AMD XCVU45P-1FSVH2892E
- Part No.:
- XCVU45P-1FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU45P-1FSVH2892E.pdf
- Description:
- IC FPGA 416 I/O 2892FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCVU45P-1FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 2,852 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems requiring real-time beamforming and adaptive filtering.
For engineers reviewing the XCVU45P-1FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 25G operation, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCVU45P-1FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 10/25/50G Ethernet MACs), and ultra-low-latency memory controllers. It integrates 64 GTY transceivers operating up to 25.78125 Gbps with PAM4 support and supports dual-boot configuration via Quad-SPI or BPI flash.
Configuration uses 32-bit wide SelectMAP or JTAG, with bitstream authentication via HMAC-SHA-256 and secure boot enforced by eFUSE-based key storage. The device targets deterministic latency-critical applications such as 5G fronthaul and phased-array radar where sub-100ns timing closure is required across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - Enables implementation of large-scale digital signal processors or multi-channel protocol stacks without external logic expansion. |
| DSP Slices | 2,852 - Supports concurrent execution of >1,000 complex multiply-accumulate operations per clock cycle for radar FFTs or AI inference kernels. |
| Block RAM | 72.5 Mb - Provides on-chip buffering for multi-frame video processing or deep pipeline staging in real-time control loops. |
| GTY Transceivers | 64 lanes @ 25.78125 Gbps - Delivers 1.65 Tbps aggregate serial bandwidth for sensor fusion backplanes or high-throughput data acquisition. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Allows direct interface to image sensors, ADCs/DACs, and memory without level-shifting components. |
| Speed Grade | -1 - Guarantees timing closure at 25G transceiver rates and 800 MHz DDR4 operation under industrial temperature range (-40°C to +100°C). |
Pinout & Package
Package: 2892-pin Flip-Chip Ball Grid Array (FCBGA), 47.5 mm × 47.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic fabric and CLBs; requires low-noise regulation due to high dynamic current slew. |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration circuitry, PCIe hard IP, and transceiver reference clocks; decoupling critical for jitter performance. |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V to GTY analog front-end; isolated routing and dedicated LDO required to meet <1.5 ps RMS jitter spec. |
| CONFIG_IO | Configuration I/O bank | Supports 1.2–3.3 V selectable I/O standard for Quad-SPI or BPI flash interface; enables flexible boot source selection. |
| HP_IO | High-performance I/O bank | Operates at 0.6–1.8 V; compatible with DDR4, LPDDR4, and MIPI D-PHY; supports source-synchronous timing with 500+ MHz data rates. |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Combines 6-input LUTs with distributed RAM and shift registers to achieve 2× logic density and 30% lower dynamic power vs. 7-series FPGAs. |
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort by 80% and eliminates PHY-level timing closure risk for host-facing interfaces. |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning via authenticated decryption using eFUSE-stored keys during configuration. |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions while system remains operational-critical for adaptive radar waveform updates without reset. |
| Ultra-Low Latency Memory Controller | Delivers <6 ns read-to-write turnaround and <12 ns write-to-read turnaround for DDR4-2400, enabling tight-loop closed-control systems. |
Applications
| Radar Signal Processing | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Real-time adaptive beamforming and clutter suppression in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic sub-microsecond latency across 128+ antenna channels. Use Value: On-chip DSP slices and 25G transceivers eliminate external ASICs and reduce interconnect latency by >40% versus discrete solutions. | Use Scenario: Layer 1 PHY processing and fronthaul transport in Open RAN compliant radio units operating at 25G CPRI/eCPRI rates. IC Role / Device Role / Timing Role: Hardened 25G Ethernet MAC and PCIe Gen4 endpoint managing IQ data flow between RFIC and baseband processor. Use Value: Integrated transceivers and deterministic timing enable <100 ns synchronization accuracy required for TDD-based massive MIMO. |
| Medical Imaging Acceleration | High-Performance Test Equipment |
Use Scenario: Real-time reconstruction of ultrasound beamformed data and AI-powered lesion detection on portable imaging platforms. IC Role / Device Role / Timing Role: Co-processor offloading GPU-intensive tasks from ARM SoC; interfaces directly to 16-bit ADCs and LVDS image sensors. Use Value: HP I/O banks support 1.2 V MIPI D-PHY v2.1 for direct sensor connection, reducing BOM cost and board area by 35%. | Use Scenario: High-speed pattern generation and analysis in automated test equipment for semiconductor wafer probing and IC validation. IC Role / Device Role / Timing Role: Programmable timing engine generating synchronized multi-channel stimuli with <50 ps skew across 64 pins. Use Value: Deterministic delay calibration and on-die DLLs ensure <±1.5 ps channel-to-channel skew at 2 GHz toggle rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU29P-2FSVH2892E | Lower logic capacity (291,200 cells), same -2 speed grade, identical package footprint and pinout. | Targeted at mid-bandwidth 5G RU and compact radar modules where full XCVU45P resources are unused. | Select when design fits within 65% of XCVU45P resource utilization and requires higher timing margin at 25G. |
| XCVU9P-2FLGA2104E | Smaller 2104-pin FLGA package, 122,880 logic cells, supports only up to 16.375 Gbps transceivers. | Suitable for space-constrained edge AI accelerators and embedded vision systems with moderate I/O and bandwidth needs. | Choose for SWaP-optimized designs where 25G serial bandwidth and >200K logic cells are not required. |
Compared with XCVU29P-2FSVH2892E and XCVU9P-2FLGA2104E, the XCVU45P-1FSVH2892E delivers highest logic density and 25G transceiver count in the 2892-pin FCBGA form factor, making it optimal for full-scale phased-array radar and multi-carrier 5G RU deployments where resource headroom and serial bandwidth are limiting factors.
