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AMD XCVU35P-1FSVH2104E
- Part No.:
- XCVU35P-1FSVH2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU35P-1FSVH2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,508
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Product details
Overview
XCVU35P-1FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3.5M logic cells, 1,728 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-throughput data center offload applications.
For engineers reviewing the XCVU35P-1FSVH2104E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and speed grade, I/O bank voltage support (1.8 V / 1.2 V), and thermal design power (TDP) of 42 W under typical operation.
Technical Context
The XCVU35P-1FSVH2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated hardened IP including 100G Ethernet MACs and 100G Interlaken cores. Its configuration interface supports dual-boot via Quad-SPI and JTAG, with bitstream encryption using AES-256 and HMAC-SHA256.
It operates across industrial temperature range (–40°C to +100°C junction) and uses 0.85 V core voltage. The device supports partial reconfiguration and dynamic function exchange, enabling runtime hardware updates without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,524,800 - total configurable LUT/FF pairs for complex digital logic implementation |
| DSP Slices | 1,728 - fixed-point and floating-point arithmetic units supporting 27×18 multiply-accumulate |
| Block RAM | 96.4 Mb - distributed as 3,600 BRAM blocks (36 Kb each), usable for FIFOs, buffers, or lookup tables |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports PAM4 and NRZ signaling for 100G/200G/400G serial protocols |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - 896 user-configurable I/O pins across 32 banks |
| TDP | 42 W - thermal design power at typical operating conditions; requires active cooling in dense PCB layouts |
| Configuration | Quad-SPI x4 or BPI - supports secure boot with AES-256 encrypted bitstream and HMAC authentication |
Pinout & Package
Package: FSVH2104 - 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 0.85 V supply for PL fabric and CLB logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power | 1.8 V supply for configuration logic, transceivers, and I/O banks; shared across multiple functions |
| MGTAVCC | Transceiver Analog Supply | 1.0 V analog supply for GTY transceiver PLLs and serializers; sensitive to ripple & noise |
| IO_Lx_y | User I/O Bank Pin | Configurable single-ended or differential I/O; voltage level set per bank (1.2 V / 1.8 V) |
| CCLK | Configuration Clock | Input clock for master SPI configuration mode; frequency up to 100 MHz |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; pulled high during valid bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Integrated MAC layer supporting IEEE 802.3bj/bs; eliminates external PHY interface logic and reduces latency |
| PCIe Gen4 x16 Root Port | Full-duplex 16-lane endpoint with AXI4 interface; enables direct host CPU coherency via CXL-compatible memory mapping |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC; delivers >100 GB/s aggregate memory bandwidth |
| Partial Reconfiguration | Enables dynamic swapping of logic regions without resetting entire device; critical for multi-mode radar or adaptive compute workloads |
| Secure Boot with AES-256 | Hardware-accelerated decryption and HMAC verification of configuration bitstream; prevents unauthorized firmware execution |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time inference on vision transformer models in edge servers with low-latency response requirements. IC Role / Device Role / Timing Role: Programmable accelerator fabric executing custom quantized neural network layers; synchronized via deterministic AXI interconnect. Use Value: Delivers 12.4 TOPS/W efficiency using INT8 arithmetic and on-chip memory hierarchy, reducing external DRAM access by 65%. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR FR1 macro base stations. IC Role / Device Role / Timing Role: Real-time signal processor implementing adaptive FIR filters and FFT/IFFT engines; clocked from ultra-low-jitter VCXO reference. Use Value: Achieves <−50 dBc ACLR with 100 MHz instantaneous bandwidth using 64×64 MIMO antenna arrays. |
| Data Center SmartNIC Offload | Radar Signal Processing |
Use Scenario: TCP/IP stack offload, TLS termination, and RDMA acceleration in cloud server NICs. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint with integrated DMA engine and packet classification logic; time-synchronized to PTP grandmaster clock. Use Value: Reduces host CPU utilization by 42% and achieves sub-800 ns packet processing latency at 100 Gbps line rate. | Use Scenario: Pulse-Doppler processing and CFAR detection in automotive long-range imaging radar. IC Role / Device Role / Timing Role: High-speed ADC interface controller and real-time beamformer; triggered by precise 10 ns resolution timing generator. Use Value: Enables 0.1° angular resolution at 77 GHz with 4D point cloud generation at 30 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU37P-2FSVH2104I | Higher speed grade (–2), 4.1M logic cells, 2,016 DSP slices, TDP = 48 W | Required for designs needing >200 MHz system clock or tighter timing closure in large datapaths | Select when timing margin is insufficient on XCVU35P-1FSVH2104E, especially for 5G L1 control loops or AI model partitioning |
| XCVU29P-1FSVH2104E | Fewer resources: 2.5M logic cells, 1,248 DSP slices, 68.4 Mb BRAM, same package | Suitable for cost-optimized 5G small cell or mid-tier SmartNIC where full XCVU35P capacity is unused | Choose for BOM cost reduction where logic utilization stays below 75% and transceiver count ≤ 48 lanes |
Compared with XCVU35P-1FSVH2104E, the XCVU37P-2FSVH2104I offers higher performance headroom at increased power and cost, while the XCVU29P-1FSVH2104E provides identical footprint and I/O compatibility with reduced resource density for streamlined deployment.
