AMD XCVU35P-2FSVH2892E
- Part No.:
- XCVU35P-2FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU35P-2FSVH2892E.pdf
- Description:
- IC FPGA 416 I/O 2892FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCVU35P-2FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,314,560 logic cells, 1,472 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference accelerators.
For engineers reviewing the XCVU35P-2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal design power envelope, and configuration interface options (e.g., dual BPI, QSPI, JTAG).
Technical Context
The XCVU35P-2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and scalable memory interfaces. It supports multi-rate transceivers operating from 1.25 to 25.8 Gb/s with built-in PRBS generation and error detection.
Configuration is supported via master/slave SPI, BPI, or JTAG, with AES-256 bitstream encryption and HMAC authentication. The device uses a 2892-pin Flip-Chip Ball Grid Array (FCBGA) package with 1,152 user I/Os distributed across 32 selectable I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,314,560 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 1,472 - enables parallel fixed/floating-point computation for AI/ML workloads |
| Block RAM | 104.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables |
| GTY Transceivers | 40 lanes @ 25.8 Gb/s - supports 100G Ethernet, PCIe Gen4, and coherent optical interfaces |
| User I/Os | 1,152 - configurable across 32 banks with support for LVDS, SSTL, HSTL, and MIPI |
| Speed Grade | -2 - guarantees timing closure at highest performance tier for critical paths |
| Configuration Interface | Quad-SPI, BPI, JTAG - enables secure, flexible, and field-upgradable bitstream loading |
Pinout & Package
Package: 2892-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, SelectIO, and transceiver reference circuits |
| VCCO | I/O bank power | Per-bank voltage (1.2–1.8 V) sets signaling standard compatibility and drive strength |
| MGTAVCC / MGTAVTT | Transceiver analog/digital supply | Separate 1.0 V analog and 1.2 V termination supplies for GTY transceiver stability |
| CONFIG_IO[0:3] | Configuration mode pins | Determine boot source (QSPI/BPI/JTAG) and configuration width during power-on reset |
| INIT_B / PROGRAM_B | Configuration control | Indicate configuration status and allow reconfiguration without full power cycle |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| DDR4 memory interface (up to 2,400 MT/s) | Enables direct connection to high-speed system memory with calibrated write leveling and read deskew |
| AES-256 + HMAC bitstream security | Prevents reverse engineering and unauthorized configuration through authenticated encryption |
| Partial Reconfiguration support | Allows dynamic logic module swapping during operation for multi-function time-sharing |
| UltraScale+ routing architecture | Delivers predictable timing convergence and reduced congestion in large, dense designs |
Applications
| AI Inference Accelerator | 5G Baseband Processing |
|---|---|
Use Scenario: Real-time neural network inference on edge servers with low-latency response requirements. IC Role / Device Role / Timing Role: Configurable accelerator fabric executing custom quantized CNN layers with streaming data flow. Use Value: 1,472 DSP slices and 25.8 Gb/s GTY transceivers enable >10 TOPS/W efficiency and 100G interconnect to host CPU. | Use Scenario: Layer 1 physical layer processing in massive MIMO radio units with real-time FFT and channel estimation. IC Role / Device Role / Timing Role: High-throughput signal processing engine implementing OFDM modulation/demodulation and beamforming kernels. Use Value: Hardened 100G Ethernet MAC and deterministic latency routing support fronthaul transport over eCPRI. |
| High-Frequency Trading Engine | Test & Measurement Equipment |
Use Scenario: Sub-microsecond order execution pipeline with deterministic packet parsing and decision logic. IC Role / Device Role / Timing Role: Low-latency packet classifier and action engine interfacing directly to 10/25/100GbE NICs. Use Value: -2 speed grade and dedicated transceiver clocking ensure <800 ps jitter on 100G links for time-critical market data. | Use Scenario: Modular signal analyzer with real-time spectrum analysis and protocol decoding up to 25 GHz. IC Role / Device Role / Timing Role: Reconfigurable digital backend synchronizing ADC/DAC sampling, FFT engines, and display rendering. Use Value: 104.5 Mb block RAM buffers multi-GSample waveforms; GTY transceivers feed data to external high-speed DACs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU37P-2FSVH2892E | Higher logic density (3,859,520 LCs), same package and pinout | Better suited for larger algorithm partitions requiring more LUTs and registers | Select when design exceeds XCVU35P resource utilization by >15% but retains identical I/O and thermal constraints |
| XCVU29P-2FSVH2892E | Fewer logic cells (2,179,840) and DSP slices (1,152), same GTY count and package | Targeted at cost-optimized 5G small cell or mid-tier test equipment | Choose when transceiver count and bandwidth are critical but logic resources can be reduced without redesign |
Compared with XCVU35P-2FSVH2892E, the XCVU37P offers headroom for future feature expansion while sharing thermal and PCB layout constraints, whereas the XCVU29P reduces unit cost and power at the expense of compute density-both require no board revision due to identical 2892-pin FCBGA mapping.
