AMD XCVU45P-1FSVH2104E

Overview

XCVU45P-1FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 1,728 DSP slices, and 59.8 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, high-speed data acquisition, and 5G baseband processing.

For engineers reviewing the XCVU45P-1FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage support (1.2 V to 1.8 V), thermal performance in FSVH2104 package, and configuration interface compatibility (e.g., dual BPI, QSPI, JTAG).

Technical Context

The XCVU45P-1FSVH2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ interconnect, and integrated hard IP including PCIe Gen4, 100G Ethernet MAC, and DDR4 memory controllers. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.

Its -1 speed grade guarantees timing closure at 25.8 Gb/s for GTY transceivers and 1.2 GHz for memory interfaces. The device uses 16 nm FinFET process technology and operates across industrial temperature range (–40°C to +100°C junction).

Key Specifications

Pinout & Package

The XCVU45P-1FSVH2104E is housed in a 2104-pin Flip-Chip Staggered Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal design requires exposed thermal lid and multi-layer PCB with dedicated power/ground planes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU45P-1FSVH2104E, the -2 variant delivers higher transceiver bandwidth at increased power and cost, while the XCVU29P-1 offers identical packaging and thermal profile but reduced logic and I/O scalability-enabling tiered system design without board redesign.

Availability

XCVU45P-1FSVH2104E is available at Aetrix Electronics and suitable for AI acceleration platforms, 5G infrastructure equipment, and high-speed test instrumentation requiring stable component supply and long-term lifecycle assurance.

Supply support for XCVU45P-1FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt and architectural innovation.

The Virtex UltraScale+ family targets high-throughput, low-latency applications including AI inference, wireless infrastructure, and defense-grade signal processing-designed to replace ASICs with field-upgradable flexibility.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU45P-1FSVH2104E?

The XCVU45P-1FSVH2104E supports GTY transceivers up to 25.8 Gb/s per lane in its -1 speed grade. This rate is validated across the industrial temperature range and enables protocols such as 100G Ethernet (4×25G), CPRI, and proprietary high-speed serial links. The XCVU45P-1FSVH2104E does not support 30.5 Gb/s operation-that requires the -2 speed grade variant.

Does the XCVU45P-1FSVH2104E include a built-in PCIe Gen4 controller?

Yes, the XCVU45P-1FSVH2104E integrates a hardened PCIe Gen4 x16 root port controller compliant with PCI Express Base Specification Revision 4.0. It handles link training, transaction layer packet processing, and error reporting in hardware, reducing logic utilization and ensuring protocol conformance without RTL implementation. The XCVU45P-1FSVH2104E supports both endpoint and root complex configurations.

What I/O standards are supported by the XCVU45P-1FSVH2104E?

The XCVU45P-1FSVH2104E supports LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling standards across 32 I/O banks. Each bank operates independently with selectable VCCO (1.2 V to 1.8 V) and dedicated VREF. The XCVU45P-1FSVH2104E does not support 3.3 V single-ended standards or RSDS.

Can the XCVU45P-1FSVH2104E perform partial reconfiguration?

Yes, the XCVU45P-1FSVH2104E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logic modules without resetting the entire device. This capability is used in multi-mode radio systems and adaptive AI accelerators. The XCVU45P-1FSVH2104E provides dedicated configuration ports and frame-based update mechanisms verified per UG908.

What is the operating temperature range for the XCVU45P-1FSVH2104E?

The XCVU45P-1FSVH2104E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. Thermal management must account for 45–65 W typical power dissipation depending on configuration and activity. The XCVU45P-1FSVH2104E package includes a thermal lid compatible with standard heatsink mounting per AMD DS925.