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AMD XCVU33P-L2FSVH2104E
- Part No.:
- XCVU33P-L2FSVH2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU33P-L2FSVH2104E.pdf
- Description:
- IC FPGA 208 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,974
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Product details
Overview
XCVU33P-L2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,328K logic cells, 1,540 DSP slices, and 92.4 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and hardened DDR4 memory controllers; deployed in AI acceleration, radar signal processing, and high-throughput data center offload.
For engineers reviewing the XCVU33P-L2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (24×25 Gb/s), I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (TDP) envelope, and configuration interface options (JTAG, Quad-SPI, BPI).
Technical Context
The XCVU33P-L2FSVH2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, and scalable transceiver banks supporting PAM4 and NRZ modulation. It integrates UltraScale+ SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and MIPI D-PHY.
Configuration is performed via Master SPI or JTAG, with dual-boot capability and AES-256 bitstream encryption. The device uses a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1,048 user I/Os distributed across 32 selectable I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,328K - determines maximum combinational/sequential logic capacity for custom datapaths and control units |
| DSP Slices | 1,540 - enables parallel fixed/floating-point computation for filtering, FFT, and matrix operations |
| Block RAM | 92.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM latency |
| Transceivers | 24 × 25 Gb/s - supports multi-lane serial protocols including PCIe Gen4, 25G Ethernet, and CPRI/eCPRI |
| User I/Os | 1,048 - configurable across 32 banks with independent voltage and standard assignment per bank |
| Memory Interface | DDR4-2400, LPDDR4-4266 - enables high-bandwidth, low-latency host memory access for streaming workloads |
| TDP | 45–75 W - defines thermal management requirements and cooling solution sizing for sustained operation |
Pinout & Package
The XCVU33P-L2FSVH2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M3 | Mode Configuration | Select boot source (SPI, BPI, JTAG) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI programming |
| DIN | Serial Data Input | Carries encrypted bitstream into FPGA during SPI configuration |
| INIT_B | Initialization Status | Open-drain output indicating successful configuration or error condition |
| PROGRAM_B | Configuration Reset | Active-low signal to initiate reconfiguration sequence |
| GND / VCCINT / VCCAUX / VCCO | Power & Ground | Separate supply domains for core logic, auxiliary circuitry, and I/O banks enable mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated endpoint/root complex blocks eliminate soft-core resource usage and guarantee timing closure |
| UltraScale+ SelectIO | Per-bank I/O voltage and standard selection allows direct interfacing with diverse peripherals without level shifters |
| AES-256 Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized cloning of configured logic |
| Hardened DDR4/LPDDR4 Controller | Reduces implementation effort and ensures deterministic timing for memory-intensive applications |
| 25G Transceiver Banks | Supports both NRZ and PAM4 signaling for flexible deployment in optical and electrical interconnects |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT pipelines; transceivers interface with ADC/DACs and RF front-ends. Use Value: 24×25 Gb/s transceivers enable high-fidelity digitized RF sample streaming; 1,540 DSP slices sustain >100 GOPS real-time compute throughput. | Use Scenario: Low-latency inference engine for vision transformers and sparse neural networks in edge servers. IC Role / Device Role / Timing Role: Configurable logic implements custom tensor operators; DDR4-2400 controller feeds weights and activations from system memory. Use Value: 92.4 Mb block RAM buffers intermediate feature maps; hardened PCIe Gen4 x16 provides 32 GB/s host-device bandwidth. |
| Data Center Offload | 5G Baseband Processing |
Use Scenario: SmartNIC functionality including packet classification, TLS offload, and RDMA acceleration. IC Role / Device Role / Timing Role: PCIe Gen4 endpoint interfaces with CPU; hardened Ethernet MACs handle 100G line-rate traffic. Use Value: 1,048 user I/Os allow concurrent connection to multiple PHYs and memory channels; TDP envelope fits within OCP NIC thermal constraints. | Use Scenario: Layer 1 physical layer processing for massive MIMO and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: FPGA fabric runs FFT/iFFT, channel coding, and precoding; transceivers link to RFICs via JESD204B/C. Use Value: 24×25 Gb/s transceivers support JESD204C at 24.33 Gbps/lane; 3,328K logic cells implement multi-sector baseband stacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-L2FSVH2104E | Fewer logic cells (2,852K), reduced DSP slices (1,320), lower TDP (35–65 W) | Suitable for cost-sensitive radar or mid-tier AI inference where full XCVU33P capacity is unused | Select when design fits within smaller resource budget and thermal envelope |
| XCVU37P-L2FSVH2104E | Higher logic density (3,784K), more DSP slices (1,720), increased block RAM (104.5 Mb) | Required for large-scale 5G baseband stacks or multi-tile AI accelerators exceeding XCVU33P capacity | Select when verified resource utilization exceeds 90% of XCVU33P-L2FSVH2104E limits |
Compared with XCVU29P-L2FSVH2104E and XCVU37P-L2FSVH2104E, the XCVU33P-L2FSVH2104E delivers balanced logic, DSP, and memory resources for demanding but not extreme workloads-enabling optimal performance-per-watt in radar, AI, and 5G infrastructure without over-provisioning.
