AMD XCVU35P-3FSVH2892E
- Part No.:
- XCVU35P-3FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU35P-3FSVH2892E.pdf
- Description:
- IC FPGA 416 I/O 2892FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,662
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Product details
Overview
XCVU35P-3FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,574K logic cells, 1,440 DSP slices, and 116.5 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -3 speed grade with extended temperature range (-40°C to +100°C). Used in high-throughput radar signal processing systems requiring deterministic latency and real-time FFT acceleration.
For engineers reviewing the XCVU35P-3FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.8 V / 1.5 V / 1.35 V / 1.2 V), and configuration security options (AES-256 bitstream encryption).
Technical Context
The XCVU35P-3FSVH2892E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency transceivers. Its UltraScale+ architecture uses 16 nm FinFET process technology and includes dedicated routing for time-critical paths in aerospace and defense avionics.
It supports partial reconfiguration, dynamic function exchange, and system-level power management via integrated PMBus interface. The device includes dual-core ARM Cortex-A53 processor subsystem (PS) with 64-bit AXI interconnect and configurable cache coherency for heterogeneous compute offload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,574,000 - Enables large-scale digital signal processing pipelines with >10k parallel MAC operations per cycle. |
| DSP Slices | 1,440 - Supports simultaneous 27×18-bit multiply-accumulate operations at 500 MHz for radar beamforming. |
| Block RAM | 116.5 Mb - Provides on-chip buffering for multi-channel 4K video frame capture at 60 fps without external DRAM. |
| Transceiver Line Rate | 32.75 Gb/s - Enables direct connection to 100G QSFP28 optical modules without gearbox ICs. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Allows native interfacing with image sensors, ADCs, and high-speed serial links. |
| Configuration Security | AES-256 + HMAC-SHA256 - Prevents unauthorized bitstream cloning and runtime tampering in certified systems. |
| Speed Grade | -3 - Guarantees timing closure at maximum operating frequency under worst-case voltage/temperature conditions. |
Pinout & Package
The XCVU35P-3FSVH2892E is housed in a 2892-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O (PS) | Configurable as GPIO, SDIO, UART, SPI, or CAN FD controller pins for embedded processor subsystem. |
| HR Bank 0–3 | High-Range I/O | Supports 1.8 V / 1.5 V / 1.35 V / 1.2 V standards with programmable slew rate and drive strength for mixed-voltage board design. |
| HP Bank 4–13 | High-Performance I/O | Enables DDR4-2400 x72 interfaces with on-die termination and calibrated input delay for sub-100 ps timing margin. |
| GTH Transceivers | UltraScale+ Serial I/O | 32 lanes operating up to 32.75 Gb/s with built-in PRBS generator/checker for link validation. |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate regulated supplies for core (0.85 V), auxiliary (1.8 V), and I/O banks enable independent power domain control. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort by eliminating soft IP synthesis and verification for host interface compliance. |
| Dual-core ARM Cortex-A53 PS | Enables Linux-based firmware execution alongside programmable logic for hybrid control/data-path architectures. |
| UltraScale+ Memory Controller | Delivers 128 GB/s peak bandwidth to DDR4-2400 memory with ECC support for mission-critical data integrity. |
| Partial Reconfiguration Support | Allows runtime logic module swapping without system reset-critical for adaptive EW and cognitive radio applications. |
| Integrated PMBus Interface | Enables real-time monitoring of rail voltages, die temperature, and power consumption via standard system management bus. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing for airborne AESA radar with 1,024-element antenna array. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and beam steering algorithms; transceivers interface directly with RFIC JESD204B links. Use Value: Achieves <5 µs latency from ADC sample to target detection decision using deterministic clocking and hard IP acceleration. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 3.5 GHz 5G NR base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD lookup tables and inverse FFT; hardened Ethernet MAC handles fronthaul transport. Use Value: Supports 8×8 MIMO with 100 MHz carrier bandwidth and <1% EVM using 27×18-bit DSP slice chaining. |
| Avionics Display Generation | Medical CT Image Reconstruction |
Use Scenario: ARINC 661-compliant cockpit display unit rendering synthetic vision and sensor fusion overlays. IC Role / Device Role / Timing Role: PL processes multi-source video streams (ARINC 818, LVDS); PS runs safety-certified ARINC 653 OS. Use Value: Meets DO-254 DAL-A timing requirements with lockstep dual-core A53 and hardware-assisted partitioning. | Use Scenario: Real-time back-projection and iterative reconstruction for 128-slice CT scanners. IC Role / Device Role / Timing Role: FPGA accelerates sinogram-to-volume conversion; DDR4 controller manages 256 GB/s memory bandwidth to GPU co-processor. Use Value: Reduces reconstruction time from 45 s to 8.2 s per full-body scan while maintaining NEMA NU-2 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU37P-3FSVH2892E | Higher logic capacity (3,852K cells), same package and pinout, +10% DSP slices, identical transceiver specs. | Suitable for larger beamformer designs requiring >128 channels or additional soft CPU cores. | Select when design requires headroom beyond current resource utilization without changing PCB layout. |
| XCVU29P-3FSVH2892E | Reduced logic (2,825K cells), same speed grade and package, -15% block RAM, identical I/O and transceiver capabilities. | Targeted at cost-sensitive phased-array radar variants with fewer simultaneous beams. | Choose for lower-BOM-cost implementation where logic utilization remains below 75% and no additional DSP resources are needed. |
Compared with XCVU35P-3FSVH2892E, the XCVU37P variant offers verified scalability for future-proofing, while the XCVU29P provides validated cost reduction without sacrificing interface compatibility or thermal envelope-both retain identical pinout, power delivery, and cooling requirements.
