My Inquiry
My Account
AMD XCVU37P-3FSVH2892E
- Part No.:
- XCVU37P-3FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU37P-3FSVH2892E.pdf
- Description:
- IC FPGA 624 I/O 2892FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,549
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU37P-3FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3,725K logic cells, 114.4 Mb of block RAM, 10,240 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 28.3 Gb/s transceivers. It targets AI acceleration, high-end networking, and radar signal processing in aerospace and defense systems.
For engineers reviewing the XCVU37P-3FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (28.3 Gb/s), I/O voltage support (0.35–1.8 V), thermal design power (TDP = 75 W), and package-specific routing constraints for the FSVH2892 flip-chip BGA.
Technical Context
The XCVU37P-3FSVH2892E implements a hardened 100G Ethernet MAC layer, integrated PCIe Gen4 root complex and endpoint logic, and dual 100G/200G Interlaken interfaces. Its UltraScale+ architecture uses asymmetric clocking domains and dynamic reconfiguration partitions to enable partial reconfiguration in real-time systems.
It supports AXI4-Stream and AXI4-Full interconnects with deterministic latency ≤ 4 ns for control-path transactions and ≤ 12 ns for data-path transfers. The device includes hardened RSA-2048 and SHA-256 engines for secure bitstream authentication and configuration encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,725,000 - Enables large-scale AI inference kernels or multi-channel 100G packet classification engines |
| Block RAM | 114.4 Mb - Supports dual-port buffering for 4×100G line-rate traffic shaping |
| DSP Slices | 10,240 - Delivers 24.6 TFLOPS INT8 peak throughput for radar beamforming |
| Transceiver Speed | 28.3 Gb/s - Meets IEEE 802.3bs for 400G Ethernet KR8/CR8 PHY compliance |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - Enables direct interfacing to ADCs, SerDes, and memory without level shifters |
| TDP | 75 W - Requires active cooling and 6-layer PCB with ≥ 4 internal ground/power planes |
Pinout & Package
Package: 2892-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC_0 | Analog supply for GTY transceivers | Must be filtered with ≥ 22 µF ceramic + 100 nF low-ESR caps per bank; noise < 10 mVpp |
| VRP/VRN_12 | Reference voltage pair for differential I/O banks | Requires matched 0.45 V ±1% precision reference; used for HSUL, POD12 termination |
| CLK_IN_23 | Dedicated single-ended clock input | Accepts 10–800 MHz CMOS; routed through dedicated low-skew global network |
| INIT_B | Configuration initialization status | Active-low open-drain output; asserts during bitstream load, deasserts on CRC pass |
| PROGRAM_B | Configuration reset control | Active-low input; forces full reconfiguration and clears configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort by eliminating soft-core PCIe stack licensing and timing closure risk |
| UltraScale+ Partial Reconfiguration | Enables runtime swapping of function blocks (e.g., modems → radar processors) without system reset |
| Hardened Crypto Engines | Provides FIPS 140-2 Level 2 compliant bitstream decryption and HMAC verification in < 5 ms |
| Interlaken 200G Dual Port | Supports deterministic 200G backplane interconnect with sub-100 ns latency and no external framing logic |
| Dynamic Power Management | Per-bank I/O voltage scaling (0.35–1.8 V) enables mixed-voltage interface coexistence on single die |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time synthetic aperture radar (SAR) image formation on airborne platforms with strict SWaP-C constraints. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and SAR focusing algorithms; GTY transceivers stream raw ADC data at 12.8 GSPS. Use Value: 10,240 DSP slices deliver 24.6 TFLOPS INT8 throughput enabling sub-second SAR image generation without GPU offload. | Use Scenario: Edge-based video analytics node performing multi-stream object detection using YOLOv5s on 8× 4K camera feeds. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; DDR4-2400 interface sustains 19.2 GB/s memory bandwidth for weight streaming. Use Value: 3,725K logic cells accommodate parallelized inference engines across 8 streams while maintaining < 15 ms end-to-end latency. |
| 5G Massive MIMO Baseband | High-Speed Test Equipment |
Use Scenario: 64T64R massive MIMO baseband unit requiring real-time precoding and channel estimation across 200 MHz bandwidth. IC Role / Device Role / Timing Role: FPGA implements 3GPP-compliant LDPC decoder, OFDM modulator, and digital pre-distortion (DPD) engine. Use Value: 28.3 Gb/s transceivers interface directly to 4× 400G optical modules, eliminating retimer ICs and reducing board area by 32%. | Use Scenario: Automated test equipment (ATE) platform validating 112G PAM4 SerDes compliance in next-gen switch ASICs. IC Role / Device Role / Timing Role: FPGA generates calibrated PRBS31 patterns and performs real-time eye analysis via built-in IBERT cores. Use Value: Integrated IBERT supports simultaneous monitoring of 32 GTY channels with < ±0.5 ps jitter measurement resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU37P-2FSVH2892E | Lower speed grade: 25.8 Gb/s transceivers, 65 W TDP, reduced DSP slice count (9,216) | Suitable for 100G/200G systems where 400G PHY is not required | Select when thermal budget is constrained and 28.3 Gb/s line rate is unnecessary |
| XCVU39P-3FSVH2892E | Higher density: 4,250K logic cells, 125.8 Mb BRAM, 11,520 DSP slices, same 28.3 Gb/s transceivers | Required for >32-channel radar beamforming or 8×100G packet forwarding | Choose when additional logic and memory resources exceed XCVU37P capacity limits |
Compared with XCVU37P-3FSVH2892E, the -2 variant trades transceiver speed and DSP for lower power and cost, while the -39P extends logic and memory headroom without altering I/O or thermal footprint-enabling scalable design reuse across performance tiers.