Availability
XCVU33P-L2FSVH2104E is available at Aetrix Electronics and suitable for AI acceleration, radar signal processing, and 5G baseband development requiring stable component supply and long-term program support.
Supply support for XCVU33P-L2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Virtex UltraScale+ family targets high-performance, high-bandwidth applications demanding hardened interfaces, scalable transceivers, and deterministic memory subsystems-optimized for real-time signal processing and hardware-accelerated computing.
FAQ
What is the maximum supported data rate per transceiver lane in XCVU33P-L2FSVH2104E?
The XCVU33P-L2FSVH2104E supports up to 25.78125 Gb/s per transceiver lane using NRZ encoding, and up to 51.5625 Gb/s with PAM4 modulation. These rates are validated per UG578 and enable compliance with PCIe Gen4, 25G/50G Ethernet, and JESD204C standards. The XCVU33P-L2FSVH2104E transceiver banks are fully configurable for protocol-specific settings including pre-emphasis and equalization.
Does XCVU33P-L2FSVH2104E support DDR4 memory interfaces?
Yes, the XCVU33P-L2FSVH2104E integrates hardened DDR4 memory controllers supporting data rates up to DDR4-2400 (1,200 MHz) with up to 16 banks per controller. It also supports LPDDR4-4266. These controllers are implemented in dedicated silicon blocks, ensuring timing closure and reducing FPGA resource consumption. The XCVU33P-L2FSVH2104E documentation confirms full JEDEC-compliant operation with registered DIMMs and discrete components.
What configuration modes are supported by XCVU33P-L2FSVH2104E?
The XCVU33P-L2FSVH2104E supports Master SPI, Slave Serial, Slave Parallel (x8/x16), and JTAG configuration modes. Mode selection is controlled by M0–M3 pins at power-up. Dual-boot capability allows fallback to a secondary bitstream stored in external flash. The XCVU33P-L2FSVH2104E also supports secure configuration via AES-256 decryption and HMAC authentication.
Is XCVU33P-L2FSVH2104E pin-compatible with other Virtex UltraScale+ devices?
No, the XCVU33P-L2FSVH2104E is not pin-compatible with other Virtex UltraScale+ FPGAs-even those sharing the same 2104-pin FCBGA package-due to differences in I/O bank placement, power pin allocation, and configuration pin routing. Pinouts must be verified per UG575 for each specific part. The XCVU33P-L2FSVH2104E requires its own unique PCB layout.
What thermal management guidance applies to XCVU33P-L2FSVH2104E?
The XCVU33P-L2FSVH2104E has a thermal design power range of 45–75 W depending on configuration and operating conditions. AMD recommends a 4-layer or higher PCB with dedicated thermal vias under the thermal lid, plus an active heatsink rated for ≥1.5°C/W junction-to-ambient. Thermal simulation using UG577's θJA and ψJT values is required. The XCVU33P-L2FSVH2104E includes on-die temperature sensors accessible via JTAG or I2C for closed-loop thermal monitoring.
XCVU33P-L2FSVH2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54960
- Number of Logic Elements/Cells:
- 961800
- Total RAM Bits:
- 24746394
- Number of I/O:
- 208
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU33P-L2FSVH2104E FAQ
1.How can I place an order for XCVU33P-L2FSVH2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU33P-L2FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU33P-L2FSVH2104E reliable?
The price and inventory of XCVU33P-L2FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU33P-L2FSVH2104E is usually 5 days.
3.What payment methods are accepted for XCVU33P-L2FSVH2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU33P-L2FSVH2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU33P-L2FSVH2104E?
XCVU33P-L2FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU33P-L2FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU33P-L2FSVH2104E?
For technical support, including XCVU33P-L2FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU33P-L2FSVH2104E requirements.
6.How does Aetrix verify that XCVU33P-L2FSVH2104E is sourced from the original manufacturer or authorized distributors?
All XCVU33P-L2FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU33P-L2FSVH2104E meets industry standards.
7.What is the process for return or replacement of XCVU33P-L2FSVH2104E?
All XCVU33P-L2FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU33P-L2FSVH2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU33P-L2FSVH2104E part is unused and in its original packaging.
Return procedure for XCVU33P-L2FSVH2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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