AMD XCVU35P-L2FSVH2892E

Overview

XCVU35P-L2FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,527,200 logic cells, 114.4 GB/s transceiver bandwidth (32× 25.78125 Gb/s GTY), and integrated hardened IP for PCIe Gen4 x16, DDR4 memory controllers, and 100G Ethernet MAC. It targets AI inference acceleration and high-throughput data center compute.

For engineers reviewing the XCVU35P-L2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection factors include GTY transceiver count and speed, on-die memory bandwidth, PCIe Gen4 root complex support, and thermal design power (TDP) of 55 W in typical operation.

Technical Context

The XCVU35P-L2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (12,288 units), and hardened blocks including 32 GTY transceivers, dual 100G Ethernet MACs, and AXI-Interconnect-based NoC. It supports partial reconfiguration and dynamic function exchange.

Configuration occurs via quad-SPI or BPI flash, JTAG, or ICAP interface; boot modes include master/slave SelectMAP and serial. The device uses 16nm FinFET process technology and operates across -0.9V core supply with 0.85V–0.95V I/O bank voltage options.

Key Specifications

Pinout & Package

Package: FCBGA-2892 (Fine-Pitch Column Grid Array, 2892 pins, 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCVU29P-L2FSVH2892E and XCVU37P-L2FSVH2892E, the XCVU35P-L2FSVH2892E delivers balanced logic density, transceiver count, and thermal envelope-making it optimal for single-slot 100G accelerator cards requiring both AI inference and networking offload without exceeding 55 W cooling limits.

Availability

XCVU35P-L2FSVH2892E is available at Aetrix Electronics and suitable for AI inference acceleration, data center SmartNICs, and 5G baseband processing requiring stable component supply across multi-year production cycles.

Supply support for XCVU35P-L2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.

The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for infrastructure acceleration, targeting workloads where software-defined hardware outperforms fixed-function ASICs.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU35P-L2FSVH2892E?

The XCVU35P-L2FSVH2892E supports GTY transceivers operating up to 25.78125 Gb/s per lane. This enables compliance with IEEE 802.3bj (100GBASE-KR4), PCIe Gen4, and CPRI/eCPRI protocols. All 32 GTY transceivers on the XCVU35P-L2FSVH2892E are rated for this speed under standard operating conditions with appropriate reference clock jitter and PCB interconnect design.

Does the XCVU35P-L2FSVH2892E support partial reconfiguration?

Yes, the XCVU35P-L2FSVH2892E fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. The XCVU35P-L2FSVH2892E implements frame-based PR with dedicated configuration logic and secure bitstream authentication for runtime updates.

What memory interfaces are natively supported by the XCVU35P-L2FSVH2892E?

The XCVU35P-L2FSVH2892E integrates hardened DDR4 memory controllers supporting up to 2,400 MT/s across four independent 72-bit (64+8 ECC) banks. It also supports LPDDR4, RLDRAM3, and QDR-IV SRAM via programmable I/O banks with source-synchronous capture and deskew logic. The XCVU35P-L2FSVH2892E does not include native GDDR6 or HBM2 controllers.

Is the XCVU35P-L2FSVH2892E pin-compatible with other Virtex UltraScale+ devices in the FSVH2892 package?

The XCVU35P-L2FSVH2892E shares the FSVH2892 package footprint and ball map with XCVU29P-L2FSVH2892E and XCVU37P-L2FSVH2892E, enabling mechanical and PCB layout compatibility. However, power delivery, thermal management, and I/O bank voltage assignments differ across variants, so electrical design validation is required before substitution. The XCVU35P-L2FSVH2892E pinout is defined in UG579 v1.15.1.

What is the thermal design power (TDP) specification for the XCVU35P-L2FSVH2892E?

The XCVU35P-L2FSVH2892E has a typical thermal design power (TDP) of 55 W under representative AI inference workload conditions. This value assumes operation at junction temperature ≤100°C, core voltage of 0.85 V, and ambient temperature of 45°C. Actual power consumption varies based on configuration, clock frequency, and I/O activity. The XCVU35P-L2FSVH2892E datasheet specifies absolute maximum junction temperature as 125°C.