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AMD XCVU3P-L2FFVC1517E
- Part No.:
- XCVU3P-L2FFVC1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCVU3P-L2FFVC1517E.pdf
- Description:
- IC FPGA 520 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,750
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Product details
Overview
XCVU3P-L2FFVC1517E from AMD is a Virtex UltraScale+ FPGA featuring 842K logic cells, 39.1 Mb of block RAM, and 3,960 DSP slices, operating at -2L speed grade with 1517-pin FC-BGA packaging; used in high-throughput data acceleration and low-latency networking systems.
For engineers reviewing the XCVU3P-L2FFVC1517E datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.8 V / 1.35 V / 1.2 V), transceiver line rates up to 32.75 Gb/s, and PCIe Gen4 x16 root complex capability.
Technical Context
The XCVU3P-L2FFVC1517E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks including 24 GTY transceivers, dual ARM Cortex-A53 MPCore processor subsystem, and DDR4 memory controllers. It supports AXI4-Stream and AXI4-Lite interfaces for high-bandwidth data movement and system control.
Configuration occurs via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device targets applications requiring deterministic latency, such as 5G baseband processing and real-time radar signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 842,000 - usable LUT-based fabric resources for custom digital logic implementation |
| Block RAM | 39.1 Mb - on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| DSP Slices | 3,960 - fixed-point and floating-point arithmetic units optimized for filtering and FFTs |
| GTY Transceivers | 24 × 32.75 Gb/s - serial I/O supporting 100G Ethernet, CPRI, and PCIe Gen4 |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and differential signaling up to 1.6 Gb/s per pin |
| Speed Grade | -2L - guaranteed timing performance at highest junction temperature (100°C) |
| Package | FC-BGA 1517 - 35 mm × 35 mm footprint with 1.0 mm ball pitch and thermal lid |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FC-BGA) with 1517 I/O balls, thermal lid, and 35 mm × 35 mm body size. Pinout conforms to AMD UG570 v1.15.1 (Virtex UltraScale+ Packaging and Pinout).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLB logic |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, SelectIO, and clock management |
| VCCO | I/O bank power | Configurable per-bank (1.2 V / 1.35 V / 1.8 V) for interface voltage matching |
| MGTAVCC | Transceiver analog supply | 1.0 V supply for GTY transceiver analog circuitry |
| CLK_IN | Dedicated clock input | Single-ended or differential reference clock input to MMCM/PLL |
| PROGRAM_B | Configuration control | Active-low asynchronous reset initiating full reconfiguration from flash |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Complex | Reduces host CPU overhead and enables direct DMA access to FPGA memory maps |
| Integrated ARM Cortex-A53 Subsystem | Enables embedded software control, real-time OS execution, and co-processing alongside PL logic |
| UltraScale+ Memory Controller | Supports DDR4-2400 with ECC, enabling reliable high-bandwidth memory interfacing |
| Secure Boot with AES-HMAC | Prevents unauthorized bitstream loading and ensures runtime integrity verification |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without disrupting active system operation |
Applications
| 5G Massive MIMO Baseband Processing | High-Frequency Trading Acceleration |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz 5G NR infrastructure. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and matrix inversion; GTY transceivers handle CPRI/eCPRI fronthaul links. Use Value: Achieves <100 ns deterministic latency for closed-loop RF calibration and supports 2×200 MHz carrier aggregation. | Use Scenario: Low-latency order matching engine deployed in exchange co-location facilities with nanosecond timestamping. IC Role / Device Role / Timing Role: Configurable logic implements ultra-fast decision trees and market data parsing; PCIe Gen4 x16 connects directly to host server memory. Use Value: Delivers sub-300 ns round-trip latency from network packet ingress to trade execution signal egress. |
| AI Inference at the Edge | Radar Signal Processing for ADAS |
Use Scenario: On-vehicle deployment of quantized CNN models for object detection using camera and LiDAR fusion inputs. IC Role / Device Role / Timing Role: DSP slices perform INT8 convolution operations; DDR4 controller manages multi-sensor frame buffering. Use Value: Sustains 12 TOPS INT8 throughput while maintaining thermal envelope under 45 W TDP. | Use Scenario: FMCW radar front-end processing for 77 GHz automotive radar modules with 4D imaging capability. IC Role / Device Role / Timing Role: FPGA fabric runs range-Doppler FFTs and CFAR detection; GTY transceivers interface with high-speed ADCs/DACs. Use Value: Enables real-time point-cloud generation at 30 fps with <0.1° azimuth resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2104E | Higher logic capacity (2,586K LC), larger package (2104-ball), higher power consumption | Better suited for multi-protocol 400G line cards requiring >100 Gb/s SerDes aggregation | Select when additional transceiver count or logic density exceeds XCVU3P-L2FFVC1517E margins |
| XCVU13P-L2FLGA2577E | 3,384K logic cells, 48 GTY transceivers, 2577-ball FC-BGA, higher thermal envelope | Targeted at AI training accelerators and cloud-scale data center offload where scalability dominates cost-per-watt | Choose when PCIe Gen5 support, HBM2 integration, or dual-die interconnect is required |
Compared with XCVU3P-L2FFVC1517E, the XCVU9P offers scalable logic headroom for protocol stacking, while the XCVU13P adds HBM2 and PCIe Gen5-making both alternatives better suited for infrastructure-class deployments rather than edge-optimized systems.
