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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU3P-3FFVC1517E

Name: XCVU3P-3FFVC1517E
Brand: AMD
SKU: XCVU3P-3FFVC1517E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU3P-3FFVC1517E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 1517-BBGA, FCBGA

Datasheet:: XCVU3P-3FFVC1517E.pdf

Description:: IC FPGA 520 I/O 1517FCBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCVU3P-3FFVC1517E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 3.5M logic cells, 14.4 GT/s transceivers, and integrated 100G Ethernet MAC blocks; it targets 5G infrastructure baseband processing, radar signal conditioning, and high-throughput data acquisition systems.

For engineers reviewing the XCVU3P-3FFVC1517E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (32), core voltage (0.85 V), thermal design power (55 W), and package I/O count (832) in the 1517-pin FCBGA.

Technical Context

The XCVU3P-3FFVC1517E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, and 32 GTY transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-A53 processors for real-time control and system management.

Configuration occurs via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in mission-critical systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	3,505,000 - total configurable LUT-based resources for complex digital logic implementation
Transceivers	32 GTY - 10–32.75 Gb/s serial I/O lanes supporting PCIe Gen4, 100G Ethernet, and CPRI
I/O Count	832 - user-configurable single-ended/differential pins in FFVC1517 package
Core Voltage	0.85 V ±3% - nominal supply for PL fabric; requires tight regulation for timing closure
TDP	55 W - maximum thermal dissipation under worst-case switching activity at junction temp ≤100°C
Embedded Memory	122.9 Mb - distributed RAM + block RAM + UltraRAM for large on-die buffering

Pinout & Package

The XCVU3P-3FFVC1517E is housed in a 1517-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVC1517) with 1.0 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for industrial-grade thermal management.

Pin/Terminal	Circuit Role	Design Meaning
VCCINT	Core power supply	Supplies 0.85 V to programmable logic fabric; requires low-noise, high-current VRM
VCCAUX	Auxiliary power supply	Provides 1.8 V to configuration logic, transceiver reference circuits, and I/O banks
MIO[0:7]	Multiplexed I/O	ARM processor interface pins supporting SDIO, UART, SPI, I2C, and GPIO functions
GTYTXN/GTYTXP	Differential transceiver output	32 pairs of high-speed serial lanes supporting 10–32.75 Gb/s signaling
INIT_B	Configuration status	Open-drain active-low signal indicating successful bitstream loading or error condition

Key Features

Feature	Design Value
Hardened 100G Ethernet MAC	Integrated IEEE 802.3bj-compliant MAC/PCS enabling direct 100G KR4/KR2 interface without external PHY
Partial Reconfiguration	Enables dynamic logic module swapping during operation-critical for adaptive radar waveform updates
AES-256 Bitstream Encryption	Prevents IP theft by securing configuration memory against readback and cloning attacks
Dual ARM Cortex-A53	64-bit application processors running Linux or bare-metal firmware for embedded control and monitoring
UltraRAM Blocks	Large, deep, single-port RAM primitives (up to 288 kb each) optimized for FIFO and buffer applications

Applications

5G Massive MIMO Baseband Unit	Phased Array Radar Processing
Use Scenario: Real-time beamforming, channel estimation, and precoding across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary signal processing engine implementing FFT, matrix inversion, and custom DSP kernels in programmable logic. Use Value: 32 GTY transceivers enable direct connection to multiple RFICs; hardened 100G MAC offloads fronthaul traffic from CPU.	Use Scenario: Pulse-Doppler processing, STAP, and synthetic aperture generation in airborne and ground-based radar platforms. IC Role / Device Role / Timing Role: High-throughput data path orchestrator with deterministic latency for ADC/DAC streaming and pulse compression. Use Value: 3.5M logic cells support concurrent multi-target tracking algorithms; UltraRAM buffers full PRI waveforms without external DRAM.
High-Speed Data Acquisition System	AI Acceleration Edge Inference Node
Use Scenario: Digitizing and preprocessing wideband sensor data (e.g., LIDAR, spectrum analyzers) at >10 GS/s aggregate rate. IC Role / Device Role / Timing Role: Time-aligned multi-channel capture engine with real-time decimation, filtering, and packetization. Use Value: 832 I/O pins support parallel ADC interfaces; GTY transceivers stream processed data over 100G Ethernet to host servers.	Use Scenario: Low-latency inference for vision and signal classification using quantized CNN/RNN models at edge nodes. IC Role / Device Role / Timing Role: Programmable AI accelerator with custom systolic array mapped to LUTs and DSP slices. Use Value: Dual Cortex-A53 cores manage model loading and I/O while PL fabric executes inference kernels with <100 ns decision latency.

5G Massive MIMO Baseband Unit

Phased Array Radar Processing

Use Scenario: Real-time beamforming, channel estimation, and precoding across 64+ antenna elements in sub-6 GHz and mmWave bands.

IC Role / Device Role / Timing Role: Primary signal processing engine implementing FFT, matrix inversion, and custom DSP kernels in programmable logic.

Use Value: 32 GTY transceivers enable direct connection to multiple RFICs; hardened 100G MAC offloads fronthaul traffic from CPU.

Use Scenario: Pulse-Doppler processing, STAP, and synthetic aperture generation in airborne and ground-based radar platforms.

IC Role / Device Role / Timing Role: High-throughput data path orchestrator with deterministic latency for ADC/DAC streaming and pulse compression.

Use Value: 3.5M logic cells support concurrent multi-target tracking algorithms; UltraRAM buffers full PRI waveforms without external DRAM.

