AMD XCVU3P-2FFVC1517I

Overview

XCVU3P-2FFVC1517I from AMD is a Virtex UltraScale+ FPGA featuring 892K logic cells, 48.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s GTY transceivers. It targets high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.

For engineers reviewing the XCVU3P-2FFVC1517I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory depth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal performance in air-cooled 1517-pin FC-BGA packages.

Technical Context

The XCVU3P-2FFVC1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Its FFVC1517 package delivers 832 user I/Os across 18 banks with configurable I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY. The device operates over –40°C to +100°C junction temperature with 0.85 V core supply.

Key Specifications

Pinout & Package

The XCVU3P-2FFVC1517I is housed in a 1517-pin Flip-Chip Ball Grid Array (FC-BGA) with 35 mm × 35 mm body size, 0.8 mm pitch, and thermal lid. Pinout follows AMD's UltraScale+ FPGA standard I/O bank layout with dedicated configuration, clock, and transceiver power/ground pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU3P-2FFVC1517I, the XCVU9P offers higher logic density for complex control planes, while the XCVU13P adds memory bandwidth and transceiver count for line-rate packet processing-neither is pin-compatible, and both require PCB redesign and thermal revalidation.

Availability

XCVU3P-2FFVC1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across extended product lifecycles.

Supply support for XCVU3P-2FFVC1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance applications.

The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for mission-critical infrastructure where deterministic timing, hardened interfaces, and long-term obsolescence management are essential.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU3P-2FFVC1517I?

The XCVU3P-2FFVC1517I supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet KR4, JESD204B/C, and CPRI. Operation at this speed requires proper PCB stack-up design, AC coupling, and termination per AMD UG578. The XCVU3P-2FFVC1517I does not support PAM4 modulation natively.

Does the XCVU3P-2FFVC1517I include a hardened PCIe Gen4 controller?

Yes, the XCVU3P-2FFVC1517I integrates a fully hardened PCIe Gen4 x16 endpoint/root port controller. It handles physical layer, data link, and transaction layers-including TLP generation, completion handling, and MSI-X interrupt management-without consuming programmable logic resources. The XCVU3P-2FFVC1517I requires no external PHY and supports ASPM L0s/L1 power states.

What I/O standards are supported by the HR banks on the XCVU3P-2FFVC1517I?

The XCVU3P-2FFVC1517I HR (High-Range) I/O banks support LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling standards with programmable output swing and termination. Each of the 18 HR banks has independent VCCO (1.2 V to 1.8 V) and VREF, enabling mixed-standard operation on a single bank. The XCVU3P-2FFVC1517I does not support RSDS or BLVDS.

Is partial reconfiguration supported on the XCVU3P-2FFVC1517I?

Yes, the XCVU3P-2FFVC1517I supports dynamic partial reconfiguration (PR) through Vivado Design Suite. PR allows runtime swapping of logical partitions without resetting the entire device or disrupting active functions. The XCVU3P-2FFVC1517I requires dedicated configuration logic and secure bitstream authentication for PR frames, and all reconfigurable regions must be constrained within the same super logic region (SLR).

What is the operating temperature range for the XCVU3P-2FFVC1517I?

The XCVU3P-2FFVC1517I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the FFVC1517 package variant and is verified per JEDEC JESD22-A108. The XCVU3P-2FFVC1517I requires thermal solution validation per AMD UG578, especially under sustained 25.8 Gb/s transceiver activity.