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AMD XCVU35P-L2FSVH2104E
- Part No.:
- XCVU35P-L2FSVH2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU35P-L2FSVH2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,269
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Product details
Overview
XCVU35P-L2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3.5M logic cells, 114.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets advanced radar processing, 5G baseband acceleration, and AI inference at the edge.
For engineers reviewing the XCVU35P-L2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal performance in air-cooled 2104-pin FC-BGA packages.
Technical Context
The XCVU35P-L2FSVH2104E implements a hardened ARM Cortex-R5 dual-core processor subsystem alongside programmable logic fabric, enabling heterogeneous compute architectures. It integrates 72 UltraScale+ DSP slices operating at 3.0 GHz and supports deterministic real-time execution via lockstep R5 cores.
This device uses 16 nm FinFET process technology and includes integrated 100G Ethernet MACs, AXI-CDMA controllers, and configurable clock management tiles with ±10 ppm stability over temperature for synchronous data acquisition systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,524,000 - Enables large-scale digital signal processing pipelines with low-latency loop closure. |
| Block RAM | 114.8 Mb - Supports multi-channel FFT buffers and frame-based video streaming without external memory. |
| Transceiver Rate | 25.8 Gb/s - Meets CPRI/eCPRI fronthaul interface requirements for massive MIMO radios. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Allows direct interfacing to image sensors, ADCs, and memory without level-shifting. |
| Package | FC-BGA 2104 - 35 mm × 35 mm footprint with 0.8 mm pitch; qualified for industrial temperature range (–40°C to +100°C). |
| PCIe Interface | Gen4 x16 - Provides 32 GB/s bidirectional bandwidth for host-FPGA co-processing in server-class accelerators. |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FC-BGA) with 2104 I/O balls, 35 mm × 35 mm body, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic and CLB fabric; requires low-noise regulation. |
| VCCAUX | Auxiliary power | Provides 1.8 V to configuration circuitry, transceivers, and clock management tiles. |
| MGTAVCC | Transceiver analog supply | Delivers 0.92 V ±2% to high-speed serial transceiver analog circuitry for jitter compliance. |
| MR | Master reset | Active-low asynchronous reset that clears configuration registers and halts all logic operation. |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration failure. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened ARM Cortex-R5 dual-core subsystem | Enables real-time control firmware execution independent of PL fabric, reducing latency in closed-loop systems. |
| UltraScale+ DSP slices (72 units) | Delivers 216 GMAC/s peak compute for fixed-point matrix operations in beamforming and channel estimation. |
| Integrated 100G Ethernet MAC | Reduces external PHY count and PCB area in high-throughput packet processing applications like network telemetry. |
| AXI-CDMA controller | Accelerates memory-mapped data transfers between DDR4 and PL without CPU intervention, improving throughput efficiency. |
| Configurable clock management tiles | Supports phase-aligned multi-clock domains for mixed-signal synchronization in RF sampling systems. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and STAP for airborne AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes beam steering algorithms while R5 cores manage scan scheduling and health monitoring. Use Value: 25.8 Gb/s transceivers interface directly to RFSoC ADC/DAC tiles, eliminating intermediate serialization layers. | Use Scenario: Layer 1 physical layer acceleration for 5G NR gNodeB units with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Implements OFDM modulation/demodulation, channel coding, and precoding in parallel hardware pipelines. Use Value: 3.5M logic cells enable concurrent processing of 16 spatial streams with sub-100 ns latency. |
| AI Edge Inference Accelerator | High-Speed Data Acquisition System |
Use Scenario: On-device CNN inference for autonomous vehicle perception using fused camera/LiDAR inputs. IC Role / Device Role / Timing Role: Configurable logic runs quantized neural network kernels; R5 cores handle sensor fusion and decision arbitration. Use Value: Block RAM capacity supports full model residency (e.g., ResNet-18) without off-chip DRAM access bottlenecks. | Use Scenario: Multi-channel oscilloscope capturing 16 synchronized 1 GS/s ADC streams. IC Role / Device Role / Timing Role: Synchronizes sampling clocks, buffers raw data in BRAM, and formats packets for PCIe Gen4 uplink. Use Value: Deterministic timing from clock management tiles ensures <±50 ps inter-channel skew across all 16 channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-L2FSVH2104E | 2.9M logic cells, 93.2 Mb BRAM, identical package and transceiver specs. | Suitable for lower-complexity 5G L1 stacks or mid-tier radar variants with reduced channel count. | Select when design fits within 85% of XCVU35P resource utilization to reduce cost and power. |
| XCVU37P-L2FSVH2104E | 3.7M logic cells, 122.4 Mb BRAM, same I/O and thermal envelope. | Required for full 256-QAM OFDM decoding across 32 carriers or >128-channel beamforming. | Choose only if verified resource usage exceeds 95% of XCVU35P capacity in final implementation. |
Compared with XCVU29P-L2FSVH2104E and XCVU37P-L2FSVH2104E, the XCVU35P-L2FSVH2104E delivers optimal balance of logic density, memory bandwidth, and thermal margin for production-grade 5G and radar platforms-avoiding overdesign while ensuring headroom for future feature upgrades.
