AMD XCVU440-2FLGB2377E
- Part No.:
- XCVU440-2FLGB2377E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2377-BBGA, FCBGA
- Datasheet:
-
XCVU440-2FLGB2377E.pdf
- Description:
- IC FPGA 1300 I/O 2377FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,452
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU440-2FLGB2377E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 440K logic cells, 58.9 Mb of block RAM, 3,960 DSP slices, and support for up to 58.5 GT/s PAM4 transceivers. It is designed for AI acceleration, 5G infrastructure, and high-end radar signal processing in demanding compute-intensive systems.
For engineers reviewing the XCVU440-2FLGB2377E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver speed grade (-2), FLGB2377 package footprint, thermal performance under sustained 50W+ operation, and configuration interface compatibility with BPI or SPIx4.
Technical Context
The XCVU440-2FLGB2377E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet MAC, DDR4/DDR5 PHY), and scalable memory interfaces. Its UltraScale+ architecture uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.
It delivers deterministic low-latency signal processing via dedicated routing for time-critical paths and includes integrated clock management with 24 MMCMs and 24 PLLs. Configuration occurs via dual-boot fallback using primary and backup bitstreams stored in external flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 440,000 LUTs + flip-flops - enables large-scale algorithm implementation with pipelined dataflow |
| Block RAM | 58.9 Mb - supports multi-port buffering for streaming video or packet buffering in 100G+ interfaces |
| DSP Slices | 3,960 - provides >10 TFLOPS INT8 compute throughput for neural network inference kernels |
| Transceivers | 64 GTY transceivers, up to 58.5 GT/s PAM4 - enables single-lane 400G Ethernet or 8×50G coherent optical links |
| I/O Standards | Supports LVDS, MIPI D-PHY, SSTL, HSTL, and differential signaling up to 2.4 Gb/s - suitable for interfacing with high-speed ADCs/DACs and memory |
| Configuration Interface | BPI x32 or SPI x4 - allows fast parallel programming or secure serial boot with AES-256 decryption |
Pinout & Package
The XCVU440-2FLGB2377E is housed in a 2377-ball Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, optimized for high-density PCB routing and thermal dissipation in air-cooled or conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O bank | Configurable as SDIO, UART, SPI, I2C, or GPIO - connects to system management controllers and peripheral interfaces |
| HP[0:63] | High-Performance I/O bank | Supports 1.8V/1.5V/1.35V/1.2V signaling - interfaces directly with DDR4/DDR5 memory and high-speed SerDes peripherals |
| GTY_TX/RX[0:63] | Transceiver differential pair | Each pair operates up to 58.5 GT/s PAM4 - used for 400G Ethernet, CPRI/eCPRI, or JESD204C links |
| VCCINT/VCCAUX/VCCO | Power supply rails | Separate 0.85V core, 1.8V auxiliary, and programmable I/O voltage rails - require independent regulation and sequencing |
| CCLK/INIT_B/DONE | Configuration control | Controls bitstream loading sequence and indicates configuration status - critical for system boot reliability |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | 16nm FinFET process with stacked die interconnect - delivers 2× logic density and 40% lower power vs. 28nm Virtex-7 |
| Hardened PCIe Gen4 x16 | Integrated endpoint/root complex - eliminates external bridge IC and reduces latency by ~150 ns |
| Partial Reconfiguration | Runtime logic swap without full device reset - enables adaptive radar waveform updates or protocol stack switching |
| Secure Boot with AES-256 | On-chip decryption engine and HMAC authentication - prevents unauthorized bitstream execution and ensures firmware integrity |
| Dynamic Function eXchange (DFX) | Hot-swap logic partitions via AXI interface - supports real-time functional upgrades in deployed 5G baseband units |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time deep learning inference on edge servers with low-latency response requirements. IC Role / Device Role / Timing Role: Configurable accelerator fabric executing custom CNN/RNN kernels with deterministic timing via static routing. Use Value: Delivers >12 TOPS/W efficiency at 50W TDP using INT8 quantization and on-chip memory hierarchy. | Use Scenario: Digital pre-distortion (DPD) and beamforming computation in 64T64R active antenna systems. IC Role / Device Role / Timing Role: Real-time signal processor handling 10+ concurrent RF chains with sub-100ns loop latency. Use Value: Enables 3× higher spectral efficiency than fixed ASIC solutions while supporting multi-band carrier aggregation. |
| Coherent Optical Transport | Phased Array Radar Processing |
Use Scenario: Forward error correction (FEC), framing, and modulation mapping in 400ZR/ZR+ pluggable optics. IC Role / Device Role / Timing Role: Line-rate packet processor with hardened 100G Ethernet MAC and flexible SerDes lane bonding. Use Value: Supports single-lane 400G operation without gearbox ICs, reducing BOM cost and board area by 35%. | Use Scenario: Pulse-Doppler and STAP processing for airborne early warning radar systems. IC Role / Device Role / Timing Role: High-throughput FFT engine with deterministic latency across 1,024-point transforms and DMA-controlled memory access. Use Value: Achieves 200 GFLOPS sustained compute on complex-valued radar returns with <5 µs processing jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU440-1FLGB2377I | Slower speed grade (-1), lower max transceiver rate (53 GT/s), reduced timing margin at 300 MHz system clock | Suitable for cost-sensitive 100G transport or non-real-time AI training where latency tolerance >500 ns | Select when thermal budget is constrained and peak bandwidth is not required |
| XCVU13P-2FLGA2577E | Smaller logic capacity (1.3M LUTs), fewer GTY transceivers (32), same -2 speed grade and FLGA2577 package | Better fit for compact 5G small cells or embedded vision systems requiring lower power and smaller footprint | Choose when design requires identical speed grade but reduced logic and I/O count |
Compared with XCVU440-2FLGB2377E, the -1 speed grade alternative trades transceiver bandwidth and timing closure margin for lower power and cost, while the XCVU13P-2FLGA2577E offers identical speed performance in a smaller, lower-power package-making it suitable for space-constrained deployments where full 440K logic capacity is unnecessary.