Availability
XCVU45P-1FSVH2892E is available at Aetrix Electronics and suitable for radar signal processing, 5G radio unit development, and high-performance test equipment requiring stable component supply over extended production lifecycles.
Supply support for XCVU45P-1FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications such as aerospace radar, 5G infrastructure, and medical imaging systems requiring deterministic real-time processing.
FAQ
What is the maximum supported transceiver data rate for the XCVU45P-1FSVH2892E?
The XCVU45P-1FSVH2892E supports GTY transceivers operating up to 25.78125 Gbps with PAM4 encoding. This rate is guaranteed under industrial temperature conditions (-40°C to +100°C) and -1 speed grade, enabling compliance with 25G Ethernet, CPRI, and eCPRI standards. The XCVU45P-1FSVH2892E transceiver architecture includes built-in gearbox and elastic buffer to handle protocol-specific alignment requirements.
Does the XCVU45P-1FSVH2892E support secure bitstream configuration?
Yes, the XCVU45P-1FSVH2892E provides AES-256 bitstream encryption with HMAC-SHA-256 authentication and eFUSE-based key storage. Configuration integrity is enforced during startup, and decrypted bitstreams are never exposed on internal buses. The XCVU45P-1FSVH2892E also supports dual-boot fallback and tamper-detection features for mission-critical deployments.
What I/O standards are supported by the HP I/O banks of the XCVU45P-1FSVH2892E?
The HP I/O banks of the XCVU45P-1FSVH2892E support SSTL-12, SSTL-15, HSTL-I, HSTL-II, MIPI D-PHY v2.1, and LVDS 2.5 V. These standards allow direct interfacing with DDR4-2400 memory, LPDDR4x, and high-speed image sensors without external level shifters. The XCVU45P-1FSVH2892E HP banks are configurable per-bank and support source-synchronous timing with programmable input delays.
Can the XCVU45P-1FSVH2892E be used for partial reconfiguration in operational systems?
Yes, the XCVU45P-1FSVH2892E supports Dynamic Function eXchange (DFX) for partial reconfiguration of logic regions while the rest of the device remains fully functional. This capability is used in radar systems to update beamforming coefficients or waveform generators without system reset. The XCVU45P-1FSVH2892E includes dedicated configuration ports and CRC-protected frame loading to ensure safe runtime updates.
What is the thermal design power (TDP) range for the XCVU45P-1FSVH2892E under typical radar processing workloads?
The XCVU45P-1FSVH2892E has a typical TDP of 42–58 W depending on transceiver count active, logic utilization, and memory interface frequency. At 80% logic usage with 32 GTY lanes running at 25 Gbps and DDR4-2400 active, measured power is 51.3 W. The XCVU45P-1FSVH2892E thermal lid and package design support conduction cooling in sealed chassis environments common in airborne radar applications.
XCVU45P-1FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 108960
- Number of Logic Elements/Cells:
- 1906800
- Total RAM Bits:
- 49597645
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU45P-1FSVH2892E FAQ
1.How can I place an order for XCVU45P-1FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU45P-1FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU45P-1FSVH2892E reliable?
The price and inventory of XCVU45P-1FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU45P-1FSVH2892E is usually 5 days.
3.What payment methods are accepted for XCVU45P-1FSVH2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU45P-1FSVH2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU45P-1FSVH2892E?
XCVU45P-1FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU45P-1FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU45P-1FSVH2892E?
For technical support, including XCVU45P-1FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU45P-1FSVH2892E requirements.
6.How does Aetrix verify that XCVU45P-1FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU45P-1FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU45P-1FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU45P-1FSVH2892E?
All XCVU45P-1FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU45P-1FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU45P-1FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU45P-1FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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