Availability
XCVU35P-L2FSVH2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and AI edge inference requiring stable component supply across multi-year production cycles.
Supply support for XCVU35P-L2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, GPU, and CPU innovation.
The Virtex UltraScale+ family was designed for high-bandwidth, low-latency infrastructure applications including wired/wireless communications, aerospace, and real-time embedded vision systems.
FAQ
What is the maximum supported DDR4 data rate for the XCVU35P-L2FSVH2104E?
The XCVU35P-L2FSVH2104E supports DDR4-2400 (1200 MHz clock) with 16-bit and 32-bit interfaces. This enables sustained memory bandwidth up to 38.4 GB/s per controller, validated for use with industrial-grade DDR4 modules operating across –40°C to +100°C ambient conditions. The XCVU35P-L2FSVH2104E includes dedicated PHY calibration logic to maintain signal integrity under voltage and temperature variation.
Does the XCVU35P-L2FSVH2104E include built-in security features?
Yes, the XCVU35P-L2FSVH2104E integrates AES-256 bitstream encryption, HMAC-SHA-256 authentication, and secure boot with RSA-4096 signature verification. These features protect intellectual property and ensure trusted configuration loading. The XCVU35P-L2FSVH2104E also supports tamper-detection circuitry and secure debug disable to meet DO-254 and IEC 62443-3-3 requirements.
What thermal solution is recommended for continuous operation of the XCVU35P-L2FSVH2104E?
A forced-air heatsink with ≥35 CFM airflow and 0.25″ thick copper base is recommended for full-load operation at +100°C ambient. The XCVU35P-L2FSVH2104E's thermal lid supports direct contact with vapor chamber solutions, and its Tcase rating is 105°C. Thermal simulation data for the XCVU35P-L2FSVH2104E is provided in UG578 v1.15, including board-level junction-to-ambient resistance values.
Can the XCVU35P-L2FSVH2104E be configured via JTAG only?
No - the XCVU35P-L2FSVH2104E supports multiple configuration modes: JTAG, Quad-SPI flash, BPI flash, and PCIe enumeration. Configuration via PCIe allows dynamic partial reconfiguration during runtime, which is used in adaptive radio applications. The XCVU35P-L2FSVH2104E also supports fallback configuration from dual-flash images for system reliability.
Is the ARM Cortex-R5 subsystem in the XCVU35P-L2FSVH2104E lockstep capable?
Yes, the dual-core ARM Cortex-R5 in the XCVU35P-L2FSVH2104E supports lockstep operation with hardware error detection and correction. This mode meets ASIL-D requirements for safety-critical functions such as radar health monitoring. The XCVU35P-L2FSVH2104E provides dedicated interrupt routing and memory protection units to isolate R5 execution from programmable logic activity.
XCVU35P-L2FSVH2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 108960
- Number of Logic Elements/Cells:
- 1906800
- Total RAM Bits:
- 49597645
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU35P-L2FSVH2104E FAQ
1.How can I place an order for XCVU35P-L2FSVH2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU35P-L2FSVH2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU35P-L2FSVH2104E reliable?
The price and inventory of XCVU35P-L2FSVH2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU35P-L2FSVH2104E is usually 5 days.
3.What payment methods are accepted for XCVU35P-L2FSVH2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU35P-L2FSVH2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU35P-L2FSVH2104E?
XCVU35P-L2FSVH2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU35P-L2FSVH2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU35P-L2FSVH2104E?
For technical support, including XCVU35P-L2FSVH2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU35P-L2FSVH2104E requirements.
6.How does Aetrix verify that XCVU35P-L2FSVH2104E is sourced from the original manufacturer or authorized distributors?
All XCVU35P-L2FSVH2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU35P-L2FSVH2104E meets industry standards.
7.What is the process for return or replacement of XCVU35P-L2FSVH2104E?
All XCVU35P-L2FSVH2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU35P-L2FSVH2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU35P-L2FSVH2104E part is unused and in its original packaging.
Return procedure for XCVU35P-L2FSVH2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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