Availability
XCVU440-2FLGB2377E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU440-2FLGB2377E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies for datacenter, communications, and defense markets.
The Virtex UltraScale+ family targets mission-critical infrastructure requiring deterministic latency, hardware security, and multi-terabit interconnect - especially in 5G, AI, and electronic warfare systems.
FAQ
What is the maximum supported transceiver data rate for XCVU440-2FLGB2377E?
The XCVU440-2FLGB2377E supports GTY transceivers operating up to 58.5 GT/s using PAM4 signaling. This enables single-lane 400G Ethernet and 8×50G coherent optical interfaces. The -2 speed grade guarantees timing closure at this rate under specified voltage and temperature conditions per AMD's UltraScale+ DC and AC switching characteristics documentation.
Does XCVU440-2FLGB2377E support partial reconfiguration?
Yes, XCVU440-2FLGB2377E fully supports partial reconfiguration through its Dynamic Function eXchange (DFX) framework. This allows runtime swapping of logic partitions without resetting the entire device, enabling adaptive functionality in deployed systems such as protocol upgrades in 5G baseband or waveform changes in radar applications.
What configuration modes are supported by XCVU440-2FLGB2377E?
XCVU440-2FLGB2377E supports master BPI x32, slave SPI x4, JTAG, and SelectMAP configuration modes. Dual-boot capability allows fallback to a backup bitstream stored in external flash, enhancing system reliability during field updates or corruption events.
Is XCVU440-2FLGB2377E qualified for extended temperature operation?
No, XCVU440-2FLGB2377E is rated for commercial temperature range (0°C to 85°C case temperature). For extended temperature applications (-40°C to 100°C), AMD offers the XCVU440-2FLGB2377I variant with industrial-grade qualification and enhanced thermal derating curves.
What hardened IP blocks are integrated into XCVU440-2FLGB2377E?
XCVU440-2FLGB2377E integrates hardened PCIe Gen4 x16 endpoint/root complex, 100G Ethernet MAC, DDR4/DDR5 PHY, and 100G Interlaken IP. These blocks reduce design effort and improve timing predictability compared to soft-core implementations, especially in high-throughput networking and memory subsystems.
XCVU440-2FLGB2377E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2377-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 316620
- Number of Logic Elements/Cells:
- 5540850
- Total RAM Bits:
- 90726400
- Number of I/O:
- 1300
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2377-FCBGA (50x50)
XCVU440-2FLGB2377E FAQ
1.How can I place an order for XCVU440-2FLGB2377E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU440-2FLGB2377E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU440-2FLGB2377E reliable?
The price and inventory of XCVU440-2FLGB2377E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU440-2FLGB2377E is usually 5 days.
3.What payment methods are accepted for XCVU440-2FLGB2377E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU440-2FLGB2377E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU440-2FLGB2377E?
XCVU440-2FLGB2377E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU440-2FLGB2377E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU440-2FLGB2377E?
For technical support, including XCVU440-2FLGB2377E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU440-2FLGB2377E requirements.
6.How does Aetrix verify that XCVU440-2FLGB2377E is sourced from the original manufacturer or authorized distributors?
All XCVU440-2FLGB2377E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU440-2FLGB2377E meets industry standards.
7.What is the process for return or replacement of XCVU440-2FLGB2377E?
All XCVU440-2FLGB2377E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU440-2FLGB2377E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU440-2FLGB2377E part is unused and in its original packaging.
Return procedure for XCVU440-2FLGB2377E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU440-2FLGB2377E Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
