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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU3P-2FFVC1517E

Name: XCVU3P-2FFVC1517E
Brand: AMD
SKU: XCVU3P-2FFVC1517E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU3P-2FFVC1517E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 1517-BBGA, FCBGA

Datasheet:: XCVU3P-2FFVC1517E.pdf

Description:: IC FPGA 520 I/O 1517FCBGA

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Product details

Overview

XCVU3P-2FFVC1517E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 892K logic cells, 49.5 Mb of block RAM, and 3,552 DSP slices, configured in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 0.8 mm pitch, used in high-speed data processing and AI acceleration systems.

For engineers reviewing the XCVU3P-2FFVC1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.8 V / 1.2 V / 1.0 V), transceiver line rates up to 25.78125 Gb/s, and PCIe Gen4 x16 endpoint capability for compute-accelerated infrastructure designs.

Technical Context

The XCVU3P-2FFVC1517E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, DDR4 PHY, 100G Ethernet MAC), and multi-rate transceivers supporting PAM4 and NRZ modulation. It targets low-latency, high-throughput signal processing pipelines requiring deterministic timing closure.

Its UltraScale+ architecture uses asymmetric clocking domains, dedicated routing for memory and interconnect, and dynamic reconfiguration via ICAP/SMAP interfaces. The device supports partial reconfiguration and real-time bitstream updates without system reset.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	892,000 - determines maximum combinational and sequential logic capacity for custom datapath implementation
Block RAM	49.5 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external memory latency
DSP Slices	3,552 - enables parallel fixed/floating-point computation for AI inference and digital filtering
Transceiver Max Rate	25.78125 Gb/s - supports 100G Ethernet KR4, PCIe Gen4, and CPRI/eCPRI protocols
I/O Standards	LVDS, SSTL, HSTL, MIPI D-PHY - enables direct interfacing with high-speed ADCs, memory, and sensors
PCIe Interface	Gen4 x16 endpoint - delivers 32 GB/s bidirectional bandwidth for host-to-FPGA accelerator communication

Pinout & Package

Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.

Pin/Terminal	Circuit Role	Design Meaning
VCCINT	Core power supply	Supplies 0.85 V ±3% to FPGA fabric; requires low-noise regulation and local decoupling
VCCAUX	Auxiliary power supply	Provides 1.8 V to configuration logic, PCIe block, and transceiver reference circuits
MGTAVCC	Transceiver analog supply	Delivers 0.95 V ±2% to high-speed serial transceiver analog circuitry
CLK_IN_0	Dedicated clock input	Accepts single-ended or differential reference clocks up to 1.2 GHz for PLL/MMCM locking
INIT_B	Configuration status	Active-low open-drain output indicating successful bitstream loading or configuration error

Key Features

Feature	Design Value
Hardened PCIe Gen4 x16 Endpoint	Eliminates soft IP resource consumption and guarantees sub-100 ns transaction latency
UltraScale+ Multi-Rate Transceivers	Supports 10–25.78125 Gb/s per lane with built-in PRBS generation and error detection
DDR4 Memory Controller (up to 2400 MT/s)	Enables direct connection to 64-bit wide DDR4 DIMMs with ECC support and AXI4 interface
Partial Reconfiguration Support	Allows runtime swapping of logic regions without disrupting active functions or I/O states
Integrated System Monitor	Monitors on-die temperature, supply voltages, and current draw via JTAG or AXI interface

Applications

AI Inference Acceleration	5G Baseband Processing
Use Scenario: Real-time neural network inference at edge data centers with low latency and high throughput requirements. IC Role / Device Role / Timing Role: Configurable hardware accelerator executing quantized CNN layers using DSP slices and BRAM-based weight storage. Use Value: Achieves >2.1 TOPS/W efficiency with deterministic sub-10 µs inference latency under thermal constraints.	Use Scenario: Massive MIMO precoding and channel estimation in 5G NR gNodeB units operating at 3.5 GHz and 28 GHz bands. IC Role / Device Role / Timing Role: Real-time baseband signal processor handling 64×64 antenna matrix computations and LDPC decoding. Use Value: Supports 100 Gbps fronthaul interface via 4×25G transceivers and meets 3GPP Release 16 timing alignment requirements.
High-Frequency Trading Systems	Test & Measurement Equipment
Use Scenario: Ultra-low-latency order execution engines deployed in co-located financial data centers. IC Role / Device Role / Timing Role: Deterministic packet parser, market data decoder, and order generator with hardware-timed response. Use Value: Delivers end-to-end latency under 350 ns from network ingress to FPGA-generated order output.	Use Scenario: Modular oscilloscopes and protocol analyzers requiring flexible sampling, triggering, and real-time analysis. IC Role / Device Role / Timing Role: High-speed digitizer controller with 10 GS/s ADC interface and on-chip FFT engine. Use Value: Enables 12-bit resolution at 1.5 GHz bandwidth with real-time spectral analysis using 2,048-point hardware FFT.

AI Inference Acceleration

5G Baseband Processing

Use Scenario: Real-time neural network inference at edge data centers with low latency and high throughput requirements.

IC Role / Device Role / Timing Role: Configurable hardware accelerator executing quantized CNN layers using DSP slices and BRAM-based weight storage.

Use Value: Achieves >2.1 TOPS/W efficiency with deterministic sub-10 µs inference latency under thermal constraints.

Use Scenario: Massive MIMO precoding and channel estimation in 5G NR gNodeB units operating at 3.5 GHz and 28 GHz bands.

IC Role / Device Role / Timing Role: Real-time baseband signal processor handling 64×64 antenna matrix computations and LDPC decoding.