Availability
XCVU35P-1FSVH2104E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G massive MIMO baseband processing, and data center SmartNIC offload requiring stable component supply across multi-year production cycles.
Supply support for XCVU35P-1FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, networking, and embedded systems.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications including 5G infrastructure, AI acceleration, and aerospace-grade reconfigurable computing.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCVU35P-1FSVH2104E?
The XCVU35P-1FSVH2104E supports up to 25.8 Gb/s per GTY transceiver lane using NRZ modulation, and 51.6 Gb/s using PAM4. This capability enables native 100G, 200G, and 400G Ethernet implementations without gearbox logic. The XCVU35P-1FSVH2104E transceivers are fully compliant with IEEE 802.3bs and OIF CEI-28G-VSR specifications.
Does XCVU35P-1FSVH2104E support partial reconfiguration?
Yes, the XCVU35P-1FSVH2104E supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logic modules without resetting the entire device. This feature is used in XCVU35P-1FSVH2104E-based radar systems to switch between waveform modes or update DPD coefficients in real time.
What configuration modes are supported by XCVU35P-1FSVH2104E?
The XCVU35P-1FSVH2104E supports Master SPI (Quad-SPI x4), Slave SelectMAP, JTAG, and BPI configuration modes. Secure configuration is enabled via AES-256 bitstream encryption and HMAC-SHA256 authentication, both implemented in dedicated on-die hardware within the XCVU35P-1FSVH2104E.
What is the I/O voltage range supported by XCVU35P-1FSVH2104E banks?
The XCVU35P-1FSVH2104E supports I/O voltages of 1.2 V and 1.8 V across its 32 configurable I/O banks. Each bank is independently powered, enabling mixed-voltage interfaces such as DDR4 (1.2 V) alongside legacy peripherals (1.8 V). The XCVU35P-1FSVH2104E does not support 3.3 V I/O standards.
Is XCVU35P-1FSVH2104E qualified for industrial temperature operation?
Yes, the XCVU35P-1FSVH2104E is rated for industrial temperature range (–40°C to +100°C junction temperature) and is supplied in the FSVH2104 package with thermal lid. Thermal management must account for its 42 W typical TDP, and the XCVU35P-1FSVH2104E requires validated heatsink and airflow per AMD UG578 guidelines.
XCVU35P-1FSVH2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 108960
- Number of Logic Elements/Cells:
- 1906800
- Total RAM Bits:
- 49597645
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU35P-1FSVH2104E FAQ
1.How can I place an order for XCVU35P-1FSVH2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU35P-1FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU35P-1FSVH2104E reliable?
The price and inventory of XCVU35P-1FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU35P-1FSVH2104E is usually 5 days.
3.What payment methods are accepted for XCVU35P-1FSVH2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU35P-1FSVH2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU35P-1FSVH2104E?
XCVU35P-1FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU35P-1FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU35P-1FSVH2104E?
For technical support, including XCVU35P-1FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU35P-1FSVH2104E requirements.
6.How does Aetrix verify that XCVU35P-1FSVH2104E is sourced from the original manufacturer or authorized distributors?
All XCVU35P-1FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU35P-1FSVH2104E meets industry standards.
7.What is the process for return or replacement of XCVU35P-1FSVH2104E?
All XCVU35P-1FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU35P-1FSVH2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU35P-1FSVH2104E part is unused and in its original packaging.
Return procedure for XCVU35P-1FSVH2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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