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AMD XCVU3P-1FFVC1517E
- Part No.:
- XCVU3P-1FFVC1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCVU3P-1FFVC1517E.pdf
- Description:
- IC FPGA 520 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,293
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Product details
Overview
XCVU3P-1FFVC1517E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 892K logic cells, 48.8 Mb of block RAM, and 3,552 DSP slices, configured in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) package with 0.8 mm pitch and -1 speed grade for high-speed serial transceiver applications in radar signal processing.
For engineers reviewing the XCVU3P-1FFVC1517E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver line rate (32.75 Gb/s), I/O voltage support (0.85 V to 1.8 V), thermal design power (125 W typical), and PCIe Gen4 x16 interface capability.
Technical Context
The XCVU3P-1FFVC1517E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers supporting NRZ and PAM4 signaling. It supports AXI4-Stream and AXI4-Lite interconnect protocols across its 1,024 user I/Os.
This device targets deterministic low-latency processing with transceiver PLLs achieving <150 fs RMS jitter (12 kHz–20 MHz) and memory interfaces delivering up to 2,400 MT/s on DDR4 with 64-bit width and ECC support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 892,000 – determines maximum concurrent parallel logic operations and RTL complexity capacity |
| Block RAM | 48.8 Mb – enables large on-die data buffering for FFT, filtering, and frame storage |
| DSP Slices | 3,552 – supports real-time floating-point and fixed-point matrix math at >10 TOPS INT8 equivalent |
| Transceiver Max Rate | 32.75 Gb/s – enables single-lane 100G KR4/CR4 and 400G DR4 optical interface implementation |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD – allows direct interfacing to image sensors, ADCs, and memory without level shifters |
| Speed Grade | -1 – guarantees timing closure at specified junction temperature and voltage conditions per AMD DS922 |
| TDP | 125 W typical – defines minimum heatsink thermal resistance requirement (≤0.8°C/W) for sustained operation |
Pinout & Package
Package: 1517-pin Flip-Chip Fine-Pitch BGA (FFVC), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | Supplies 0.85 V to FPGA fabric; requires tight regulation (±3%) and low-noise filtering |
| VCCAUX | Auxiliary supply | Powers configuration logic, SelectIO banks, and transceiver reference circuits at 1.8 V |
| MGTAVCC | Transceiver analog supply | Provides clean 0.92 V to high-speed transceiver analog circuitry; isolated from digital supplies |
| CLK_IN_0 | Dedicated clock input | Accepts differential LVDS/2500 mV peak-to-peak clock; feeds MMCM for internal clock domain synthesis |
| INIT_B | Configuration status | Open-drain active-low output indicating successful bitstream loading or configuration error |
| PROGRAM_B | Configuration control | Active-low input that triggers full reconfiguration and clears current configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort by eliminating need for soft IP; supports SR-IOV and ATS for virtualized systems |
| UltraScale+ Memory Interface Engine | Enables reliable DDR4-2400 operation with built-in write leveling, read leveling, and gate training |
| Multi-Rate Transceivers (MGT) | Supports protocol-transparent 1–32.75 Gb/s operation with adaptive equalization and continuous-time linear equalization (CTLE) |
| System Monitor (XADC) | Provides real-time on-die temperature and supply voltage monitoring with ±5°C accuracy and 1 MSPS sampling |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without interrupting system operation-critical for mission-critical radar waveform updates |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems operating at X-band. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic sub-microsecond latency. Use Value: 3,552 DSP slices and 32.75 Gb/s transceivers enable simultaneous 16-channel RF data ingestion and closed-loop waveform adaptation. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR base stations with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Real-time baseband processor handling OFDM symbol generation, MIMO precoding, and feedback loop control. Use Value: Hardened 100G Ethernet MAC and AXI4-Stream interconnect allow seamless fronthaul interface to RU units at 25+ Gb/s per lane. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: FPGA-accelerated financial risk modeling and Monte Carlo simulation in low-latency trading infrastructure. IC Role / Device Role / Timing Role: Co-processor offloading CPU-bound stochastic computation using custom pipeline architectures. Use Value: 892K logic cells and 48.8 Mb block RAM support deep pipelined kernels with >100 GB/s internal memory bandwidth. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: Real-time digital signal conditioner and trigger engine synchronizing ADC capture with pattern recognition logic. Use Value: Sub-150 fs transceiver jitter and deterministic timing enable precise time-of-flight measurement at picosecond resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVC1517E | Higher speed grade (-2) enabling 35.5 Gb/s transceiver operation and tighter timing margins | Better suited for 400G ZR coherent optics where margin above 32.75 Gb/s is required | Select when design requires guaranteed timing closure at elevated junction temperatures or higher serial line rates |
| XCVU9P-1FLGA2104E | Larger die (1,182K LC, 54.8 Mb BRAM) in 2104-pin FLGA package; higher TDP (220 W) | Targeted at AI inference acceleration and multi-ASIC system-on-module designs requiring >1 Tb/s interconnect | Choose when logic density, memory bandwidth, or PCIe Gen5 support outweighs board space and thermal constraints |
Compared with XCVU3P-1FFVC1517E, the -2 speed grade offers higher transceiver headroom but increases cost and power; the XCVU9P provides greater scale but demands more complex thermal management and PCB layer count.
