AMD XCVU45P-2FSVH2104E

Overview

XCVU45P-2FSVH2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 1,728 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCI Express Gen4 x16, making it suitable for high-bandwidth data center acceleration and 5G infrastructure applications.

For engineers reviewing the XCVU45P-2FSVH2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, memory bandwidth, power delivery requirements, and thermal management in high-clock-frequency deployments.

Technical Context

The XCVU45P-2FSVH2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated RF-ADC/DAC blocks in select variants - though this specific part excludes RF data converters. It supports dynamic partial reconfiguration and includes hardened IP for PCIe Gen4, DDR4 memory controllers (up to 2,400 MT/s), and 100G Ethernet MACs.

Its 16nm FinFET process enables operation at -2 speed grade (tPD = 720 ps), with core voltage VCCINT = 0.85 V ±3% and auxiliary supply VCCAUX = 1.8 V. The device uses multi-voltage I/O banks supporting LVDS, SSTL, HSTL, and MIPI standards across 720 user I/O pins.

Key Specifications

Pinout & Package

Package: 2104-ball Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader (IHS). Dimensions: 49.0 mm × 49.0 mm, RoHS-compliant, moisture sensitivity level (MSL) 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Compared with XCVU29P-2FSVH2104E and XCVU9P-2FLGA2104E, the XCVU45P-2FSVH2104E provides highest logic density and Gen4 PCIe capability in the FSVH2104 package, enabling scalable architectures for AI training clusters and carrier-grade 5G infrastructure where bandwidth and reconfigurability are non-negotiable.

Availability

XCVU45P-2FSVH2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G baseband processing, data center SmartNIC development, and high-frequency trading systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU45P-2FSVH2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-throughput, low-latency infrastructure applications demanding hardened interfaces, massive on-chip memory, and field-upgradable logic - especially in 5G, AI, and cloud networking.

FAQ

What is the maximum supported DDR4 memory interface speed for the XCVU45P-2FSVH2104E?

The XCVU45P-2FSVH2104E supports DDR4 memory interfaces up to 2,400 MT/s using its hardened memory controller IP. This speed is achievable with appropriate PCB layout, termination, and voltage regulation - and is validated in AMD's UG576 documentation for the Virtex UltraScale+ family. The XCVU45P-2FSVH2104E implements dedicated PHY logic and calibration engines to maintain signal integrity at this rate.

Does the XCVU45P-2FSVH2104E include built-in RF data converters?

No, the XCVU45P-2FSVH2104E does not integrate RF analog-to-digital or digital-to-analog converters. While some Virtex UltraScale+ variants (e.g., XCVU13P with RFSoC) include RF-ADC/DAC tiles, the XCVU45P-2FSVH2104E is a pure digital FPGA with hardened transceivers only. Its signal acquisition capability relies on external ADC/DAC interfacing via its high-speed I/O banks or 25.8 Gb/s transceivers.

What thermal solution is recommended for sustained operation of the XCVU45P-2FSVH2104E?

AMD specifies a maximum junction temperature of 100°C for the XCVU45P-2FSVH2104E under continuous operation. A vapor chamber heatsink with ≥120 W thermal dissipation capacity and forced airflow (≥300 LFM) is recommended. The XCVU45P-2FSVH2104E's integrated heat spreader (IHS) requires TIM2-grade thermal interface material and flatness ≤25 µm across the 49 mm × 49 mm footprint to ensure reliable long-term thermal performance.

Can the XCVU45P-2FSVH2104E be configured via JTAG only, or are other methods supported?

The XCVU45P-2FSVH2104E supports multiple configuration modes including JTAG, Quad-SPI flash, BPI flash, and SelectMAP parallel interface. JTAG is used for debugging and initial programming, while Quad-SPI is typical for production boot. Configuration bitstreams can be encrypted using AES-256 keys stored in eFUSE, and the XCVU45P-2FSVH2104E supports secure fallback and authenticated update mechanisms per AMD's security white papers.

Is partial reconfiguration supported on the XCVU45P-2FSVH2104E, and what tools enable it?

Yes, the XCVU45P-2FSVH2104E fully supports dynamic partial reconfiguration (DPR) as defined in AMD Vivado Design Suite v2022.2+. DPR allows runtime replacement of logical partitions without resetting the entire device. The XCVU45P-2FSVH2104E's configuration logic includes dedicated frame-addressable access and CRC-protected bitstream loading - enabling use cases like protocol switching in 5G baseband or adaptive filter updates in radar systems.