Availability
XCVU35P-2FSVH2892E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G baseband systems, and high-frequency trading platforms requiring stable component supply across multi-year production cycles.
Supply support for XCVU35P-2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.
The Virtex UltraScale+ family targets high-performance, high-bandwidth applications such as AI acceleration, 5G infrastructure, and advanced test equipment where deterministic latency, hardened IP, and power-efficient scalability are essential.
FAQ
What is the maximum data rate supported by the GTY transceivers in XCVU35P-2FSVH2892E?
The XCVU35P-2FSVH2892E features 40 GTY transceiver lanes each supporting up to 25.8 Gb/s. This enables protocols including PCIe Gen4, 100G Ethernet, and CPRI/eCPRI. The actual achievable rate depends on board layout, reference clock quality, and equalization settings configured in Vivado.
Does XCVU35P-2FSVH2892E support partial reconfiguration?
Yes, XCVU35P-2FSVH2892E fully supports partial reconfiguration through the Vivado Design Suite. This allows dynamic swapping of logic modules during runtime, enabling time-multiplexed functionality in applications like multi-standard radio or adaptive test instrumentation without full device reboot.
What configuration modes are available for XCVU35P-2FSVH2892E?
XCVU35P-2FSVH2892E supports Quad-SPI, BPI (x16/x32), and JTAG configuration modes. Mode selection is controlled by CONFIG_IO pins at power-on. Dual BPI mode allows redundant bitstream storage, while QSPI enables compact, low-pin-count boot from serial flash.
What is the thermal design power (TDP) range for XCVU35P-2FSVH2892E under typical operation?
XCVU35P-2FSVH2892E has a typical TDP range of 35–55 W depending on resource utilization, transceiver activity, and I/O switching frequency. Full utilization with all GTY lanes active at 25.8 Gb/s and DDR4 interfaces running at 2,400 MT/s approaches the upper bound, requiring active cooling per AMD UG578 guidelines.
Is XCVU35P-2FSVH2892E pin-compatible with other Virtex UltraScale+ devices in the same package?
Yes, XCVU35P-2FSVH2892E shares the 2892-pin FCBGA package footprint and pinout with XCVU29P-2FSVH2892E and XCVU37P-2FSVH2892E. This enables hardware reuse across performance tiers, though configuration bitstreams and power delivery must be validated per device's specific resource map and voltage requirements.
XCVU35P-2FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 108960
- Number of Logic Elements/Cells:
- 1906800
- Total RAM Bits:
- 49597645
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU35P-2FSVH2892E FAQ
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The price and inventory of XCVU35P-2FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU35P-2FSVH2892E is usually 5 days.
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6.How does Aetrix verify that XCVU35P-2FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU35P-2FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU35P-2FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU35P-2FSVH2892E?
All XCVU35P-2FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU35P-2FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU35P-2FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU35P-2FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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