High-Speed Data Acquisition System

AI Acceleration Edge Inference Node

Use Scenario: Digitizing and preprocessing wideband sensor data (e.g., LIDAR, spectrum analyzers) at >10 GS/s aggregate rate.

IC Role / Device Role / Timing Role: Time-aligned multi-channel capture engine with real-time decimation, filtering, and packetization.

Use Value: 832 I/O pins support parallel ADC interfaces; GTY transceivers stream processed data over 100G Ethernet to host servers.

Use Scenario: Low-latency inference for vision and signal classification using quantized CNN/RNN models at edge nodes.

IC Role / Device Role / Timing Role: Programmable AI accelerator with custom systolic array mapped to LUTs and DSP slices.

Use Value: Dual Cortex-A53 cores manage model loading and I/O while PL fabric executes inference kernels with <100 ns decision latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU9P-2FLGA2104I	Higher logic density (5.4M cells), 64 GTY transceivers, larger 2104-pin FLGA package, 70 W TDP	Supports more complex 5G DU+CU integration and multi-radar fusion; requires enhanced thermal solution	Select when additional logic capacity or transceiver count is required beyond XCVU3P-3FFVC1517E capabilities
XCKU15P-2FFVA1156E	Kintex UltraScale+ family; 1.3M logic cells, 20 GTY transceivers, 1156-pin FFVA package, 35 W TDP	Targeted at cost-sensitive 5G small cells and mid-tier radar; lacks hardened 100G MAC and dual A53 processors	Choose for lower-power, lower-cost deployments where full XCVU3P feature set is not required

Compared with XCVU3P-3FFVC1517E, XCVU9P-2FLGA2104I delivers higher scalability for future-proofing, while XCKU15P-2FFVA1156E offers reduced BOM cost and thermal footprint at the expense of integrated networking and processing features.

Availability

XCVU3P-3FFVC1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply and long-term program support.

Supply support for XCVU3P-3FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.

The Virtex UltraScale+ family targets mission-critical infrastructure applications demanding high bandwidth, deterministic latency, and hardware security-especially in wireless communications and defense electronics.

FAQ

What is the operating temperature range for the XCVU3P-3FFVC1517E?

The XCVU3P-3FFVC1517E is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification applies to the "E" speed grade and FFVC1517 package, enabling deployment in outdoor 5G base stations and avionics environments where ambient extremes are expected. Thermal design must maintain junction temperature within this limit under full load.

Does the XCVU3P-3FFVC1517E support PCIe Gen4 x16?

Yes, the XCVU3P-3FFVC1517E supports PCIe Gen4 x16 via its GTY transceivers configured in protocol mode. Each GTY lane achieves up to 16 GT/s, meeting PCIe Gen4 electrical requirements. Implementation requires proper board layout, reference clock routing, and use of Vivado 2022.2 or later for IP core integration and timing closure.

Can the XCVU3P-3FFVC1517E be configured via JTAG only?

No-the XCVU3P-3FFVC1517E supports multiple configuration modes including JTAG, quad-SPI flash, and BPI parallel NOR flash. JTAG is used primarily for debugging and initial programming; production systems typically rely on quad-SPI for faster, autonomous boot. Configuration mode is selected via mode pins M[2:0] at power-up.

What is the maximum supported memory interface speed for DDR4 on the XCVU3P-3FFVC1517E?

The XCVU3P-3FFVC1517E supports DDR4 interfaces up to 2400 MT/s using its MIG (Memory Interface Generator) IP core. This speed is achievable with appropriate PCB stackup, fly-by topology, and termination. The device provides dedicated DQS and DM routing resources per byte lane to meet DDR4 timing margins at full rate.

Is partial reconfiguration supported on the XCVU3P-3FFVC1517E?

Yes, partial reconfiguration is fully supported on the XCVU3P-3FFVC1517E. It enables dynamic replacement of logic modules without resetting the entire device. This capability is implemented through hierarchical design flow in Vivado and requires specific floorplanning, checkpointing, and bitstream generation steps verified in UG909.

XCVU3P-3FFVC1517E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 1517-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 49260

Number of Logic Elements/Cells:: 862050

Total RAM Bits:: 118067200

Number of I/O:: 520

Number of Gates:: -

Voltage - Supply:: 0.873V ~ 0.927V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 1517-FCBGA (40x40)

XCVU3P-3FFVC1517E FAQ

1.How can I place an order for XCVU3P-3FFVC1517E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU3P-3FFVC1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU3P-3FFVC1517E reliable?

The price and inventory of XCVU3P-3FFVC1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU3P-3FFVC1517E is usually 5 days.

3.What payment methods are accepted for XCVU3P-3FFVC1517E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU3P-3FFVC1517E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU3P-3FFVC1517E?

XCVU3P-3FFVC1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU3P-3FFVC1517E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU3P-3FFVC1517E?

For technical support, including XCVU3P-3FFVC1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU3P-3FFVC1517E requirements.

6.How does Aetrix verify that XCVU3P-3FFVC1517E is sourced from the original manufacturer or authorized distributors?

All XCVU3P-3FFVC1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU3P-3FFVC1517E meets industry standards.

7.What is the process for return or replacement of XCVU3P-3FFVC1517E?

All XCVU3P-3FFVC1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU3P-3FFVC1517E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU3P-3FFVC1517E part is unused and in its original packaging.

Return procedure for XCVU3P-3FFVC1517E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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