Availability
XCVU3P-L2FFVC1517E is available at Aetrix Electronics and suitable for 5G infrastructure, financial data acceleration, and automotive radar systems requiring stable component supply across extended product lifecycles.
Supply support for XCVU3P-L2FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family delivers high-performance, power-optimized programmable logic targeting 5G, AI inference, and real-time signal processing applications.
FAQ
What is the maximum supported transceiver line rate for the XCVU3P-L2FFVC1517E?
The XCVU3P-L2FFVC1517E supports GTY transceivers rated up to 32.75 Gb/s per lane. This enables compliance with 100G Ethernet (4×25G), 400G Ethernet (8×50G PAM4), and PCIe Gen4 x16 protocols. The actual achievable rate depends on PCB stackup, reference clock stability, and equalization settings configured in Vivado.
Does the XCVU3P-L2FFVC1517E include an integrated processor subsystem?
Yes, the XCVU3P-L2FFVC1517E integrates a dual-core ARM Cortex-A53 MPCore processor subsystem running at up to 1.5 GHz. This hard processor system supports Linux and real-time OS execution, and communicates with programmable logic via AXI interfaces. It is not present in lower-tier UltraScale devices.
What configuration modes does the XCVU3P-L2FFVC1517E support?
The XCVU3P-L2FFVC1517E supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI mode allows fast boot from serial flash; JTAG is used for debugging and programming during development. Configuration security features include AES-256 bitstream encryption and HMAC authentication.
Is partial reconfiguration supported on the XCVU3P-L2FFVC1517E?
Yes, the XCVU3P-L2FFVC1517E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules-such as protocol engines or filter banks-without resetting the entire device or halting active I/O paths. PR requires specific floorplanning and checkpoint-based implementation flows.
What DDR memory standards are supported by the XCVU3P-L2FFVC1517E memory controller?
The XCVU3P-L2FFVC1517E memory controller supports DDR4-2400 with ECC, LPDDR4-4266, and RLDRAM3-2133. It provides two independent 64-bit channels with configurable burst lengths and on-die termination. The controller includes built-in calibration and refresh management compliant with JEDEC specifications.
XCVU3P-L2FFVC1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 49260
- Number of Logic Elements/Cells:
- 862050
- Total RAM Bits:
- 130355200
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCVU3P-L2FFVC1517E FAQ
1.How can I place an order for XCVU3P-L2FFVC1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU3P-L2FFVC1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU3P-L2FFVC1517E reliable?
The price and inventory of XCVU3P-L2FFVC1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU3P-L2FFVC1517E is usually 5 days.
3.What payment methods are accepted for XCVU3P-L2FFVC1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU3P-L2FFVC1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU3P-L2FFVC1517E?
XCVU3P-L2FFVC1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU3P-L2FFVC1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU3P-L2FFVC1517E?
For technical support, including XCVU3P-L2FFVC1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU3P-L2FFVC1517E requirements.
6.How does Aetrix verify that XCVU3P-L2FFVC1517E is sourced from the original manufacturer or authorized distributors?
All XCVU3P-L2FFVC1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU3P-L2FFVC1517E meets industry standards.
7.What is the process for return or replacement of XCVU3P-L2FFVC1517E?
All XCVU3P-L2FFVC1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU3P-L2FFVC1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU3P-L2FFVC1517E part is unused and in its original packaging.
Return procedure for XCVU3P-L2FFVC1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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