Availability
XCVU35P-3FSVH2892E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband, avionics display generation, and medical imaging systems requiring stable component supply across long product lifecycles.
Supply support for XCVU35P-3FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and safety-critical applications in aerospace, defense, wired/wireless infrastructure, and medical imaging systems.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCVU35P-3FSVH2892E?
The XCVU35P-3FSVH2892E supports DDR4-2400 memory interfaces with x72 data width. This is implemented via hardened memory controller IP with on-die termination calibration and write-leveling circuitry. The interface delivers up to 128 GB/s peak bandwidth and supports ECC for error correction. Timing closure is guaranteed at -3 speed grade across the full industrial temperature range.
Does the XCVU35P-3FSVH2892E include a processor subsystem?
Yes, the XCVU35P-3FSVH2892E integrates a dual-core ARM Cortex-A53 processor subsystem (PS) with 64-bit AXI interconnect, 32 KB L1 instruction and data caches per core, and 1 MB shared L2 cache. The PS runs independently of the programmable logic (PL) and supports Linux, FreeRTOS, and safety-certified RTOS environments. It communicates with PL via AXI GP/HP/ACP ports.
What transceiver protocols does the XCVU35P-3FSVH2892E natively support?
The XCVU35P-3FSVH2892E includes 32 GTH transceivers supporting native protocols including PCIe Gen4 x16, 100G Ethernet (CAUI-4), CPRI v7.0, JESD204B/C, and SATA 3.0. Each transceiver lane operates up to 32.75 Gb/s with built-in PRBS pattern generation and checking. Protocol selection is configured at runtime via GT wizard IP and does not require external retimers.
Is the XCVU35P-3FSVH2892E qualified for extended temperature operation?
Yes, the XCVU35P-3FSVH2892E is rated for operation from -40°C to +100°C junction temperature and is specified for extended temperature applications. It meets JEDEC JESD22-A104 reliability testing and is commonly deployed in conduction-cooled avionics and ground-based radar enclosures. Thermal design must maintain case temperature ≤ 95°C under full load using appropriate heatsinking.
What security features are implemented in the XCVU35P-3FSVH2892E configuration flow?
The XCVU35P-3FSVH2892E implements AES-256 bitstream encryption, HMAC-SHA256 authentication, and secure boot with RSA-4096 signature verification. Configuration occurs only after successful cryptographic validation. Bitstream decryption keys are stored in eFUSE and cannot be read out. Secure debug access requires authenticated JTAG session with certificate-based challenge-response handshake.
XCVU35P-3FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 108960
- Number of Logic Elements/Cells:
- 1906800
- Total RAM Bits:
- 49597645
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU35P-3FSVH2892E FAQ
1.How can I place an order for XCVU35P-3FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU35P-3FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU35P-3FSVH2892E reliable?
The price and inventory of XCVU35P-3FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU35P-3FSVH2892E is usually 5 days.
3.What payment methods are accepted for XCVU35P-3FSVH2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU35P-3FSVH2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU35P-3FSVH2892E?
XCVU35P-3FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU35P-3FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU35P-3FSVH2892E?
For technical support, including XCVU35P-3FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU35P-3FSVH2892E requirements.
6.How does Aetrix verify that XCVU35P-3FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU35P-3FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU35P-3FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU35P-3FSVH2892E?
All XCVU35P-3FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU35P-3FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU35P-3FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU35P-3FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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