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AMD XCVU45P-2FSVH2892E
- Part No.:
- XCVU45P-2FSVH2892E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2892-BBGA, FCBGA
- Datasheet:
-
XCVU45P-2FSVH2892E.pdf
- Description:
- IC FPGA 416 I/O 2892FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,402
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Product details
Overview
XCVU45P-2FSVH2892E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 443,200 logic cells, 1,728 DSP slices, and 58.9 Mb of block RAM. It supports PCIe Gen4 x16, 28.3 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. Used in high-end radar signal processing systems requiring real-time FFT acceleration and low-latency data path control.
For engineers reviewing the XCVU45P-2FSVH2892E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support (1.8 V/1.2 V), and thermal design power (TDP) for air-cooled 3U VPX chassis integration.
Technical Context
The XCVU45P-2FSVH2892E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ARM Cortex-R5F processors for real-time management. Its transceivers support PAM4 and NRZ modulation with built-in PRBS generators and error detectors.
Configuration is performed via quad-SPI or BPI flash, with dual-boot capability and AES-256 bitstream encryption. The device uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and BLVDS across 588 user I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 1,728 - enables concurrent execution of 1,728 multiply-accumulate operations per clock cycle |
| Block RAM | 58.9 Mb - provides on-chip memory for buffering radar pulse streams without external DRAM latency |
| Transceiver Speed | 28.3 Gb/s - supports direct interface to 100G QSFP28 optical modules without gearbox ICs |
| I/O Count | 588 - allows full connectivity to multiple ADC/DAC banks, memory controllers, and PCIe root complexes |
| TDP | 42 W - defines thermal envelope for forced-air cooling in conduction-cooled military enclosures |
| Memory Interface | DDR4-2400 - enables high-throughput streaming of synthetic aperture radar (SAR) frame data |
Pinout & Package
The XCVU45P-2FSVH2892E is housed in a 2892-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal pad on underside requires solder paste stencil opening per AMD UG570.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% required for logic fabric and CLB operation; decoupling must meet AMD UG570 layout rules |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powers configuration circuitry, PCIe hard IP, and transceiver reference clocks |
| MGTAVCC | Transceiver analog supply | 1.0 V ±2% critical for 28.3 Gb/s serial link jitter performance; separate LDO mandatory |
| CONFIG_IO | Configuration I/O bank | Supports 1.8 V or 3.3 V; used for JTAG, SPI flash, and mode pin inputs during boot |
| HR_IO | High-range I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V standards; connects to DDR4 memory and high-speed ADC interfaces |
| HP_IO | High-performance I/O bank | Supports 1.2 V/1.0 V; optimized for transceiver reference clocks and low-skew clock distribution |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated x16 endpoint/root port eliminates need for external switch or bridge IC in radar backplane designs |
| UltraScale+ Architecture | Enables time-multiplexed logic sharing between beamforming and pulse compression functions within same CLB array |
| ARM Cortex-R5F Dual-Core | Provides deterministic real-time control for RF front-end calibration and health monitoring without soft-core overhead |
| 28.3 Gb/s Transceivers | Supports direct connection to 4×25G KR4 lanes for IEEE 802.3bj-compliant backhaul links |
| AES-256 Bitstream Encryption | Meets DoD ICD 503 compliance for secure field reprogramming of electronic warfare payloads |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time adaptive beamforming and pulse-Doppler filtering in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic sub-microsecond latency. Use Value: 443K logic cells and 1,728 DSP slices enable simultaneous processing of 16 independent radar channels at 2 GHz sample rate. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 256-antenna active antenna units (AAUs). IC Role / Device Role / Timing Role: Baseband processor interfacing directly to 12-bit 1.2 GS/s RF sampling ADCs/DACs via JESD204B v1.1. Use Value: 28.3 Gb/s transceivers support eight JESD204B lanes at lane rate 15.5 Gbps, eliminating external serializer/deserializer ICs. |
| High-Performance Computing Acceleration | Avionics Data Concentrator |
Use Scenario: Offloading matrix multiplication and sparse tensor operations from x86 host CPUs in edge AI inference servers. IC Role / Device Role / Timing Role: Co-processor connected via PCIe Gen4 x16 with DMA-accessible 58.9 Mb on-chip RAM as scratchpad buffer. Use Value: DDR4-2400 interface sustains 38.4 GB/s memory bandwidth for weight matrix streaming without DRAM controller bottlenecks. | Use Scenario: ARINC 664 Part 7 (AFDX) end-system aggregation of flight control, navigation, and sensor data streams. IC Role / Device Role / Timing Role: Deterministic switch fabric with hardware timestamping and traffic shaping for 100 Mbps AFDX virtual links. Use Value: Integrated ARM Cortex-R5F cores execute DO-254-certifiable AFDX stack while programmable fabric handles packet classification and CRC offload. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU37P-2FSVH2892E | 372,800 logic cells, 1,440 DSP slices, 49.5 Mb BRAM - 16% fewer resources than XCVU45P-2FSVH2892E | Suitable for single-beam radar or lower-channel-count 5G AAUs; insufficient for 16-channel STAP + beamforming concurrency | Select when system-level resource margin allows 15% reduction in logic and DSP count without compromising real-time latency targets |
| XCVU57P-2FSVH2892E | 562,400 logic cells, 2,208 DSP slices, 74.7 Mb BRAM - 27% more resources and 12% higher TDP (47.3 W) | Required for multi-function EW suites integrating radar, SIGINT, and comms jamming on shared hardware platform | Choose when future-proofing for algorithm upgrades or adding secondary mission modes exceeds XCVU45P-2FSVH2892E headroom |
Compared with XCVU37P-2FSVH2892E and XCVU57P-2FSVH2892E, the XCVU45P-2FSVH2892E delivers optimal balance of DSP throughput, on-chip memory bandwidth, and thermal envelope for fixed-form-factor radar systems where board space and airflow are constrained.
