AMD XCVU35P-3FSVH2104E

Overview

XCVU35P-3FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,575K logic cells, 1,248 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.

For engineers reviewing the XCVU35P-3FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic capacity, memory bandwidth, and thermal envelope for air-cooled accelerator modules.

Technical Context

The XCVU35P-3FSVH2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP including PCIe Gen4 root complex, 100G Ethernet MAC, and DDR4 memory controllers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Its 2104-pin Flip-Chip BGA (FCBGA) package enables high I/O count (832 user I/Os) with support for multiple I/O standards including LVDS, SSTL, and HSTL. The -3 speed grade guarantees timing closure at 300 MHz system clock with 25.8 Gb/s serial link operation.

Key Specifications

Pinout & Package

The XCVU35P-3FSVH2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for active cooling integration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU35P-3FSVH2104E, the XCVU37P offers headroom for future feature expansion without PCB change, while the XCVU29P reduces BOM cost and power by 18% at the expense of maximum clock frequency and logic capacity.

Availability

XCVU35P-3FSVH2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and optical transport network line cards requiring stable component supply across multi-year production cycles.

Supply support for XCVU35P-3FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense applications.

The Virtex UltraScale+ family targets high-throughput, low-latency signal and packet processing in mission-critical infrastructure where deterministic performance and long-term obsolescence management are essential.

FAQ

What is the maximum supported data rate for GTY transceivers in XCVU35P-3FSVH2104E?

The XCVU35P-3FSVH2104E supports GTY transceivers up to 25.8 Gb/s per lane, validated for protocols including JESD204C, 100G Ethernet, and PCIe Gen4. This rate is guaranteed under the -3 speed grade with proper board-level signal integrity design and thermal management.

Does XCVU35P-3FSVH2104E include a hardened PCIe Gen4 controller?

Yes, the XCVU35P-3FSVH2104E integrates a hardened PCIe Gen4 x16 root complex block, eliminating the need for soft IP implementation and ensuring compliance with PCIe 4.0 specification, including ASPM and AER features.

What memory interface standards does XCVU35P-3FSVH2104E support?

The XCVU35P-3FSVH2104E supports DDR4 (up to 2400 MT/s), LPDDR4 (up to 4266 MT/s), and QDR-IV SRAM (up to 2000 MT/s) via dedicated memory controller hard IP, with configurable data widths and ECC support for DDR4/LPDDR4.

Is partial reconfiguration supported on XCVU35P-3FSVH2104E?

Yes, XCVU35P-3FSVH2104E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module swaps during runtime-critical for multi-standard wireless baseband or adaptive radar waveform updates.

What is the thermal design power (TDP) range for XCVU35P-3FSVH2104E under typical operating conditions?

The XCVU35P-3FSVH2104E has a typical TDP range of 35–48 W depending on logic utilization, transceiver activity, and I/O switching. Full-speed operation with all GTY lanes active and 90% logic usage reaches the upper end of this range.