AMD XCVU35P-2FSVH2104E

Overview

XCVU35P-2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3.5M logic cells, 19.2 GT/s transceivers, and integrated HBM2 memory controller supporting up to 256 GB/s memory bandwidth. It targets AI acceleration, 5G baseband processing, and high-throughput data center workloads.

For engineers reviewing the XCVU35P-2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include HBM2 interface support, transceiver lane count (64), I/O voltage flexibility (1.2 V/1.35 V/1.8 V), and thermal design power (TDP) of 75 W under typical configuration.

Technical Context

The XCVU35P-2FSVH2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4 x16, 100G Ethernet MAC, and DDR4/HBM2 memory controllers. Its transceivers support PAM4 and NRZ modulation schemes across 64 lanes.

It integrates dual 100G Ethernet cores, AXI-Interconnect infrastructure, and configurable DSP slices optimized for INT8/INT16 matrix operations. The device uses 16nm FinFET process technology and supports partial reconfiguration.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Staggered Ball Grid Array (FC-SBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU35P-2FSVH2104E, the XCVU37P offers higher compute density at increased power, while the XCVU29P retains critical I/O and memory interface compatibility at reduced logic scale-enabling scalable FPGA deployment across performance tiers.

Availability

XCVU35P-2FSVH2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and high-performance computing applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XCVU35P-2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and client devices.

The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for compute-intensive applications demanding HBM2 integration, hardened 100G networking, and PCIe Gen4 connectivity.

FAQ

What is the maximum supported HBM2 memory bandwidth for XCVU35P-2FSVH2104E?

The XCVU35P-2FSVH2104E supports up to 256 GB/s aggregate bandwidth via its integrated dual-channel HBM2 controller. This bandwidth is achieved using two 1024-bit wide interfaces operating at 1.6 Gbps per pin, enabling sustained throughput for AI model loading and real-time tensor streaming without external memory bottlenecks. The XCVU35P-2FSVH2104E does not require external PHY or interface logic to achieve this rate.

Does XCVU35P-2FSVH2104E support PCIe Gen5?

No, XCVU35P-2FSVH2104E integrates hardened PCIe Gen4 x16 endpoints only. It does not support PCIe Gen5 signaling or protocol features. Designs requiring Gen5 must use newer Versal or next-generation Virtex families. The XCVU35P-2FSVH2104E maintains full backward compatibility with Gen3 and Gen4 root complexes and switches.

What thermal solution is recommended for XCVU35P-2FSVH2104E in continuous operation?

A forced-air heatsink rated for ≥75 W TDP with ≥3 m/s airflow across a 49 mm × 49 mm footprint is recommended for XCVU35P-2FSVH2104E. Thermal interface material with ≤0.15 °C·in²/W resistance and copper baseplate construction ensures junction temperature remains within −40°C to 100°C operational limits. The XCVU35P-2FSVH2104E includes on-die thermal sensors accessible via JTAG or I2C for closed-loop monitoring.

Can XCVU35P-2FSVH2104E be used with standard PCB materials like FR-4?

Yes, XCVU35P-2FSVH2104E is qualified for use with standard FR-4 PCBs meeting IPC-4101/126 specifications. Its 0.8 mm pitch FC-SBGA package supports standard microvia and HDI stackups. Designers must observe controlled impedance routing for HRIO banks and maintain ≥8-mil spacing between HBM2 clock traces and noisy digital nets. The XCVU35P-2FSVH2104E reference designs validate FR-4 compatibility up to 19.2 GT/s operation.

Is partial reconfiguration supported on XCVU35P-2FSVH2104E?

Yes, XCVU35P-2FSVH2104E fully supports partial reconfiguration through Vivado Design Suite v2022.2+. This allows dynamic swapping of logical partitions-such as changing encryption engines or filter coefficients-without resetting the entire device or disrupting active transceiver links. The XCVU35P-2FSVH2104E implements dedicated configuration port logic and frame-based update mechanisms compliant with IEEE 1532.