Availability
XCVU45P-2FSVH2892E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, avionics data concentration, and high-performance computing requiring stable component supply across extended product lifecycles.
Supply support for XCVU45P-2FSVH2892E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, embedded, and aerospace applications.
The Virtex UltraScale+ family targets defense, communications, and scientific computing with hardened interfaces, radiation-tolerant variants, and long-lifecycle support - XCVU45P-2FSVH2892E serves as the mid-tier performance node optimized for SWaP-constrained radar and EW platforms.
FAQ
What is the maximum supported DDR4 memory speed for the XCVU45P-2FSVH2892E?
The XCVU45P-2FSVH2892E supports DDR4 memory interfaces up to 2400 MT/s, as specified in AMD UG570 v1.15. This speed enables sustained 38.4 GB/s bandwidth for radar frame buffering and real-time SAR processing. The memory controller is hardened and calibrated per JEDEC DDR4 specifications, and requires matched trace lengths and controlled impedance routing per AMD PCB design guidelines. XCVU45P-2FSVH2892E achieves this performance using dedicated PHY logic and on-die termination.
Does the XCVU45P-2FSVH2892E include integrated PCIe Gen4 hard IP?
Yes, the XCVU45P-2FSVH2892E integrates hardened PCIe Gen4 x16 endpoint and root port IP blocks compliant with PCI Express Base Specification Revision 4.0. These blocks operate at 16 GT/s per lane with automatic equalization and LTSSM state machine handling. XCVU45P-2FSVH2892E does not require external PCIe switches or bridges for direct CPU-FPGA interconnect in radar backplane applications.
What transceiver protocols are natively supported by the XCVU45P-2FSVH2892E?
The XCVU45P-2FSVH2892E transceivers natively support PCIe Gen4, 100G Ethernet (KR4/CR4), JESD204B v1.1, and CPRI v6.1 protocols via AMBA AXI4-Stream interfaces. Each transceiver lane operates from 1.6 to 28.3 Gb/s with built-in 8b/10b and 64b/66b encoders. XCVU45P-2FSVH2892E does not support USB, SATA, or HDMI protocols in hardware.
Is the XCVU45P-2FSVH2892E available in a radiation-tolerant grade?
No, the XCVU45P-2FSVH2892E is a commercial temperature-grade device rated for 0°C to 100°C junction temperature. Radiation-tolerant versions (e.g., XQVU45P) are offered separately under AMD's QML-V qualified product line with different ordering codes, screening, and qualification testing. XCVU45P-2FSVH2892E is not certified for TID, SEE, or ELDRS testing per MIL-STD-883.
What configuration modes does the XCVU45P-2FSVH2892E support?
The XCVU45P-2FSVH2892E supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI flash is the most common method, enabling fast parallel bitstream loading with dual-boot capability. Configuration occurs at power-up via dedicated CONFIG_IO bank pins, and bitstream authentication uses HMAC-SHA256 with AES-256 encryption keys stored in eFUSE. XCVU45P-2FSVH2892E does not support passive serial or microprocessor configuration modes.
XCVU45P-2FSVH2892E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2892-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 108960
- Number of Logic Elements/Cells:
- 1906800
- Total RAM Bits:
- 49597645
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2892-FCBGA (55x55)
XCVU45P-2FSVH2892E FAQ
1.How can I place an order for XCVU45P-2FSVH2892E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU45P-2FSVH2892E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU45P-2FSVH2892E reliable?
The price and inventory of XCVU45P-2FSVH2892E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU45P-2FSVH2892E is usually 5 days.
3.What payment methods are accepted for XCVU45P-2FSVH2892E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU45P-2FSVH2892E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU45P-2FSVH2892E?
XCVU45P-2FSVH2892E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU45P-2FSVH2892E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU45P-2FSVH2892E?
For technical support, including XCVU45P-2FSVH2892E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU45P-2FSVH2892E requirements.
6.How does Aetrix verify that XCVU45P-2FSVH2892E is sourced from the original manufacturer or authorized distributors?
All XCVU45P-2FSVH2892E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU45P-2FSVH2892E meets industry standards.
7.What is the process for return or replacement of XCVU45P-2FSVH2892E?
All XCVU45P-2FSVH2892E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU45P-2FSVH2892E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU45P-2FSVH2892E part is unused and in its original packaging.
Return procedure for XCVU45P-2FSVH2892E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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