Use Value: Supports 100 Gbps fronthaul interface via 4×25G transceivers and meets 3GPP Release 16 timing alignment requirements.

High-Frequency Trading Systems

Test & Measurement Equipment

Use Scenario: Ultra-low-latency order execution engines deployed in co-located financial data centers.

IC Role / Device Role / Timing Role: Deterministic packet parser, market data decoder, and order generator with hardware-timed response.

Use Value: Delivers end-to-end latency under 350 ns from network ingress to FPGA-generated order output.

Use Scenario: Modular oscilloscopes and protocol analyzers requiring flexible sampling, triggering, and real-time analysis.

IC Role / Device Role / Timing Role: High-speed digitizer controller with 10 GS/s ADC interface and on-chip FFT engine.

Use Value: Enables 12-bit resolution at 1.5 GHz bandwidth with real-time spectral analysis using 2,048-point hardware FFT.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU3P-2FFVD1760E	Larger 1760-pin FC-FBGA package with higher I/O count (832 vs. 652) and additional transceivers	Better suited for multi-protocol aggregation (e.g., 100G + 400G Ethernet + PCIe Gen5)	Select when board layout allows larger footprint and >652 user I/Os are required
XCVU9P-2FLGA2104E	Higher density (2.5M LC), more BRAM (93.3 Mb), and 48 transceivers vs. 32 in XCVU3P-2FFVC1517E	Targeted at full-stack AI training accelerators and radar signal processors needing >100 TOPS raw compute	Choose when logic capacity and memory bandwidth exceed XCVU3P-2FFVC1517E limits

Compared with XCVU3P-2FFVC1517E, the XCVU3P-2FFVD1760E offers expanded I/O and transceiver count in a larger package, while the XCVU9P-2FLGA2104E delivers significantly higher logic and memory resources-making both alternatives suitable only when the original device's 892K LC, 49.5 Mb BRAM, and 32 transceivers are insufficient for the target workload.

Availability

XCVU3P-2FFVC1517E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G baseband processing, and high-frequency trading systems requiring stable component supply across long production cycles.

Supply support for XCVU3P-2FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.

The Virtex UltraScale+ family was designed for compute-intensive, low-latency applications including AI acceleration, 5G infrastructure, and real-time signal processing where deterministic performance and hardened IP integration are critical.

FAQ

What is the maximum transceiver line rate supported by the XCVU3P-2FFVC1517E?

The XCVU3P-2FFVC1517E supports a maximum transceiver line rate of 25.78125 Gb/s per lane. This enables compliance with PCIe Gen4, 100G Ethernet KR4, and CPRI/eCPRI standards. The transceivers are fully integrated into the XCVU3P-2FFVC1517E die and require no external retimers or redrivers for operation at this rate.

Does the XCVU3P-2FFVC1517E include a hardened PCIe Gen4 controller?

Yes, the XCVU3P-2FFVC1517E integrates a hardened PCIe Gen4 x16 endpoint block. This eliminates the need to implement PCIe in programmable logic, reduces resource usage, and ensures deterministic latency below 100 ns for TLP transactions. The controller is part of the XCVU3P-2FFVC1517E's fixed-function silicon.

What I/O voltage standards does the XCVU3P-2FFVC1517E support?

The XCVU3P-2FFVC1517E supports multiple I/O standards including LVDS, SSTL-18, SSTL-15, HSTL-I, and MIPI D-PHY. These are configurable per bank and allow direct interfacing with DDR4 memory, high-speed ADCs/DACs, and sensor interfaces without level-shifting components in the XCVU3P-2FFVC1517E design.

Is partial reconfiguration supported on the XCVU3P-2FFVC1517E?

Yes, the XCVU3P-2FFVC1517E supports partial reconfiguration through its ICAP and SMAP interfaces. This allows dynamic swapping of logic modules during operation without resetting the entire device or disrupting active I/O or memory interfaces-a core capability of the XCVU3P-2FFVC1517E architecture.

What is the total block RAM capacity of the XCVU3P-2FFVC1517E?

The XCVU3P-2FFVC1517E provides 49.5 Mb of total block RAM distributed across 1,440 BRAM primitives. This capacity supports large on-chip buffers, FIFOs, and coefficient tables for signal processing and AI workloads, reducing dependency on external memory and improving system-level determinism in the XCVU3P-2FFVC1517E implementation.

XCVU3P-2FFVC1517E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 1517-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 49260

Number of Logic Elements/Cells:: 862050

Total RAM Bits:: 130355200

Number of I/O:: 520

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 1517-FCBGA (40x40)

XCVU3P-2FFVC1517E FAQ

1.How can I place an order for XCVU3P-2FFVC1517E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU3P-2FFVC1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU3P-2FFVC1517E reliable?

The price and inventory of XCVU3P-2FFVC1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU3P-2FFVC1517E is usually 5 days.

3.What payment methods are accepted for XCVU3P-2FFVC1517E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU3P-2FFVC1517E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU3P-2FFVC1517E?

XCVU3P-2FFVC1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU3P-2FFVC1517E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU3P-2FFVC1517E?

For technical support, including XCVU3P-2FFVC1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU3P-2FFVC1517E requirements.

6.How does Aetrix verify that XCVU3P-2FFVC1517E is sourced from the original manufacturer or authorized distributors?

All XCVU3P-2FFVC1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU3P-2FFVC1517E meets industry standards.

7.What is the process for return or replacement of XCVU3P-2FFVC1517E?

All XCVU3P-2FFVC1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU3P-2FFVC1517E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU3P-2FFVC1517E part is unused and in its original packaging.

Return procedure for XCVU3P-2FFVC1517E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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