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU33P-2FSVH2104E part is unused and in its original packaging.
Return procedure for XCVU33P-2FSVH2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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