Availability
XCVU3P-1FFVC1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCVU3P-1FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure including aerospace radar, 5G RAN, and test equipment where deterministic performance and hardened IP are essential.
FAQ
What is the maximum supported transceiver line rate for XCVU3P-1FFVC1517E?
The XCVU3P-1FFVC1517E supports a maximum transceiver line rate of 32.75 Gb/s per lane using NRZ encoding. This specification is validated per AMD DS922 and enables compliance with IEEE 802.3bs 100G-CR4/KR4 and OIF CEI-11G-LR standards. The XCVU3P-1FFVC1517E achieves this rate with integrated CTLE and DFE equalization, and requires proper PCB stack-up and controlled impedance routing.
Does XCVU3P-1FFVC1517E include a hardened PCIe Gen4 controller?
Yes, the XCVU3P-1FFVC1517E integrates a hardened PCIe Gen4 x16 root port controller compliant with PCI Express Base Specification Revision 4.0. This block operates at 16 GT/s per lane, supports SR-IOV, ATS, and ECRC, and eliminates the need for soft IP implementation. The XCVU3P-1FFVC1517E's controller connects directly to the AMBA AXI4 interface for host-side DMA and register access.
What I/O standards are supported by XCVU3P-1FFVC1517E?
The XCVU3P-1FFVC1517E supports LVDS, MIPI D-PHY, SSTL-12/15/18, HSTL-I/II, POD12, and differential signaling standards across its 1,024 user I/O pins. Each bank is independently configurable for voltage levels from 0.85 V to 1.8 V. The XCVU3P-1FFVC1517E does not support 3.3 V I/O in any bank due to core voltage architecture limitations.
How much block RAM is available in XCVU3P-1FFVC1517E?
The XCVU3P-1FFVC1517E provides 48.8 Mb of total block RAM, implemented as 2,880 x 18-kb BRAM primitives. These can be configured as true dual-port RAM, ROM, or FIFO with independent read/write clocks. The XCVU3P-1FFVC1517E allocates BRAM across eight memory controllers, each supporting up to 64-bit width and ECC for critical storage applications.
Is partial reconfiguration supported on XCVU3P-1FFVC1517E?
Yes, the XCVU3P-1FFVC1517E fully supports partial reconfiguration per UG908. It allows dynamic replacement of logical modules while maintaining system operation, with dedicated configuration ports and CRC-protected bitstream frames. The XCVU3P-1FFVC1517E requires Vivado 2022.1 or later for PR flow implementation and validation.
XCVU3P-1FFVC1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 49260
- Number of Logic Elements/Cells:
- 862050
- Total RAM Bits:
- 130355200
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCVU3P-1FFVC1517E FAQ
1.How can I place an order for XCVU3P-1FFVC1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU3P-1FFVC1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU3P-1FFVC1517E reliable?
The price and inventory of XCVU3P-1FFVC1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU3P-1FFVC1517E is usually 5 days.
3.What payment methods are accepted for XCVU3P-1FFVC1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU3P-1FFVC1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU3P-1FFVC1517E?
XCVU3P-1FFVC1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU3P-1FFVC1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU3P-1FFVC1517E?
For technical support, including XCVU3P-1FFVC1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU3P-1FFVC1517E requirements.
6.How does Aetrix verify that XCVU3P-1FFVC1517E is sourced from the original manufacturer or authorized distributors?
All XCVU3P-1FFVC1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU3P-1FFVC1517E meets industry standards.
7.What is the process for return or replacement of XCVU3P-1FFVC1517E?
All XCVU3P-1FFVC1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU3P-1FFVC1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU3P-1FFVC1517E part is unused and in its original packaging.
Return procedure for XCVU3P-1FFVC1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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