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AMD XCVU33P-3FSVH2104E
- Part No.:
- XCVU33P-3FSVH2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU33P-3FSVH2104E.pdf
- Description:
- IC FPGA 208 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,720
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Product details
Overview
XCVU33P-3FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,328K logic cells, 1,536 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference engines and 5G baseband processing.
For engineers reviewing the XCVU33P-3FSVH2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage support, thermal design power envelope, and configuration interface options (e.g., dual BPI, QSPI, JTAG).
Technical Context
The XCVU33P-3FSVH2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 25.8 Gb/s GTY transceivers, UltraScale+ memory controllers, and integrated ARM Cortex-R5F processors for real-time control. It supports multi-rate serial protocols including CPRI, eCPRI, and 100G/400G Ethernet via transceiver reconfiguration.
Configuration is performed via Master SPI or BPI mode using external flash; bitstream encryption and HMAC authentication are supported for secure boot. The device operates across industrial temperature range (–40°C to +100°C) and requires precise power sequencing per VCCINT, VCCAUX, and VCCO rail specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,328K - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 1,536 - enables parallel fixed/floating-point computation for signal processing pipelines |
| Block RAM | 96.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports 400G Ethernet, PCIe Gen4, and high-speed serial interconnects |
| I/O Pins | 1,048 user-configurable - includes support for LVDS, SSTL, HSTL, and MIPI standards |
| Speed Grade | -3 - highest timing performance bin, enabling maximum clock frequencies in critical paths |
| Package | FCBGA-2104 - 2104-ball flip-chip with 0.8 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
Package: FCBGA-2104 (2104-ball flip-chip ball grid array, 37.5 mm × 37.5 mm, 0.8 mm pitch, 1.27 mm height). Thermal pad on underside for enhanced heat transfer to PCB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to programmable logic fabric; requires low-noise regulation and tight tolerance |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, transceiver analog circuitry, and I/O banks |
| VCCO | I/O bank power | Configurable per-bank (1.2 V to 1.8 V); sets output swing and input threshold for connected peripherals |
| M0–M2 | Configuration mode pins | Determine boot source (e.g., Master SPI, BPI, JTAG) at power-on reset |
| CCLK | Configuration clock | Drives internal configuration shift register; frequency up to 100 MHz in Master SPI mode |
| INIT_B | Configuration status | Active-low open-drain signal indicating configuration success or failure |
Key Features
| Feature | Design Value |
|---|---|
| Hardened GTY transceivers | 64 lanes supporting 25.8 Gb/s with built-in PRBS generation and error detection for link validation |
| UltraScale+ memory controller | Integrated DDR4/LPDDR4 controller with ECC support, eliminating need for external PHY logic |
| Secure boot with AES-HMAC | Ensures authenticated and encrypted bitstream loading, preventing unauthorized firmware execution |
| ARM Cortex-R5F subsystem | Dual-core real-time processor with 256 KB TCM for embedded control, monitoring, and system management tasks |
| Partial reconfiguration support | Enables dynamic logic swapping without full device reboot, reducing downtime in mission-critical systems |
Applications
| 5G Massive MIMO Baseband Unit | AI Acceleration Server Card |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in sub-6 GHz and mmWave 5G NR infrastructure. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, MIMO matrix inversion, and precoding algorithms; GTY transceivers interface with RFICs via JESD204B/C. Use Value: Low-latency deterministic processing and 25.8 Gb/s JESD204C support enable 8×8 and 64×64 antenna array scalability. | Use Scenario: Hardware-accelerated inference for vision transformers and LLM tokenization in cloud data centers. IC Role / Device Role / Timing Role: Configurable logic implements custom tensor operators; PCIe Gen4 x16 provides host CPU coherency and high-bandwidth data streaming. Use Value: 3,328K logic cells and 1,536 DSP slices deliver >2x throughput vs. prior-generation FPGAs for INT8/FP16 workloads. |
| High-Performance Test Equipment | Avionics Digital Signal Processor |
Use Scenario: Multi-channel arbitrary waveform generation and real-time spectrum analysis in automated test systems. IC Role / Device Role / Timing Role: Block RAM buffers sample streams; DSP slices perform real-time FFT and digital down-conversion; GTY links feed DACs/ADCs. Use Value: On-chip 96.4 Mb RAM eliminates external memory bottlenecks, enabling sustained 2 GS/s capture and replay. | Use Scenario: Radar pulse compression and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: ARM Cortex-R5F handles deterministic I/O scheduling and health monitoring; FPGA fabric runs SAR algorithms with strict timing deadlines. Use Value: Industrial temperature rating (–40°C to +100°C) and SEU mitigation features ensure reliability in radiation-prone environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU33P-2FSVH2104I | Lower speed grade (-2), reduced max clock frequency and transceiver margin; same logic/DSP/RAM resources | Suitable for cost-sensitive 5G fronthaul where 25.8 Gb/s is not required | Select when timing closure is achievable at -2 grade and thermal budget allows higher junction temperature |
| XCVU37P-3FSVH2104E | Higher logic density (3,734K cells), additional GTY lanes (72), and larger block RAM (112.4 Mb) | Targeted at 400G+ optical transport and multi-die AI training accelerators requiring more compute headroom | Choose when XCVU33P-3FSVH2104E resource utilization exceeds 90% in critical paths or transceiver count is insufficient |
Compared with XCVU33P-2FSVH2104I, the XCVU33P-3FSVH2104E delivers higher timing margin for demanding 5G and AI workloads; versus XCVU37P-3FSVH2104E, it offers optimal balance of performance, power, and cost for single-die acceleration deployments.
