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AMD XCVU440-2FLGB2377I
- Part No.:
- XCVU440-2FLGB2377I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2377-BBGA, FCBGA
- Datasheet:
-
XCVU440-2FLGB2377I.pdf
- Description:
- IC FPGA 1300 I/O 2377FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,134
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Product details
Overview
XCVU440-2FLGB2377I from AMD is a high-capacity Virtex UltraScale+ FPGA featuring 440K logic cells, 58.9 Mb of block RAM, and 4,520 DSP slices; supports PCIe Gen4 x16, 28.3 Gb/s transceivers, and DDR4 memory interfaces; deployed in high-throughput data center acceleration and radar signal processing systems.
For engineers reviewing the XCVU440-2FLGB2377I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal design power envelope, and package-compatible migration paths within the Virtex UltraScale+ family.
Technical Context
The XCVU440-2FLGB2377I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers supporting protocols from 600 Mb/s to 28.3 Gb/s. It integrates dual ARM Cortex-A53 processors for real-time control and system management.
Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported. The device operates across industrial temperature range (–40°C to +100°C) and uses 0.85 V core voltage with multiple I/O standards including LVDS, SSTL, HSTL, and MIPI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 440,000 - determines maximum combinational/sequential logic capacity for custom datapaths and control units |
| Block RAM | 58.9 Mb - enables large on-chip buffering for streaming data, frame storage, or FIFOs without external memory |
| DSP Slices | 4,520 - supports parallel multiply-accumulate operations at up to 10.4 TMAC/s for AI inference or beamforming |
| Transceiver Speed | 28.3 Gb/s - enables direct attachment to 100G/400G optical modules and high-speed serial interconnects |
| I/O Pins | 1,092 - provides high-density interface routing for memory, sensors, and high-speed peripherals |
| Speed Grade | -2 - guarantees timing closure at highest performance level for critical paths in compute-intensive designs |
| Package | FLGB2377 - 2377-ball flip-chip BGA with 0.8 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
FLGB2377 is a 2377-ball flip-chip ball grid array package with 0.8 mm pitch, thermal lid, and controlled impedance routing support. Designed for high-power FPGA applications requiring efficient heat extraction and low-inductance power delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | Supplies 0.85 V to programmable logic and CLB resources; requires tight regulation and low-noise filtering |
| VCCAUX | Auxiliary Power Supply | Provides 1.8 V to configuration circuitry, transceivers, and clock management tiles |
| MGTAVCC | Transceiver Analog Supply | Delivers clean 0.92 V to high-speed transceiver analog front-end for jitter-sensitive operation |
| CONFIG_IO | Configuration Interface | Supports dual-role pins for JTAG boundary scan or quad-SPI master boot configuration |
| HR_IO | High-Range I/O Bank | Enables 1.8 V/2.5 V/3.3 V single-ended and differential signaling with programmable slew rate and drive strength |
| HP_IO | High-Performance I/O Bank | Supports 1.2 V/1.35 V/1.5 V interfaces including DDR4, LPDDR4, and MIPI D-PHY |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead or timing risk |
| 100G Ethernet MAC + RS-FEC | Enables line-rate packet processing for network offload and smart NIC applications without external PHY |
| UltraScale+ Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with built-in calibration, error correction, and refresh management |
| Secure Boot with AES-256 & HMAC | Prevents unauthorized bitstream loading and ensures firmware authenticity in mission-critical deployments |
| ARM Cortex-A53 Dual-Core Subsystem | Provides embedded Linux-capable processing for real-time system control, monitoring, and partial reconfiguration coordination |
Applications
| 5G Massive MIMO Baseband Processing | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Primary baseband processor implementing FFT, matrix inversion, and digital up/down conversion pipelines. Use Value: 4,520 DSP slices and 28.3 Gb/s transceivers enable full-bandwidth processing with deterministic latency under 5 µs. | Use Scenario: Offloading TCP/IP stack, RDMA, and TLS encryption from host CPU in cloud servers. IC Role / Device Role / Timing Role: Programmable accelerator tightly coupled to 100G Ethernet MAC and DDR4 memory controller. Use Value: Hardened PCIe Gen4 x16 and 100G MAC eliminate external bridge chips and reduce end-to-end latency by 40%. |
| Phased Array Radar Signal Processing | AI Inference at Edge with Custom Datapaths |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture imaging in airborne radar systems. IC Role / Device Role / Timing Role: Real-time signal processor handling ADC sample ingestion, STAP, and SAR image formation kernels. Use Value: 58.9 Mb block RAM buffers full chirp sequences while 440K logic cells implement pipelined FFT engines. | Use Scenario: Low-latency inference for vision-based industrial inspection using quantized CNN models. IC Role / Device Role / Timing Role: Configurable AI accelerator with custom INT8/FP16 datapath mapped to DSP slices and BRAM. Use Value: 10.4 TMAC/s peak throughput and deterministic timing allow sub-millisecond inference response in safety-critical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU440-1FLGB2377I | Slower speed grade (-1 vs -2); lower max transceiver speed (25.8 Gb/s) and reduced timing margin for critical paths | Suitable for cost-sensitive radar subsystems where full 28.3 Gb/s lanes are unused | Select when target frequency and power budget permit relaxed timing closure without sacrificing I/O count or logic density |
| XCVU280-2FLGB2377I | Lower logic capacity (280K cells), less block RAM (32.1 Mb), and fewer DSP slices (3,020); same package and speed grade | Fits smaller-scale 5G fronthaul or mid-tier SmartNIC designs with constrained algorithm complexity | Choose for footprint-compatible upgrade path when scaling down from XCVU440-2FLGB2377I due to reduced computational load |
Compared with XCVU440-2FLGB2377I, the -1 speed grade offers lower power and cost at the expense of transceiver bandwidth and timing headroom, while the XCVU280-2FLGB2377I retains identical packaging and thermal profile but delivers ~36% less logic and DSP resources for streamlined implementations.
