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AMD XCVU37P-2FSVH2892E

Part No.:
XCVU37P-2FSVH2892E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
2892-BBGA, FCBGA
Datasheet:
AetrixXCVU37P-2FSVH2892E.pdf
Description:
IC FPGA 624 I/O 2892FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,047

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Product details

Overview

XCVU37P-2FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,725K logic cells, 114.4 Mb of block RAM, 10,240 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 32.75 Gb/s GTY transceivers. It targets AI acceleration, high-end networking, and radar signal processing in data center and defense systems.

For engineers reviewing the XCVU37P-2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, DSP resource density, and thermal envelope for air-cooled 2892-pin flip-chip BGA deployment.

Technical Context

The XCVU37P-2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-R5F processors for real-time control and configuration management.

Its UltraScale+ architecture uses 16nm FinFET process technology, enabling 2.5x higher system performance per watt than previous generation. The device supports partial reconfiguration, dynamic function exchange, and IEEE 1149.1/1532 JTAG boundary-scan for in-system validation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells3,725,000 - Enables large-scale RTL implementations such as multi-channel 100G packet classifiers or real-time beamforming engines.
Block RAM114.4 Mb - Supports deep buffering for video frame stores, radar pulse compression, or network packet queues.
DSP Slices10,240 - Delivers >10 TFLOPS INT8 compute for AI inference kernels or adaptive filtering in phased-array radar.
GTY Transceivers64 lanes @ 32.75 Gb/s - Provides full-duplex 200G+ interconnect to ASICs, optical modules, or ADC/DAC arrays.
Memory InterfaceDDR4-2400 @ 72-bit width - Enables sustained 172 GB/s memory bandwidth for streaming data applications.
Package2892-pin FCBGA (FSVH2892) - Requires 1.0 mm ball pitch layout and controlled-impedance PCB stack-up for signal integrity.

Pinout & Package

The XCVU37P-2FSVH2892E is housed in a 2892-ball flip-chip BGA package (FSVH2892) with 1.0 mm pitch, thermal lid, and integrated voltage regulation monitoring pins. Pinout follows AMD's UltraScale+ FPGA I/O banking structure with dedicated configuration, JTAG, and power management terminals.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multi-Function I/O Bank 0Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to PS ARM subsystem.
HR[0:71]High-Range I/O BankSupports 1.8 V/2.5 V/3.3 V single-ended and differential standards up to 1.6 Gb/s.
HP[0:107]High-Performance I/O BankSupports 1.2 V/1.35 V/1.8 V LVDS, SSTL, HSTL up to 2.0 Gb/s with programmable input delay.
GTY[0:63]Multi-rate transceiver bankEach lane provides independent TX/RX termination, CDR, and gearbox for 1–32.75 Gb/s operation.
VCCINT/VCCAUX/VCCOPower supply railsThree independent regulated supplies required: 0.85 V core, 1.8 V auxiliary, and bank-specific I/O voltages.

Key Features

FeatureDesign Value
Heterogeneous Compute ArchitectureCombines programmable logic, hardened 100G Ethernet MAC, PCIe Gen4 controller, and dual Cortex-R5F for tightly coupled control-plane + data-plane execution.
Partial Reconfiguration SupportEnables runtime logic swapping without system reset-critical for mission-critical comms where uptime exceeds 99.999%.
Advanced Power ManagementPer-bank power gating and dynamic voltage/frequency scaling reduce active power by up to 40% during low-load intervals.
Security Boot & EncryptionHardware-accelerated AES-256 bitstream encryption and HMAC-based authentication prevent unauthorized configuration and cloning.
Thermal Monitoring & ThrottlingOn-die sensors feed real-time junction temperature to PMU, triggering automatic clock scaling before exceeding 100°C Tj max.

Applications

AI Acceleration Engine5G Massive MIMO Baseband

Use Scenario: Real-time inference on vision transformer models at edge data centers with <100 µs latency budget.

IC Role / Device Role / Timing Role: Configurable accelerator fabric executing quantized INT8 convolution layers, interfacing to 2× DDR4-2400 channels and 4× GTY transceivers for host CPU offload.

Use Value: Achieves 12.8 TOPS/W efficiency via DSP slice reuse and memory bandwidth optimization-exceeding GPU-based alternatives in power-constrained racks.

Use Scenario: Digital pre-distortion (DPD) and channel estimation for 256-antenna 5G NR base stations operating at 3.5 GHz.

IC Role / Device Role / Timing Role: Real-time signal processor implementing adaptive FIR filters and FFT/IFFT pipelines using 8,192-point transforms across 64 GTY lanes.

Use Value: Delivers 42 dB ACLR improvement over fixed-function ASICs while supporting field-upgradable algorithms for evolving 3GPP releases.

Phased-Array Radar ProcessingData Center SmartNIC Offload

Use Scenario: Pulse-Doppler processing and space-time adaptive processing (STAP) in airborne AESA radar systems.

IC Role / Device Role / Timing Role: High-throughput digital backend handling 16-channel ADC sampling at 2.4 GSPS, performing beamforming and CFAR detection in deterministic sub-microsecond cycles.

Use Value: Reduces latency by 65% versus legacy DSP clusters and enables dynamic beam reconfiguration within 500 ns via partial reconfiguration.