Availability
XCVU33P-3FSVH2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI inference servers, and high-end test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU33P-3FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.
The Virtex UltraScale+ family targets high-bandwidth, low-latency applications in wired/wireless communications, aerospace, and data center acceleration, with emphasis on transceiver-rich, secure, and thermally robust FPGA platforms.
FAQ
What is the maximum operating temperature for the XCVU33P-3FSVH2104E?
The XCVU33P-3FSVH2104E is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is validated per AMD's thermal characterization and requires adherence to recommended PCB copper pour, thermal vias, and heatsink mounting guidelines to maintain safe operating limits under full load. The XCVU33P-3FSVH2104E datasheet defines thermal resistance values (θJA, θJB) for standard board layouts.
Does the XCVU33P-3FSVH2104E support PCIe Gen5?
No, the XCVU33P-3FSVH2104E supports PCIe Gen4 x16 natively via its hardened GTY transceivers. PCIe Gen5 capability is not implemented in this device; it lacks the required 32 Gb/s transceiver architecture and associated protocol stack. For Gen5 support, AMD recommends the Versal ACAP series or later Virtex UltraScale+ variants explicitly specified for Gen5 compliance.
Can the XCVU33P-3FSVH2104E be configured via JTAG only?
JTAG is supported for debugging and programming but not for primary configuration. The XCVU33P-3FSVH2104E requires an external configuration master (e.g., SPI flash or microcontroller) to load the bitstream at power-up. JTAG can be used for partial reconfiguration or debug access after initial configuration, but the XCVU33P-3FSVH2104E does not boot directly from JTAG without auxiliary logic.
What I/O standards are supported by the XCVU33P-3FSVH2104E?
The XCVU33P-3FSVH2104E supports LVDS, BLVDS, RSDS, mini-LVDS, TMDS, SSTL, HSTL, POD, and MIPI D-PHY across its 1,048 user I/O pins. Each I/O bank is independently configurable for voltage (1.2 V to 1.8 V) and standard, enabling mixed-voltage interfaces. The XCVU33P-3FSVH2104E does not support 3.3 V I/O standards in any bank.
Is bitstream encryption mandatory for secure boot on the XCVU33P-3FSVH2104E?
Bitstream encryption is optional but strongly recommended for secure boot. The XCVU33P-3FSVH2104E supports AES-256 encryption with HMAC-SHA-256 authentication; both features must be enabled during bitstream generation to prevent unauthorized configuration. Without encryption, the XCVU33P-3FSVH2104E will still configure successfully but lacks protection against bitstream cloning or tampering.
XCVU33P-3FSVH2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54960
- Number of Logic Elements/Cells:
- 961800
- Total RAM Bits:
- 24746394
- Number of I/O:
- 208
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU33P-3FSVH2104E FAQ
1.How can I place an order for XCVU33P-3FSVH2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU33P-3FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU33P-3FSVH2104E reliable?
The price and inventory of XCVU33P-3FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU33P-3FSVH2104E is usually 5 days.
3.What payment methods are accepted for XCVU33P-3FSVH2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU33P-3FSVH2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU33P-3FSVH2104E?
XCVU33P-3FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU33P-3FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU33P-3FSVH2104E?
For technical support, including XCVU33P-3FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU33P-3FSVH2104E requirements.
6.How does Aetrix verify that XCVU33P-3FSVH2104E is sourced from the original manufacturer or authorized distributors?
All XCVU33P-3FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU33P-3FSVH2104E meets industry standards.
7.What is the process for return or replacement of XCVU33P-3FSVH2104E?
All XCVU33P-3FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU33P-3FSVH2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU33P-3FSVH2104E part is unused and in its original packaging.
Return procedure for XCVU33P-3FSVH2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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