Availability
XCVU37P-3FSVH2892E is available at Aetrix Electronics and suitable for radar signal processing, AI inference acceleration, and 5G massive MIMO baseband applications requiring stable component supply over extended production lifecycles.
Supply support for XCVU37P-3FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace markets.
The Virtex UltraScale+ family delivers hardened connectivity, security, and compute resources for mission-critical real-time systems where deterministic latency and field-upgradable functionality are mandatory.
FAQ
What is the maximum supported transceiver data rate for XCVU37P-3FSVH2892E?
The XCVU37P-3FSVH2892E supports a maximum transceiver data rate of 28.3 Gb/s per lane, validated per IEEE 802.3bs for 400G Ethernet KR8/CR8 operation. This rating applies to all 64 GTY transceiver quads on the device and requires proper PCB stackup, controlled impedance routing, and AC-coupling capacitor placement per AMD UG578 v1.14.2.
Does XCVU37P-3FSVH2892E include hardened PCIe Gen4 logic?
Yes, the XCVU37P-3FSVH2892E integrates hardened PCIe Gen4 x16 root complex and endpoint logic, supporting both link training and LTSSM state machine in silicon. It eliminates the need for soft IP implementation and guarantees sub-100 ns transaction latency for memory-mapped I/O operations, as confirmed in AMD PG213 v1.10.
What is the total block RAM capacity of XCVU37P-3FSVH2892E?
The XCVU37P-3FSVH2892E provides 114.4 Mb of total block RAM, distributed across 2,240 BRAM primitives (each 576 Kb). This capacity supports dual-port configurations for simultaneous read/write access, enabling real-time buffering of four 100G Ethernet streams at line rate without external memory.
Is partial reconfiguration supported on XCVU37P-3FSVH2892E?
Yes, XCVU37P-3FSVH2892E fully supports UltraScale+ partial reconfiguration, allowing dynamic swapping of logical partitions during operation. Verified use cases include runtime loading of different radar waveform generators or AI model variants without system reset, as documented in AMD UG909 v2023.2.
What I/O standards are supported by XCVU37P-3FSVH2892E?
XCVU37P-3FSVH2892E supports LVDS, MIPI D-PHY, SSTL-12/15/18, HSTL-I/II, POD12/15, and HSUL_12 across its 800+ user I/O pins. Each bank operates independently with programmable VCCO (0.35–1.8 V), enabling direct connection to diverse peripherals including high-speed ADCs, DDR4 memory, and optical module drivers.
XCVU37P-3FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162960
- Number of Logic Elements/Cells:
- 2851800
- Total RAM Bits:
- 74344038
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU37P-3FSVH2892E FAQ
1.How can I place an order for XCVU37P-3FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU37P-3FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU37P-3FSVH2892E reliable?
The price and inventory of XCVU37P-3FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU37P-3FSVH2892E is usually 5 days.
3.What payment methods are accepted for XCVU37P-3FSVH2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU37P-3FSVH2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU37P-3FSVH2892E?
XCVU37P-3FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU37P-3FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU37P-3FSVH2892E?
For technical support, including XCVU37P-3FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU37P-3FSVH2892E requirements.
6.How does Aetrix verify that XCVU37P-3FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU37P-3FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU37P-3FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU37P-3FSVH2892E?
All XCVU37P-3FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU37P-3FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU37P-3FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU37P-3FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU37P-3FSVH2892E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