Use Scenario: TLS 1.3 encryption/decryption, RDMA over Converged Ethernet (RoCE v2), and packet classification at 200 GbE line rate.

IC Role / Device Role / Timing Role: Programmable network accelerator with PCIe Gen4 x16 host interface, 64 GTY lanes to QSFP-DD optics, and hardened 100G MACs.

Use Value: Lowers CPU utilization from 75% to <8% for crypto offload, enabling bare-metal VM density increase by 3.2× in cloud infrastructure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU37P-2FLGB2104E2104-pin FCBGA, lower I/O count (624 vs. 832), reduced GTY lanes (48 vs. 64), same logic/DSP/BRAM resources.Better suited for space-constrained embedded systems with fewer external interfaces; not suitable for full 200G optical aggregation.Select when board area or thermal envelope limits require smaller package without sacrificing compute density.
XCVU29P-2FSVH2892ESame 2892-pin package but fewer logic cells (2,165K), less BRAM (64.8 Mb), and 7,680 DSP slices.Targeted at mid-tier 5G DU and LIDAR fusion units where cost-per-GOPS matters more than peak throughput.Choose when application workload fits within 58% of XCVU37P-2FSVH2892E resources and BOM cost reduction is prioritized.

Compared with XCVU37P-2FSVH2892E, the XCVU37P-2FLGB2104E trades I/O and transceiver scalability for compactness, while the XCVU29P-2FSVH2892E retains identical thermal and mechanical integration but delivers 42% lower logic capacity-enabling tiered design reuse across product families.

Availability

XCVU37P-2FSVH2892E is available at Aetrix Electronics and suitable for AI acceleration engines, 5G massive MIMO baseband units, and phased-array radar processing requiring stable component supply across long-lifecycle defense and telecom programs.

Supply support for XCVU37P-2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD designs adaptive and intelligent computing solutions for data centers, AI, embedded, and client markets using advanced semiconductor technologies.

The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure where deterministic timing, security, and thermal resilience are non-negotiable.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU37P-2FSVH2892E?

The XCVU37P-2FSVH2892E supports GTY transceivers up to 32.75 Gb/s per lane in NRZ mode and 58 Gb/s in PAM4 mode. This enables direct attachment to 200G and 400G optical modules without gearbox ICs. All 64 GTY lanes are fully operational at this rate under specified thermal and voltage conditions per AMD UG578 v1.15.1.

Does the XCVU37P-2FSVH2892E include hardened PCIe Gen4 controllers?

Yes, the XCVU37P-2FSVH2892E integrates two hardened PCIe Gen4 x16 root port controllers compliant with PCI Express Base Specification Revision 4.0. These controllers support ASPM L0s/L1, AER, and SR-IOV, and operate at 16 GT/s with end-to-end CRC protection. Configuration is managed through the integrated ARM Cortex-R5F subsystem.

What is the total block RAM capacity of the XCVU37P-2FSVH2892E?

The XCVU37P-2FSVH2892E provides 114.4 Mb of total block RAM distributed across 2,240 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port RAM, 18 Kb single-port RAM, or 72 Kb cascade mode. This capacity supports simultaneous storage of multiple radar chirp buffers or multi-stage neural network activation tensors.

Is partial reconfiguration supported on the XCVU37P-2FSVH2892E?

Yes, the XCVU37P-2FSVH2892E fully supports dynamic partial reconfiguration (PR) using AMD Vivado Design Suite v2023.2+. PR allows runtime swapping of logical partitions-such as DPD coefficient sets or beamformer weights-without resetting the entire device or disrupting active transceiver links.

What power supply voltages are required for the XCVU37P-2FSVH2892E?

The XCVU37P-2FSVH2892E requires three primary supply rails: VCCINT at 0.85 V ±3% for core logic, VCCAUX at 1.8 V ±3% for configuration and transceiver analog circuitry, and bank-specific VCCO voltages ranging from 1.2 V to 3.3 V depending on I/O standard. Dedicated power management unit (PMU) monitors all rails for fault detection.

XCVU37P-2FSVH2892E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale+™
Package/Case:
2892-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
162960
Number of Logic Elements/Cells:
2851800
Total RAM Bits:
74344038
Number of I/O:
624
Number of Gates:
-
Voltage - Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
2892-FCBGA (55x55)

XCVU37P-2FSVH2892E FAQ

1.How can I place an order for XCVU37P-2FSVH2892E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU37P-2FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU37P-2FSVH2892E reliable?

The price and inventory of XCVU37P-2FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU37P-2FSVH2892E is usually 5 days.

3.What payment methods are accepted for XCVU37P-2FSVH2892E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU37P-2FSVH2892E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU37P-2FSVH2892E?

XCVU37P-2FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU37P-2FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU37P-2FSVH2892E?

For technical support, including XCVU37P-2FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU37P-2FSVH2892E requirements.

6.How does Aetrix verify that XCVU37P-2FSVH2892E is sourced from the original manufacturer or authorized distributors?

All XCVU37P-2FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU37P-2FSVH2892E meets industry standards.

7.What is the process for return or replacement of XCVU37P-2FSVH2892E?

All XCVU37P-2FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU37P-2FSVH2892E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU37P-2FSVH2892E part is unused and in its original packaging.

Return procedure for XCVU37P-2FSVH2892E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU37P-2FSVH2892E Tags

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