Availability
XCVU440-2FLGB2377I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and AI-accelerated server applications requiring stable component supply across extended product lifecycles.
Supply support for XCVU440-2FLGB2377I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through FPGA, adaptive SoC, and software-defined platforms.
The Virtex UltraScale+ family targets high-throughput, low-latency, and security-critical applications such as 5G RAN, defense radar, and cloud infrastructure acceleration.
FAQ
What is the operating temperature range for XCVU440-2FLGB2377I?
The XCVU440-2FLGB2377I is rated for industrial temperature operation from –40°C to +100°C ambient. This range is validated per AMD's qualification testing and applies to the FLGB2377 package under specified airflow and PCB thermal conditions. Thermal derating is required above 85°C junction temperature, and the device includes on-die temperature sensors accessible via JTAG or I2C for real-time monitoring in the XCVU440-2FLGB2377I.
Does XCVU440-2FLGB2377I support DDR4 memory interfaces?
Yes, the XCVU440-2FLGB2377I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to 32-bit wide interfaces. It includes automatic calibration, on-die termination control, and ECC support. These capabilities are implemented in dedicated memory interface blocks within the XCVU440-2FLGB2377I and require no soft logic implementation.
How many transceiver quads does XCVU440-2FLGB2377I contain?
The XCVU440-2FLGB2377I contains 64 GTY transceiver quads, totaling 256 transceiver lanes. Each GTY quad supports protocols from 600 Mb/s to 28.3 Gb/s, with independent reference clocking and PMA/PMD configuration. This transceiver count is fixed for the XCVU440-2FLGB2377I and documented in AMD UG578 v1.15.
Is XCVU440-2FLGB2377I pin-compatible with other Virtex UltraScale+ devices?
The XCVU440-2FLGB2377I uses the FLGB2377 package, which is shared with select Virtex UltraScale+ devices including XCVU280-2FLGB2377I and XCVU37P-2FLGB2377I. However, pin functions are not fully interchangeable due to differences in I/O bank allocation, transceiver placement, and power rail distribution. Migration between these devices requires board-level redesign and constraint file updates for the XCVU440-2FLGB2377I.
What configuration modes are supported by XCVU440-2FLGB2377I?
The XCVU440-2FLGB2377I supports multiple configuration modes: JTAG for debugging and programming, master SPI (quad or standard) for single-image boot, and BPI for parallel NOR flash loading. Configuration security features-including AES-256 bitstream encryption and HMAC authentication-are active in all modes and enforced by the XCVU440-2FLGB2377I hardware root-of-trust engine.
XCVU440-2FLGB2377I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2377-BBGA, FCBGA
- Packaging:
- Box
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 316620
- Number of Logic Elements/Cells:
- 5540850
- Total RAM Bits:
- 90726400
- Number of I/O:
- 1300
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2377-FCBGA (50x50)
XCVU440-2FLGB2377I FAQ
1.How can I place an order for XCVU440-2FLGB2377I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU440-2FLGB2377I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU440-2FLGB2377I reliable?
The price and inventory of XCVU440-2FLGB2377I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU440-2FLGB2377I is usually 5 days.
3.What payment methods are accepted for XCVU440-2FLGB2377I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU440-2FLGB2377I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU440-2FLGB2377I?
XCVU440-2FLGB2377I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU440-2FLGB2377I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU440-2FLGB2377I?
For technical support, including XCVU440-2FLGB2377I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU440-2FLGB2377I requirements.
6.How does Aetrix verify that XCVU440-2FLGB2377I is sourced from the original manufacturer or authorized distributors?
All XCVU440-2FLGB2377I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU440-2FLGB2377I meets industry standards.
7.What is the process for return or replacement of XCVU440-2FLGB2377I?
All XCVU440-2FLGB2377I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU440-2FLGB2377I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU440-2FLGB2377I part is unused and in its original packaging.
Return procedure for XCVU440-2FLGB2377I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU440-2FLGB2377I Tags
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